Download or read book Microforces in Electromigration written by and published by . This book was released on 1993 with total page 53 pages. Available in PDF, EPUB and Kindle. Book excerpt: Theoretical description of electromigration (EM) in metallic microstructures. How EM in a small metallic system is affected by surfaces, interfaces, and extended defects e.g. grain boundaries and dislocations. Electronic aspects of EM and dynamical atom response to current; emphasizing mesoscopic systems. Calculated local transport field in very small structures: near grain boundary or dislocation; and probeability by scanning tunneling microscope. Investigated inelastic scattering effects on electrical conductivity and EM of migrating impurity. Pauli-blocking effects induce nonlinearities in the electron and atom response. Mesoscopic systems show this more strongly than bulk systems because Fermi-distribution can be strongly perturbed in state with current. Investigated impurity heating by electron current, quantummechanical dynamics of interacting atom-lattice-electron system included; found effective temperature as function of time. Net atom flux expressed in terms of effective driving force in Nernst-Einstein relation; in phonon-assisted diffusion of light interstitials driving force can be much smaller than from previous theories. Generalization to non-adiabatic effects on electron screening and direct force for EM. Investigated dynamics in complementary classical diffusion processes; First numerical simulations of atomic level EM. Significant enhancement of light interstitial EM from. Electromigration, Quantum mechanics, Mesoscopic, Transport fields.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Design and Manufacturing of Active Microsystems written by Stephanus Büttgenbach and published by Springer Science & Business Media. This book was released on 2011-03-04 with total page 447 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the design and manufacturing of microsystems as well as necessary key technologies developed within the Collaborative Research Center 516. The research efforts of this collaboration are focused on active micro systems which are based on the electromagnetic actuator principle. The travel of the investigated actuator systems is on the order of several millimeters. The total construction size of the actuator is on the range of several centimeters whereas essential structures being several micrometers. The methods and the production technologies that are investigated on the basis of various research models incorporate the fundamental process chains of microsystems.

Download or read book Government Reports Annual Index written by and published by . This book was released on 1994 with total page 1688 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Phase field Modeling of Phase Changes and Mechanical Stresses in Electrode Particles of Secondary Batteries written by Zhang, Tao and published by KIT Scientific Publishing. This book was released on 2021-09-27 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most storage materials exhibit phase changes, which cause stresses and, thus, lead to damage of the electrode particles. In this work, a phase-field model for the cathode material NaxFePO4 of Na-ion batteries is studied to understand phase changes and stress evolution. Furthermore, we study the particle size and SOC dependent miscibility gap of the nanoscale insertion materials. Finally, we introduce the nonlocal species concentration theory, and show how the nonlocality influences the results.

Download or read book Lead free Solders written by K. Subramanian and published by John Wiley & Sons. This book was released on 2012-03-06 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Download or read book Government Reports Announcements Index written by and published by . This book was released on 1994-06 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections written by Cher Ming Tan and published by Springer Science & Business Media. This book was released on 2011-03-28 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.

Download or read book Mathematical Methods and Models in Phase Transitions written by Alain Miranville and published by Nova Publishers. This book was released on 2005 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: The modelling and the study of phase transition phenomena are capital issues as they have essential applications in material sciences and in biological and industrial processes. We can mention, e.g., phase separation in alloys, ageing of materials, microstructure evolution, crystal growth, solidification in complex alloys, surface diffusion in the presence of stress, evolution of the surface of a thin flow in heteroepitaxial growth, motion of voids in interconnects in integrated circuits, treatment of airway closure disease by surfactant injection, fuel injection, fire extinguishers etc., This book consists of 11 contributions from specialists in the mathematical modelling and analysis of phase transitions. The content of these contributions ranges from the modelling to the mathematical and numerical analysis. Furthermore, many numerical simulations are presented. Finally, the contributors have tried to give comprehensive and accurate reference lists. This book should thus serve as a reference book for researchers interested in phase transition phenomena.

Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

Download or read book The Cahn Hilliard Equation Recent Advances and Applications written by Alain Miranville and published by SIAM. This book was released on 2019-09-09 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book to present a detailed discussion of both classical and recent results on the popular Cahn–Hilliard equation and some of its variants. The focus is on mathematical analysis of Cahn–Hilliard models, with an emphasis on thermodynamically relevant logarithmic nonlinear terms, for which several questions are still open. Initially proposed in view of applications to materials science, the Cahn–Hilliard equation is now applied in many other areas, including image processing, biology, ecology, astronomy, and chemistry. In particular, the author addresses applications to image inpainting and tumor growth. Many chapters include open problems and directions for future research. The Cahn-Hilliard Equation: Recent Advances and Applications is intended for graduate students and researchers in applied mathematics, especially those interested in phase separation models and their generalizations and applications to other fields. Materials scientists also will find this text of interest.

