Download or read book Low Temperature Silicon Thin Films for Large Area Electronics Device Fabrication Using Soft Lithography and Laser Crystallization by Sequential Lateral Solidification written by and published by . This book was released on 2001 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Low temperature Si Thin Films for Large area Electronics written by Hyun-Chul Jin and published by . This book was released on 2001 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Excimer Laser Crystallization of Silicon Films Artificially Controlled Super Lateral Growth for Grain Boundary Location Controlled and Single Crystal Island Materials for Thin Film Transistor Applications written by and published by . This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report describes new excimer-laser crystallization (ELC) techniques for producing high-quality Si films for AMLCD applications. These artificially controlled super-lateral growth (ACSLG) processes deliver crystalline silicon films with microstructures optimized for thin-film transistor applications. The ACSLG methods described herein include: (1) a low-temperature method for producing grain-boundary-location-controlled (GLC) Si films on glass substrates, (2) a high-temperature method for producing single-crystal islands (SCI) on quartz substrates, (3) a realistic two-dimensional program for simulation of ELC, and (4) low-temperature sequential lateral solidification of Si films. Preliminary TFT devices have yielded near-record performance characteristics and demonstrate that the ACSLG materials are superior to existing materials for fabrication of TFTs. The sequential lateral solidification (SLS) process possesses two characteristics not found in any other technique: (1) it can produce the best material (single-crystal silicon films) for TFT devices, and (2) it does so directly on low-cost, low-temperature substrates. The impact of the SLS process will be to create a new materials/device technology: low-temperature single-crystal silicon TFTs, which will: (1) displace conventional low- and high-temperature polycrystalline silicon TFT technology; (2) eliminate the need to utilize silicon-on-insulator (SOI) processes; and (3) ultimately enable the realization of highly integrated AMLCDs and system-on-glass products.
Download or read book Thin Film Materials for Large Area Electronics written by B. Equer and published by Elsevier Science Limited. This book was released on 1999 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: The symposium brought together more than a hundred attendees from many countries including a significant participation from Japan and other East-Asia countries. Many of the trends observed in the 1st Symposium held in 1996 were confirmed: displays are indeed the main application in LAE (photovoltaics were not included in the topics of this symposium) and active matrix display (AMLCD) is still the leading technology. Future AMLCDs integrating the display drivers onto the same substrate require much faster thin-film transistors (TFTs) than those used for LCD addressing, therefore putting a strong demand on polysilicon performances. As a consequence the quest for an improved low temperature, large area (and low cost) polysilicon process is intensive and the competitors, including direct plasma deposition and excimer laser crystallization of amorphous layers, are reporting significant steps forward. With the tremendous demand for efficient colour flat panel displays, other display technologies are gaining interest. Field emission display (FED) is one of them. FEDs based on amorphous tetrahedral carbon thin-films are stimulating intensive studies on the optoelectronic properties of this complex material. Large area pixellized sensors for x-ray radiography and document scanning is another field of application in LAE which has recently reached initial production. Using a TFT or diode pixel addressing similar to AMLCD, this kind of device benefits from most of the AMLCD technology. However these devices present an increased complexity and stringent specifications on noise which in turn means materials with improved electronic transport properties. Finally, LAE is a fast developing area in thin-film research and technology. Initially an all-silicon domain, it now involves a large range of thin-film semiconductors and dielectrics, whose properties need to be fully understood and for which flexible and efficient processes have still to be developed.
Download or read book Low Temperature Processing of Thin Films for Flexible Electronics written by P. Joshi and published by The Electrochemical Society. This book was released on 2009-05 with total page 63 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Novel Plasma Techniques for Low Temperature Processing of Thin Films for Flexible Electronics¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, California from May 24 to 29, 2009.
Download or read book American Doctoral Dissertations written by and published by . This book was released on 2001 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Films On Silicon Electronic And Photonic Applications written by Vijay Narayanan and published by World Scientific. This book was released on 2016-08-15 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a broad overview of the fundamental materials science of thin films that use silicon as an active substrate or passive template, with an emphasis on opportunities and challenges for practical applications in electronics and photonics. It covers three materials classes on silicon: Semiconductors such as undoped and doped Si and SiGe, SiC, GaN, and III-V arsenides and phosphides; dielectrics including silicon nitride and high-k, low-k, and electro-optically active oxides; and metals, in particular silicide alloys. The impact of film growth and integration on physical, electrical, and optical properties, and ultimately device performance, is highlighted.
