Download or read book Layer Assignment for Rubber Band Routing written by T. Dayan and published by . This book was released on 1993 with total page 17 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rubber band Based Topological Router written by Tal Dayan and published by . This book was released on 1997 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Global Wiring for a Performance driven Rubber band Router written by David Joseph Staepelaere and published by . This book was released on 1999 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rubber band Updating and Applications for Post route Optimization written by Jeffrey Z. Su and published by . This book was released on 1998 with total page 308 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Algorithms for VLSI Physical Design Automation written by Naveed A. Sherwani and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 554 pages. Available in PDF, EPUB and Kindle. Book excerpt: Algorithms for VLSI Physical Design Automation, Second Edition is a core reference text for graduate students and CAD professionals. Based on the very successful First Edition, it provides a comprehensive treatment of the principles and algorithms of VLSI physical design, presenting the concepts and algorithms in an intuitive manner. Each chapter contains 3-4 algorithms that are discussed in detail. Additional algorithms are presented in a somewhat shorter format. References to advanced algorithms are presented at the end of each chapter. Algorithms for VLSI Physical Design Automation covers all aspects of physical design. In 1992, when the First Edition was published, the largest available microprocessor had one million transistors and was fabricated using three metal layers. Now we process with six metal layers, fabricating 15 million transistors on a chip. Designs are moving to the 500-700 MHz frequency goal. These stunning developments have significantly altered the VLSI field: over-the-cell routing and early floorplanning have come to occupy a central place in the physical design flow. This Second Edition introduces a realistic picture to the reader, exposing the concerns facing the VLSI industry, while maintaining the theoretical flavor of the First Edition. New material has been added to all chapters, new sections have been added to most chapters, and a few chapters have been completely rewritten. The textual material is supplemented and clarified by many helpful figures. Audience: An invaluable reference for professionals in layout, design automation and physical design.
Download or read book Physical Design for Multichip Modules written by Mysore Sriram and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 205 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Download or read book Pin Assignment and Routing on a Single layer Pin Grid Array written by Man-fai Yu and published by . This book was released on 1995 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Routing in the Third Dimension written by Naveed A. Sherwani and published by John Wiley & Sons. This book was released on 1995-03 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Download or read book Single layer Fanout Routing and Routability Analysis for Ball Grid Arrays written by Man-fai Yu and published by . This book was released on 1995 with total page 28 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Performance Design Automation for Multi chip Modules and Packages written by Jun-Dong Cho and published by World Scientific. This book was released on 1996 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Download or read book System in Package written by Lei He and published by Now Publishers Inc. This book was released on 2011-06-20 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Download or read book Handbook of Algorithms for Physical Design Automation written by Charles J. Alpert and published by CRC Press. This book was released on 2008-11-12 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Download or read book Single layer Wire Routing and Compaction written by F. Miller Maley and published by MIT Press (MA). This book was released on 1990 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This pioneering study of two-dimensional wiring patterns develops powerful algorithms for the physical design of VLSI circuits. Its homotopic approach to circuit layout advances the state of the art in wire routing and layout compaction, and will inspire future research. By viewing wires as flexible connections with fixed topology, the author obtains simple and efficient algorithms for CAD problems whose previous solutions employed, unreliable or inefficient heuristics. Single-Layer Wire Routing and Compactionis the first rigorous treatment of homotopic layouts and the techniques for optimizing them. In a novel application of classical mathematics to computer science, Maley characterizes the ideal routing of a layout in terms of simple topological invariants. He derives practical algorithms from this theoretical insight. The algorithms and their underlying ideas are intuitive, widely applicable, and presented in a highly readable style. F. Miller Maley is a Research Associate in the Computer Science Department at Princeton University. Single-Layer Wire Routing and Compactionis included in the series Foundations of Computing, edited by Michael Garey and Albert Meyer.
Download or read book Proceedings written by and published by . This book was released on 1997 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 1991 IEEE International Symposium on Circuits and Systems written by and published by . This book was released on 1991 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book An Introduction to VLSI Physical Design written by Majid Sarrafzadeh and published by McGraw-Hill Science, Engineering & Mathematics. This book was released on 1996 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication
