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Download or read book Wafer Level Chip Scale Packaging written by Shichun Qu and published by Springer. This book was released on 2014-09-10 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

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Download or read book Semiconductor Technology ISTC 2001 written by Ming Yang and published by . This book was released on 2001 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Computing in Research and Development in Africa written by Abdoulaye Gamatié and published by Springer. This book was released on 2014-10-11 with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the trends, challenges and solutions in computing use for scientific research and development within different domains in Africa, such as health, agriculture, environment, economy, energy, education and engineering. The benefits expected are discussed by a number of recognized, domain-specific experts, with a common theme being computing as solution enabler. This book is the first document providing such a representative up-to-date view on this topic at the continent level.

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Download or read book Proceedings of the 1992 International Symposium on Microelectronics October 19 21 1992 Moscone Center San Francisco California written by International Society for Hybrid Microelectronics and published by . This book was released on 1992 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Download or read book 3D Integration for NoC based SoC Architectures written by Abbas Sheibanyrad and published by Springer Science & Business Media. This book was released on 2010-11-08 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Download or read book Proceedings of the 11th International Conference on Robotics Vision Signal Processing and Power Applications written by Nor Muzlifah Mahyuddin and published by Springer Nature. This book was released on 2022-02-11 with total page 1124 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceeding is a collection of research papers presented at the 11th International Conference on Robotics, Vision, Signal Processing & Power Applications (RoViSP 2021). The theme of RoViSP 2021 “Enhancing Research and Innovation through the Fourth Industrial Revolution (IR 4.0)” served as a platform for researchers, scientists, engineers, academicians as well as industrial professionals from all around the globe to present and exchange their research findings and development activities through oral presentations. The book covers various topics of interest, including: Robotics, Control, Mechatronics and Automation Telecommunication Systems and Applications Electronic Design and Applications Vision, Image and Signal Processing Electrical Power, Energy and Industrial Applications Computer and Information Technology Biomedical Engineering and Applications Intelligent Systems Internet-of-things Mechatronics Mobile Technology

Download or read book Proceedings of the International Symposium on Power Semiconductor Devices and ICs written by and published by . This book was released on 2004 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Universal Access in Human Computer Interaction Context Diversity written by Constantine Stephanidis and published by Springer. This book was released on 2011-06-27 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt: The four-volume set LNCS 6765-6768 constitutes the refereed proceedings of the 6th International Conference on Universal Access in Human-Computer Interaction, UAHCI 2011, held as Part of HCI International 2011, in Orlando, FL, USA, in July 2011, jointly with 10 other conferences addressing the latest research and development efforts and highlighting the human aspects of design and use of computing systems. The 47 revised papers included in the third volume were carefully reviewed and selected from numerous submissions. The papers are organized in the following topical sections: universal access in the mobile context; ambient assisted living and smart environments; driving and interaction; interactive technologies in the physical and built environment.