Download or read book Transmission Pipeline Calculations and Simulations Manual written by E. Shashi Menon and published by Gulf Professional Publishing. This book was released on 2014-12-27 with total page 613 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transmission Pipeline Calculations and Simulations Manual is a valuable time- and money-saving tool to quickly pinpoint the essential formulae, equations, and calculations needed for transmission pipeline routing and construction decisions. The manual's three-part treatment starts with gas and petroleum data tables, followed by self-contained chapters concerning applications. Case studies at the end of each chapter provide practical experience for problem solving. Topics in this book include pressure and temperature profile of natural gas pipelines, how to size pipelines for specified flow rate and pressure limitations, and calculating the locations and HP of compressor stations and pumping stations on long distance pipelines. - Case studies are based on the author's personal field experiences - Component to system level coverage - Save time and money designing pipe routes well - Design and verify piping systems before going to the field - Increase design accuracy and systems effectiveness

Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Download or read book Nano Semiconductors written by Krzysztof Iniewski and published by CRC Press. This book was released on 2018-09-03 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: With contributions from top international experts from both industry and academia, Nano-Semiconductors: Devices and Technology is a must-read for anyone with a serious interest in future nanofabrication technologies. Taking into account the semiconductor industry’s transition from standard CMOS silicon to novel device structures—including carbon nanotubes (CNT), graphene, quantum dots, and III-V materials—this book addresses the state of the art in nano devices for electronics. It provides an all-encompassing, one-stop resource on the materials and device structures involved in the evolution from micro- to nanoelectronics. The book is divided into three parts that address: Semiconductor materials (i.e., carbon nanotubes, memristors, and spin organic devices) Silicon devices and technology (i.e., BiCMOS, SOI, various 3D integration and RAM technologies, and solar cells) Compound semiconductor devices and technology This reference explores the groundbreaking opportunities in emerging materials that will take system performance beyond the capabilities of traditional CMOS-based microelectronics. Contributors cover topics ranging from electrical propagation on CNT to GaN HEMTs technology and applications. Approaching the trillion-dollar nanotech industry from the perspective of real market needs and the repercussions of technological barriers, this resource provides vital information about elemental device architecture alternatives that will lead to massive strides in future development.

Download or read book Thermodynamic Methods in the Theory of Heterogeneous Systems written by M. J. Grinfelʹd and published by Longman Scientific and Technical. This book was released on 1991 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Effective FMEAs written by Carl S. Carlson and published by John Wiley & Sons. This book was released on 2012-04-11 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: Outlines the correct procedures for doing FMEAs and how to successfully apply them in design, development, manufacturing, and service applications There are a myriad of quality and reliability tools available to corporations worldwide, but the one that shows up consistently in company after company is Failure Mode and Effects Analysis (FMEA). Effective FMEAs takes the best practices from hundreds of companies and thousands of FMEA applications and presents streamlined procedures for veteran FMEA practitioners, novices, and everyone in between. Written from an applications viewpoint—with many examples, detailed case studies, study problems, and tips included—the book covers the most common types of FMEAs, including System FMEAs, Design FMEAs, Process FMEAs, Maintenance FMEAs, Software FMEAs, and others. It also presents chapters on Fault Tree Analysis, Design Review Based on Failure Mode (DRBFM), Reliability-Centered Maintenance (RCM), Hazard Analysis, and FMECA (which adds criticality analysis to FMEA). With extensive study problems and a companion Solutions Manual, this book is an ideal resource for academic curricula, as well as for applications in industry. In addition, Effective FMEAs covers: The basics of FMEAs and risk assessment How to apply key factors for effective FMEAs and prevent the most common errors What is needed to provide excellent FMEA facilitation Implementing a "best practice" FMEA process Everyone wants to support the accomplishment of safe and trouble-free products and processes while generating happy and loyal customers. This book will show readers how to use FMEA to anticipate and prevent problems, reduce costs, shorten product development times, and achieve safe and highly reliable products and processes.

Download or read book Continuum Mechanics and Thermodynamics written by Ellad B. Tadmor and published by Cambridge University Press. This book was released on 2012 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treats subjects directly related to nonlinear materials modeling for graduate students and researchers in physics, materials science, chemistry and engineering.