Download or read book Microcircuit Bond Screening Study written by John Gaffney and published by . This book was released on 1971 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: A study was undertaken to determine if any standard or nonstandard environment would provide an effective screen to remove weak bonds from integrated circuits. Both flat packages and dual-in-line packages were considered. All of the devices utilized .001 in. dia. aluminum wire, ultrasonically bonded to chip and post. The results indicated that package disintegration precedes bond detachment, even when bonds are only lightly attached. It is concluded, based on the results obtained from this study, that none of the environments used provided a totally effective screen for weak ultrasonic bonds.

Download or read book Development of Microcircuit Bond Pull Screening Techniques written by Anthony P. Bertin and published by . This book was released on 1973 with total page 101 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of microcircuit bond-pull screening techniques was undertaken to determine if prestressing of interconnecting wire bonds within a microcircuit package would be a feasible technique for removing weak bonds prior to sealing. The primary concern was determining if prestressing was destructive to the long life of the bonds. Test samples included both gold and aluminum 1 mil wire bonds, fabricated in two different package configurations, providing variations in wire length and loop height. The wire bonds were prestressed at a pull strength level equivalent to 40% of the average breaking strength of the wire. Both prestressed and unprestressed bonds were subjected to a testing program of package processing, MIL-STD-883 Class B screening and accelerated life testing. The results showed that prestressing, even at the relatively high levels used, had no long term degrading effect on the reliability of wire bonds and was a very useful screen for detecting poorly made bonds. The technique may be used as a 100% screen or as a product sampling test for bonding control. Cost factors may limit its usefulness. (Modified author abstract).

Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microcircuit Screening Effectiveness written by Henry C. Rickers and published by . This book was released on 1978 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt: This information is utilized to determine efficiency factors of individual screens/tests and is combined with cost information to assess screening effectiveness and to provide the proper guidance in determining the optimal screening program for any specific situation. (Author).

Download or read book Microcircuit Wire Bond Reliability written by T. R. Myers and published by . This book was released on 1972 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor devices interconnecting wire bonds have been a continuing source of reliability problems. This monograph discusses the relevance of design and processing factors to reliability problems with wire bonds. The prevention and control of such problems are discussed in terms of design, processing, post production screening and sampling tests. The current literature on the subject is reviewed and incorporated in the above discussions. An analysis of the RAC data base is presented along with the resulting bond failure rate equations and summary data. The report contains three appendices including a cross reference guide to the literature as well as bibliography of over 90 references with abstracts. (Author).

Download or read book Development of a Model for the Ultrasonic Wire Bond Used in Microcircuit Fabrication written by DREXEL UNIV PHILADELPHIA PA DEPT OF ELECTRICAL ENGINEERING. and published by . This book was released on 1976 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary objective of this contract has been to develop and improve the experimental techniques needed to evaluate the microcircuit bond model. To this end an alternate technique has been developed for separating the bond so that the interface can be examined; techniques and equipment for fabricating substrates have been improved; methods for measuring substrate properties have been developed; techniques for making several thousands of bonds to each substrate have been developed and methods for controlling ball size and shape have been developed. The techniques and equipments required for a full scale study of the microcircuit bond model are now available. The initial results indicate that the bond model is reasonably consistent with the test results. A full scale study of the bond model is recommended.

Download or read book Methods for Testing Wire bond Electrical Connections written by Harry A. Schafft and published by . This book was released on 1973 with total page 28 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Energy Research Abstracts written by and published by . This book was released on 1983 with total page 1408 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1973 with total page 1102 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Reference Manual for Telecommunications Engineering written by Roger L. Freeman and published by . This book was released on 2002 with total page 1766 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains a compendium of the most frequently used data in day-to-day telecommunications engineering work: tables, graphs, figures, formulae, nomograms, performance curves, standards highlights, constants and statistics. Designed for easy and rapid access. Comprehensive reference for designing, building, purchasing, using or maintaining all kinds of telecommunications systems. Central source of information on transmission, switching, traffic engineering, numbering, signaling, noise, modulation and forward error correction.

Download or read book Microelectronic Failure Analysis Desk Reference written by and published by ASM International. This book was released on 2001-01-01 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.

Download or read book Government Reports Announcements written by and published by . This book was released on 1974 with total page 1048 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Measurement Technology Combined Quarterly Report October 1 1973 to March 31 1974 written by W. Murray Bullis and published by . This book was released on 1974 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book NBS Special Publication written by and published by . This book was released on 1974 with total page 956 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1981 with total page 1372 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Measurement Technology written by Institute for Applied Technology (U.S.). Electronic Technology Division and published by . This book was released on 1973 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Government Reports Announcements Index written by and published by . This book was released on 1983 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: