Download or read book Material Factors Influencing Metallic Whisker Growth written by and published by . This book was released on 2008 with total page 173 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Factors Governing Tin Whisker Growth written by Erika R Crandall and published by Springer Science & Business Media. This book was released on 2013-08-15 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems. This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.

Download or read book RCA Engineer written by and published by . This book was released on 1960 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Whisker Technology written by Albert P. Levitt and published by John Wiley & Sons. This book was released on 1970 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 1572 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mitigating Tin Whisker Risks written by Takahiko Kato and published by John Wiley & Sons. This book was released on 2016-04-28 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

Download or read book Materials Science and Chemical Engineering written by Jin Yun and published by Trans Tech Publications Ltd. This book was released on 2013-05-27 with total page 1012 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 2013 International Conference on Materials Science and Chemical Engineering (MSCE 2013), February 20-21, 2013, Singapore, Singapore

Download or read book ISTFA 1997 International Symposium for Testing and Failure Analysis written by Grace M. Davidson and published by ASM International. This book was released on 1997-01-01 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Army Research and Development written by and published by . This book was released on 1965 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Inorganic Fibres Composite Materials written by P. Bracke and published by Elsevier. This book was released on 2013-10-22 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: A compendium of the current state-of-the-art in the technology of inorganic fibre manufacture and its use in the development of new high grade composite materials. Provides comprehensive information that is well in advance of industrial realization with invaluable insight relating to development and expected future trends. Specific entries are provided for the most important types of fibres known to date, each type discussed under manufacture, post-treatments, properties and uses. Also includes high quality photomicrographs, diagrams of the process techniques and molecular structures, bibliographical data, and helpful summaries in tabular form. Lists over 870 patent references.

Download or read book Tin and Solder Plating in the Semiconductor Industry written by A.C. Tan and published by Springer Science & Business Media. This book was released on 1992-11-30 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1966 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Navy Research Task Summary written by United States. Office of Naval Research and published by . This book was released on with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Navy Research Task Summary 1961 written by United States. Office of Naval Research and published by . This book was released on 1962 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1969 with total page 1090 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book U S Government Research Development Reports written by and published by . This book was released on 1970 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Metal Finishing Abstracts written by and published by . This book was released on 1970 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: