Download or read book Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2004 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multilayered Low Temperature Cofired Ceramics LTCC Technology written by Yoshihiko Imanaka and published by Springer Science & Business Media. This book was released on 2006-05-28 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Download or read book Low Temperature Co fired Ceramic LTCC Substrate for High Temperature Microelectronics written by Devin Alexander Smarra and published by . This book was released on 2017 with total page 74 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry is Low Temperature Co-fired Ceramic (LTCC). LTCC is a multi-layer design and packaging system that can embed passive components and thermal management structures within a substrate. This thesis compiles research done to evaluate LTCC as a high-performance electronic packaging technique by determining the performance of embedded passives and thermal management structures at temperatures from -55°C to 225°C. The passive structures and thermal management structures are evaluated using theoretical calculations, simulations, and measurements of fabricated devices.
Download or read book Low Temperature Electronics written by Edmundo A. Gutierrez-D. and published by Academic Press. This book was released on 2001 with total page 985 pages. Available in PDF, EPUB and Kindle. Book excerpt: Summarizes the advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. This book provides an exploration of the theory, research, and technologies related to cryoelectronics.
Download or read book Low temperature Electronics written by Randall K. Kirschman and published by . This book was released on 1986 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Low Temperature Co fired Ceramics for System in Package Applications at 122 GHz written by Bhutani, Akanksha and published by KIT Scientific Publishing. This book was released on 2019-10-17 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Download or read book Microwave Materials and Applications written by Mailadil T. Sebastian and published by John Wiley & Sons. This book was released on 2017-03-02 with total page 1000 pages. Available in PDF, EPUB and Kindle. Book excerpt: The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
Download or read book Advances in Dielectric Materials and Electronic Devices written by K. M. Nair and published by John Wiley & Sons. This book was released on 2012-04-11 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Download or read book Printed Electronics Technologies written by Wei Wu and published by Royal Society of Chemistry. This book was released on 2022-07-20 with total page 685 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern printing technology has paved the way for the fabrication of thin inexpensive electronics and is now established as a topic taught on advanced level courses across materials science and engineering. The properties of printed electronics, such as thin-form factor, flexibility, stretchability, portability, and rollability mean that they have a wide range of applications, including in wearable devices, smart packaging, healthcare, and the automotive industry. This book describes the key printing technologies for printed electronics. Chapters cover principles and mechanisms, techniques, inorganic and organic materials, substrates, post-treatment and applications of printed electronics technologies. Written by a leader in the field, this title will be essential reading for students on courses across materials science, electronics science, manufacturing and engineering, as well as those with an interest in printed electronics.
Download or read book Advanced Thermal Management Materials written by Guosheng Jiang and published by Springer Science & Business Media. This book was released on 2012-09-14 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Download or read book Harsh Environment Electronics written by Ahmed Sharif and published by John Wiley & Sons. This book was released on 2019-08-05 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Download or read book Developments in Dielectric Materials and Electronic Devices written by K. M. Nair and published by John Wiley & Sons. This book was released on 2012-04-11 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers in this volume include topics such as materials synthesis and processing; relaxors; novel compositions; material design; materials for multilayer electronic devices; processing-microstructure-property relationship; applications; environmental issues; and economic/cost analysis of tomorrow's electronic devices. Includes 38 papers.
Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Download or read book Ceramic Materials for Electronics written by Relva C. Buchanan and published by CRC Press. This book was released on 2018-10-08 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Download or read book MEMS Accelerometers written by Mahmoud Rasras and published by MDPI. This book was released on 2019-05-27 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Download or read book Modern Ferrites Volume 2 written by Vincent G. Harris and published by John Wiley & Sons. This book was released on 2022-11-08 with total page 421 pages. Available in PDF, EPUB and Kindle. Book excerpt: MODERN FERRITES, Volume 2 A robust exploration of the basic principles of ferrimagnetic and their applications In Modern Ferrites: Volume 2, renowned researcher and educator, Vincent G. Harris delivers a comprehensive overview of ferrimagnetic phenomena and discussions of select applications of modern ferrite materials in emerging technologies and applications. Volume 2 explores fundamental properties of ferrite systems, including their structure, chemistry, and magnetism, as well as practical applications, such as permanent magnets; inductors, inverters, and filters; and their use in emerging applications as metamaterials, multiferroics, and biomedical technologies. In addition to the properties of ferrites, the included resources explore the processing, structure, and property relationships in ferrites as nanoparticles, thin and thick films, compacts, and crystals. The authors discuss how these relationships are key to realizing practical device applications laying the foundation for next generation communications, radar, sensing, and biomedical technologies. This volume includes: A comprehensive review of ferrite discoveries and impacts upon ancient cultures, their scientific evolution, and societal benefits; Discussion of the origins of magnetism in ferrimagnetic oxides including superexchange theory, GKA-rules, and recent developments in density functional theory; In-depth examination of ferrite power conversion and conditioning components and their processing as low temperature co-fired ceramics; Ferrite-based electromagnetic interference suppression and electromagnetic absorption; Nonlinear microwave devices; multiferroic and emerging magnetoelectric devices; Biomedical applications of ferrite nanoparticles Perfect for RF engineers and magnetitians working in the fields of RF electronics, radar, communications, and spintronics as well as other emerging technologies. Modern Ferrites will earn a place on the bookshelves of engineers and scientists interested in the ever-expanding technologies reliant upon ferrite materials and new processing methodologies. Modern Ferrites Volume 1: Basic Principles, Processing and Properties is also available (ISBN: 9781118971468).
