Download or read book Microstructural Mechanisms for Early Failures of Integrated Circuit Interconnects and Characterization of A1 Y Alloy Thin Films for Interconnects written by Yongkun Liu and published by . This book was released on 1998 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Effects of Microstructural Control on the Failure Kinetics and the Reliability Improvement of Al and Al alloy Interconnects written by and published by . This book was released on 1996 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: The reliability of microelectronic systems is often limited by electromigration failure in Al-based thin-film conducting lines which interconnect devices to form an integrated circuit. Under an applied electric field Al atoms migrate with the electron flow, causing a counterflow of vacancies that accumulate into voids, eventually leading to an open circuit failure. The work reported here is concerned with clarifying the microstructural mechanism of electromigration failure, and with developing a metallurgical method to improve the electromigration resistance of Al-based interconnects. Pure Al, Al-2Cu, and Al-2Cu-1Si lines with quasi-bamboo microstructures are explored as a function of heat treatment conditions and current density. The {open_quotes}weakest{close_quotes} microstructural unit that causes failure is identified by electron microscopy; with rare exceptions, failure occurs at the upstream end of the longest polygranular segment in a given line. This microstructural characteristic of electromigration failure is even observed in lines whose maximum segment lengths are less than a few microns. The time to failure appears to increase exponentially with decreasing longest polygranular segment length. A simple constitutive equation is reported to describe the failure kinetics as a function of the polygranular segment length that leads to failure. Given correct values of the kinetic constants included in the equation, this microstructure-based constitutive relation will provide a way to assess interconnect reliability. An effective metallurgical method that can eliminate relatively long polygranular segments is post-pattern annealing. This heat treatment particularly narrows the distribution of the longest polygranular segment lengths over a large set of lines. As a consequence, the time-to-failure distribution narrows as well, so that the time to first failure increases more substantially than the median time to failure.
Download or read book Mechanisms of Surface and Microstructure Evolution in Deposited Films and Film Structures written by John Sanchez, Jr and published by Cambridge University Press. This book was released on 2014-06-05 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: A wide variety of materials systems and deposition strategies have been developed to produce epitaxial and polycrystalline thin films. In particular, controlling the morphology and microstructure of metal films at the nanometer and/or micron scale has become crucial for applications such as giant magnetoresistive devices, contacts and diffusion barriers in integrated circuits and photovoltaics, and multilayer X-ray mirrors. This book, first published in 2001, focuses on the interactions between different mechanisms of microstructure evolution and film-growth conditions. Two sections of the volume, including a joint effort with Symposium R, Morphology and Dynamics of Crystal Surfaces in Molecular and Colloid Systems, highlight the fundamental mechanisms of epitaxial growth. Additional topics include: multilayers - stress in thin films; early stages of film growth - mechanical properties; texture in polycrystalline films; grain growth - barrier layers; and silicides and organic thin films - pulsed laser deposition.
Download or read book Microstructural Science for Thin Film Metallizations in Electronic Applications written by John Sanchez and published by Minerals, Metals, & Materials Society. This book was released on 1988 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructural Characterization of the Initial Stages of Growth of Y Ba Cu O Thin Films written by Stephen Kelly Streiffer and published by . This book was released on 1992 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructure Based Experimental and Finite Element Analysis of Failure Mechanism of Lead free BGA Interconnects written by Ramji Dhakal and published by ProQuest. This book was released on 2008 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanism of Electromigration Failure in Al Thin Film Interconnects Containing Sc written by and published by . This book was released on 1995 with total page 8 pages. Available in PDF, EPUB and Kindle. Book excerpt: In order to understand the role of Sc on electromigration (EM) failure, Al interconnects with 0.1 and 0.3 wt.% Sc sere tested as a function of post-pattern annealing time. In response to the evolution of the line structure, the statistics of lifetime evolved. While the addition of Sc greatly reduces the rate of evolution of the failure statistics because the grain growth rate decreases, the MTF variation was found to be very similar to that of pure Al. These observations seem to show that Sc has little influence on the kinetics of Al EM; however, it has some influence on the EM resistance of the line since it is an efficient grain refiner. Unlike Cu in Al, Sc does not seem to migrate, which may explain its lack of influence on the kinetics of Al EM.
Download or read book New Methodologies for Interconnect Reliability Assessments of Integrated Circuits written by Stefan Peter Hau-Riege and published by . This book was released on 2000 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book Interfacial Compatibility in Microelectronics written by Tomi Laurila and published by Springer Science & Business Media. This book was released on 2012-01-10 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Download or read book Tensile Testing of Thin Films written by D. T. Read and published by . This book was released on 1997 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: Five technical papers covering the development of a set of techniques for measuring the tensile properties of thin films are gathered here. Also included are drawings of the mechanical components of the apparatus and listings of two computer programs. Additional necessary parts include a computer, instrumentation, two piezoelectric stacks, and an appropriate platform equipped with a microscope. Piezoelectric stacks are used as actuators. Noncontacting eddy-current displacement sensors measure both the tensile displacement and the force.Closed-loop feedback control allows a variety of test programs. The maximum available displacement is about 50 um, and the maximum available force is about 0.3 N. The resolution of displacement is about 25 nm, and the resolution of force is about 100 uN. Cyclic loading has been demonstrated for cycles as short as 20 s.
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and published by ASM International. This book was released on 2019-11-01 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Download or read book Materials written by Michael F. Ashby and published by Butterworth-Heinemann. This book was released on 2013-10-09 with total page 899 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials, Third Edition, is the essential materials engineering text and resource for students developing skills and understanding of materials properties and selection for engineering applications. This new edition retains its design-led focus and strong emphasis on visual communication while expanding its inclusion of the underlying science of materials to fully meet the needs of instructors teaching an introductory course in materials. A design-led approach motivates and engages students in the study of materials science and engineering through real-life case studies and illustrative applications. Highly visual full color graphics facilitate understanding of materials concepts and properties. For instructors, a solutions manual, lecture slides, online image bank, and materials selection charts for use in class handouts or lecture presentations are available at http://textbooks.elsevier.com. The number of worked examples has been increased by 50% while the number of standard end-of-chapter exercises in the text has been doubled. Coverage of materials and the environment has been updated with a new section on Sustainability and Sustainable Technology. The text meets the curriculum needs of a wide variety of courses in the materials and design field, including introduction to materials science and engineering, engineering materials, materials selection and processing, and materials in design. - Design-led approach motivates and engages students in the study of materials science and engineering through real-life case studies and illustrative applications - Highly visual full color graphics facilitate understanding of materials concepts and properties - Chapters on materials selection and design are integrated with chapters on materials fundamentals, enabling students to see how specific fundamentals can be important to the design process - For instructors, a solutions manual, lecture slides, online image bank and materials selection charts for use in class handouts or lecture presentations are available at http://textbooks.elsevier.com - Links with the Cambridge Engineering Selector (CES EduPack), the powerful materials selection software. See www.grantadesign.com for information NEW TO THIS EDITION: - Text and figures have been revised and updated throughout - The number of worked examples has been increased by 50% - The number of standard end-of-chapter exercises in the text has been doubled - Coverage of materials and the environment has been updated with a new section on Sustainability and Sustainable Technology
Download or read book Fundamentals of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Download or read book Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and published by ASM International. This book was released on 2011 with total page 673 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes bibliographical references and index.