Download or read book Thin Film Device Applications written by Kasturi Chopra and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Two-dimensional materials created ab initio by the process of condensation of atoms, molecules, or ions, called thin films, have unique properties significantly different from the corresponding bulk materials as a result of their physical dimensions, geometry, nonequilibrium microstructure, and metallurgy. Further, these characteristic features of thin films can be drasti cally modified and tailored to obtain the desired and required physical characteristics. These features form the basis of development of a host of extraordinary active and passive thin film device applications in the last two decades. On the one extreme, these applications are in the submicron dimensions in such areas as very large scale integration (VLSI), Josephson junction quantum interference devices, magnetic bubbles, and integrated optics. On the other extreme, large-area thin films are being used as selective coatings for solar thermal conversion, solar cells for photovoltaic conver sion, and protection and passivating layers. Indeed, one would be hard pressed to find many sophisticated modern optical and electronic devices which do not use thin films in one way or the other. With the impetus provided by industrial applications, the science and technology of thin films have undergone revolutionary development and even today continue to be recognized globally as frontier areas of RID work. Major technical developments in any field of science and technology are invariably accompanied by an explosion of published literature in the form of scientific publications, reviews, and books.
Download or read book Metal Based Thin Films for Electronics written by Klaus Wetzig and published by John Wiley & Sons. This book was released on 2006-03-06 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This up-to-date handbook covers the main topics of preparation, characterization and properties of complex metal-based layer systems. The authors -- an outstanding group of researchers -- discuss advanced methods for structure, chemical and electronic state characterization with reference to the properties of thin functional layers, such as metallization and barrier layers for microelectronics, magnetoresistive layers for GMR and TMR, sensor and resistance layers. As such, the book addresses materials specialists in industry, especially in microelectronics, as well as scientists, and can also be recommended for advanced studies in materials science, analytics, surface and solid state science.
Download or read book Thin Film Physics And Devices Fundamental Mechanism Materials And Applications For Thin Films written by Jianguo Zhu and published by World Scientific. This book was released on 2021-06-18 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films have an extremely broad range of applications from electronics and optics to new materials and devices. Collaborative and multidisciplinary efforts from physicists, materials scientists, engineers and others have established and advanced a field with key pillars constituting (i) the synthesis and processing of thin films, (ii) the understanding of physical properties in relation to the nanometer scale, (iii) the design and fabrication of nano-devices or devices with thin film materials as building blocks, and (iv) the design and construction of novel tools for characterization of thin films.Against the backdrop of the increasingly interdisciplinary field, this book sets off to inform the basics of thin film physics and thin film devices. Readers are systematically introduced to the synthesis, processing and application of thin films; they will also study the formation of thin films, their structure and defects, and their various properties — mechanical, electrical, semiconducting, magnetic, and superconducting. With a primary focus on inorganic thin film materials, the book also ventures on organic materials such as self-assembled monolayers and Langmuir-Blodgett films.This book will be effective as a teaching or reference material in the various disciplines, ranging from Materials Science and Engineering, Electronic Science and Engineering, Electronic Materials and Components, Semiconductor Physics and Devices, to Applied Physics and more. The original Chinese publication has been instrumental in this purpose across many Chinese universities and colleges.
Download or read book Preparation and Properties of Thin Films written by K. N. Tu and published by Elsevier. This book was released on 2013-10-22 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.
Download or read book Thin Films and Heterostructures for Oxide Electronics written by Satishchandra B. Ogale and published by Springer Science & Business Media. This book was released on 2005-07-15 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: Oxides form a broad subject area of research and technology development which encompasses different disciplines such as materials science, solid state chemistry, physics etc. The aim of this book is to demonstrate the interplay of these fields and to provide an introduction to the techniques and methodologies involving film growth, characterization and device processing. The literature in this field is thus fairly scattered in different research journals covering one or the other aspect of the specific activity. This situation calls for a book that will consolidate this information and thus enable a beginner as well as an expert to get an overall perspective of the field, its foundations, and its projected progress.
