Download or read book Materials and Process Considerations in Electronic Component Design written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1989 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the design phase of a product, emphasis in usually placed in such factors as function, size, weight, and cost. Lately, manufacturability has become another key factor since a design is of little value if it cannot be produced. Within the realm of manufacturability, the design engineer should, whenever possible, consider various materials and processed that will be used in the fabrication of the product. Using case examples, this paper will illustrate how interactions between various materials and processed can lead to problems with regard to the fabrication or function of a product. By documenting and learning from these experiences, future problems can be prevented during the design phase.

Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Download or read book Mechanical Engineers Handbook Volume 1 written by Myer Kutz and published by John Wiley & Sons. This book was released on 2015-02-05 with total page 1042 pages. Available in PDF, EPUB and Kindle. Book excerpt: Full coverage of materials and mechanical design in engineering Mechanical Engineers' Handbook, Fourth Edition provides a quick guide to specialized areas you may encounter in your work, giving you access to the basics of each and pointing you toward trusted resources for further reading, if needed. The accessible information inside offers discussions, examples, and analyses of the topics covered. This first volume covers materials and mechanical design, giving you accessible and in-depth access to the most common topics you'll encounter in the discipline: carbon and alloy steels, stainless steels, aluminum alloys, copper and copper alloys, titanium alloys for design, nickel and its alloys, magnesium and its alloys, superalloys for design, composite materials, smart materials, electronic materials, viscosity measurement, and much more. Presents comprehensive coverage of materials and mechanical design Offers the option of being purchased as a four-book set or as single books, depending on your needs Comes in a subscription format through the Wiley Online Library and in electronic and custom formats Engineers at all levels of industry, government, or private consulting practice will find Mechanical Engineers' Handbook, Volume 1 a great resource they'll turn to repeatedly as a reference on the basics of materials and mechanical design.

Download or read book Materials Enabled Designs written by Michael Pfeifer and published by Butterworth-Heinemann. This book was released on 2009-06-02 with total page 321 pages. Available in PDF, EPUB and Kindle. Book excerpt: There are books aplenty on materials selection criteria for engineering design. Most cover the physical and mechanical properties of specific materials, but few offer much in the way of total product design criteria. This innovative new text/reference will give the “Big picture view of how materials should be selected—not only for a desired function but also for their ultimate performance, durability, maintenance, replacement costs, and so on. Even such factors as how a material behaves when packaged, shipped, and stored will be taken into consideration. For without that knowledge, a design engineer is often in the dark as to how a particular material used in particular product or process is going to behave over time, how costly it will be, and, ultimately, how successful it will be at doing what is supposed to do. This book delivers that knowledge. * Brief but comprehensive review of major materials functional groups (mechanical, electrical, thermal, chemical) by major material categories (metals, polymers, ceramics, composites)* Invaluable guidance on selection criteria at early design stage, including such factors as functionality, durability, and availability* Insight into lifecycle factors that affect choice of materials beyond simple performance specs, including manufacturability, machinability, shelf life, packaging, and even shipping characteristics* Unique help on writing materials selection specifications

Download or read book Design for Excellence in Electronics Manufacturing written by Cheryl Tulkoff and published by John Wiley & Sons. This book was released on 2021-03-22 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.

Download or read book Electronic Materials and Processes Handbook written by Charles A. Harper and published by McGraw-Hill Professional Publishing. This book was released on 1994 with total page 814 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems.

Download or read book Design Guidelines for Surface Mount Technology written by John Traister and published by Elsevier. This book was released on 2012-12-02 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

Download or read book Mechanics and Materials for Electronic Packaging Design and process issues in electronic packaging written by American Society of Mechanical Engineers. Applied Mechanics Division and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

Download or read book Corrosion and Reliability of Electronic Materials and Devices written by Robert B. Comizzoli and published by The Electrochemical Society. This book was released on 1999 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 8th Automotive Materials Conference written by William J. Smothers and published by John Wiley & Sons. This book was released on 2009-09-28 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.

Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Download or read book Compatibility and Testing of Electronic Components written by C. E. Jowett and published by Elsevier. This book was released on 2016-08-10 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for electronic applications; and humidity corrosion of metallic resistors. The text is recommended for electrical engineers who would like to know more about electrical components, especially those who are interested in the fields of thin films and integrated circuitry.

Download or read book Winter Annual Meeting written by American Society of Mechanical Engineers and published by . This book was released on with total page 702 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Comprehensive Materials Processing written by and published by Newnes. This book was released on 2014-04-07 with total page 5485 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive Materials Processing, Thirteen Volume Set provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources

Download or read book Materials Selection and Design written by Md Abdul Maleque and published by Springer Science & Business Media. This book was released on 2013-12-11 with total page 127 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents topics on the basics of materials selection and design which will give a better understanding on the selection methods and then find suitable materials for the applications. This book draws the simple and straightforward quantitative methods followed by knowledge-based expert system approach with real and tangible case studies to show how undergraduate or post-graduate students or engineers can apply their knowledge on materials selection and design. Topics discussed in this book contain special features such as illustration, tables and tutorial questions for easy understanding. A few published books or documents are available, hence this book will be very useful for those who use (or want to use) materials selection approach without the advantages of having had comprehensive knowledge or expertise in this materials’ world.

Download or read book Concise Encyclopedia of Semiconducting Materials Related Technologies written by S. Mahajan and published by Elsevier. This book was released on 2013-10-22 with total page 607 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronic materials and particularly advances in semiconductor technology have played a central role in the electronics revolution by allowing the production of increasingly cheap and powerful computing equipment and advanced telecommunications devices. This Concise Encyclopedia, which incorporates relevant articles from the acclaimed Encyclopedia of Materials Science and Engineering as well as newly commissioned articles, emphasizes the materials aspects of semiconductors and the technologies important in solid-state electronics. Growth of bulk crystals and epitaxial layers are discussed in the volume and coverage is included of defects and their effects on device behavior. Metallization and passivation issues are also covered. Over 100 alphabetically arranged articles, written by world experts in the field, are each intended to serve as the first source of information on a particular aspect of electronic materials. The volume is extensively illustrated with photographs, diagrams and tables. A bibliography is provided at the end of each article to guide the reader to recent literature. A comprehensive system of cross-references, a three-level subject index and an alphabetical list of articles are included to aid readers in the abstraction of information.