Download or read book Thin Films on Silicon written by Vijay Narayanan and published by Materials and Energy. This book was released on 2016-08-15 with total page 537 pages. Available in PDF, EPUB and Kindle. Book excerpt: A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Silicon (Si) is one of the most important semiconductors today because it has a very low occurrence of defects. While it's the building block of most electronic devices, other semiconductors are becoming more important in the industry because of their superior properties. The search for organic semiconductors as well as hybrid materials which combine organic and inorganic materials is underway. Scientists are searching for the materials most capable of absorbing light over a wide range of solar wavelengths and with the lowest manufacturing cost. This book explores the recent advances and remaining challenges in thin-film silicon.
Download or read book Flexible Electronics Fabrication by Lithography free Low Temperature Metal Nanoparticle Laser Processing written by Seung Hwan Ko and published by . This book was released on 2006 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Films on Silicon written by Vijay Narayanan and published by . This book was released on 2016 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This volume provides a broad overview of the fundamental materials science of thin films that use silicon as an active substrate or passive template, with an emphasis on opportunities and challenges for practical applications in electronics and photonics. It covers three materials classes on silicon: Semiconductors such as undoped and doped Si and SiGe, SiC, GaN, and III-V arsenides and phosphides; dielectrics including silicon nitride and high-k, low-k, and electro-optically active oxides; and metals, in particular silicide alloys. The impact of film growth and integration on physical, electrical, and optical properties, and ultimately device performance, is highlighted."--Publisher's website.
Download or read book Low Temperature Processing of Thin Films for Flexible Electronics written by and published by . This book was released on 2009 with total page 53 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Transfer Printing Methods for Fabricating Thin film Electronics on Nonconventional Substrates written by Chi Hwan Lee and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin-film electronics refer to devices composed from thin-films of active semiconductors, dielectrics and metallic connects that are deposited over a supporting substrate, frequently silicon or glass. Thin-film electronics are widely used for applications, ranging from solar cells, batteries, transistors, light emitting diodes to sensors. Fabrication of thin-film electronics on nonconventional substrates (e.g., papers, polymers, fabrics and metal sheets) presents exciting opportunities for realizing the next-generation of electronics, such as flexible displays, transparent touchscreen panels, wearable solar cells and bio-integrated electronics. However, fabrication of thin-film electronics on nonconventional substrates faces a significant challenge due to the mismatch between the device fabrication conditions and the tolerable processing conditions for the nonconventional substrates in terms of maximum temperature and chemical compatibility. To overcome this challenge, two transfer printing methods are developed, which involve the following main steps: (1) fabricating the thin-film electronics on a conventional silicon wafer using standard fabrication methods; (2) peeling off the entire thin-film electronics from the silicon wafer; and (3) finally attaching the thin-film electronics to nonconventional substrates. This general approach eliminates the need for further fabrication steps on the nonconventional substrates; therefore overcoming the above processing condition mismatch challenge. The first transfer printing method relies on the differences in adhesion to transfer thin-film electronics from weakly adhesive donor silicon wafer to more strongly adhesive receiver substrates. To demonstrate this, the silicon nanowire based thin-film resistors were used. Electrical characterization of the transferred thin-film electronics shows that ohmic contacts are maintained between silicon nanowires and metal electrodes, and are successfully demonstrated for applications of flexible piezoresistive sensors and temperature sensors with reliable performance. Nevertheless, about 30~50% of the devices are damaged during the peel-off process due to the high mechanical stresses. To resolve this problem, the second transfer printing method is developed, named water-assisted transfer printing method or peel-and-stick process, which relies on the phenomenon of water penetrating into the interface between Ni film and SiO2 layer. As model systems for the peel-and-stick process, we use hydrogenated amorphous silicon thin-film solar cells in addition to silicon nanowire based thin-film resistors, diodes and transistors as model systems. The transfer yield is improved to 100%, and the transferred thin-film electronics maintain their original geometries and device performances with high fidelity. We hypothesize that the peel-and-stick process is closely related to the water-assisted subcritical debonding phenomenon. So, we further experimentally investigate the critical adhesion energy of the Ni-SiO2 interface where the phenomenon of water penetrating occurs, and confirm that the critical interfacial adhesion energies are significantly reduced by 70~80% in the presence of water, compared to those in ambient environment. We believe that the peel-and-stick process has great potential for the manufacturing of high-performance thin-film electronics on diverse flexible/transparent nonconventional substrates.
