Download or read book Interdiffusion and Adhesion of Polyimides written by Nancy Cecelia Stoffel and published by . This book was released on 1995 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polyimides written by Malay Ghosh and published by CRC Press. This book was released on 2018-02-06 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides coverage on the full range of topics associated with polyimides, including structure, polymer fundamentals, and product areas. The text addresses both basic and applied aspects of the subject. It details the synthesis of polyimides, polyamideimides, and flourinated polyimides, explains the molecular design of photosensitive polyimides, and more.
Download or read book Polyimides written by K.L. Mittal and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 626 pages. Available in PDF, EPUB and Kindle. Book excerpt: This and its companion Volume 2 chronicle the proceedings of the First Technical Conference on Polyimides: Synthesis, Char acterization and Applications held under the auspices of the Mid Hudson Section of the Society of Plastics Engineers at Ellenville, New York, November 10-12, 1982. In the last decade or so there has been an accelerated interest in the use of polyimides for a variety of applications in a number of widely differing technologies. The applications of polyimides range from aerospace to microelectronics to medical field, and this is attributed to the fact that polyimides offer certain desirable traits, inter alia, high temperature stability. Polyimides are used as organic insulators, as adhesives, as coat ings, in composites, just to name a few of their uses. Even a casual search of the literature will underscore the importance of this class of materials and the high tempo of R&D activity taking place in the area of polyimides. So it was deemed that a conference on polyimides was both timely and needed. This conference was designed to provide a forum for discussion of various ramifications of polyimides, to bring together scientists and technologists interested in all aspects of polyimides and thus to provide an opportunity for cross-pollination of ideas, and to highlight areas which needed further and intensi fied R&D efforts. If the comments from the attendees are a baro meter of the success of a conference, then this event was highly successful and fulfilled amply its stated objectives.
Download or read book Polyimides and Other High temperature Polymers written by K. L. Mittal and published by BRILL. This book was released on 2009-04-24 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics covered in this proceedings volume include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.
Download or read book Advances in Polyimide written by Claudius Feger and published by CRC Press. This book was released on 1993-01-04 with total page 970 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polyimides and Other High Temperature Polymers Synthesis Characterization and Applications volume 2 written by Kash L. Mittal and published by CRC Press. This book was released on 2003-03-01 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume documents the proceedings of the Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, December 3-6, 2001. Polyimides possess many desirable attributes, so this class of materials has found applications in many technologies ranging from
Download or read book Polyimides and Other High Temperature Polymers Synthesis Characterization and Applications written by Kash L. Mittal and published by CRC Press. This book was released on 2007-07-10 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is mostly based on papers presented at the Fourth International Symposium on this topic held in Savannah, Georgia. However, in addition to these papers, certain very relevant papers have also been included to broaden the scope and thus enhance the value of this book. Currently there is tremendous interest in these material because of their unique properties and applications in diverse technological areas ranging from microelectronics to aerospace to adhesive bonding. This book is divided into three parts: Part 1: Synthesis and Bulk Characterization; Part 2: Surface and Interface Aspects (Composites and Metallization); and Part 3: Applications. The topics covered include: synthesis of a number of polyimides with tailored properties; nanocomposites for high-performance applications; molecular assembly of polyimides; polyimide L-B films; metallization of polyimides; applications of high temperature polymers as proton exchange membranes; dielectrics, and in textile.
Download or read book Properties and Adhesion of Polyimides in Microelectronic Devices written by M. Grunze and published by . This book was released on 1990 with total page 12 pages. Available in PDF, EPUB and Kindle. Book excerpt: This paper gives a summary on the properties of polyimide films used in microelectronic devices and on recent research efforts to understand the adhesion between polyimides and inorganic materials. One of the major concerns in the application of polyimides is the integrity and reliability of the laminar structures. Surface sensitive spectroscopies have been recently applied to identify the nature of the chemical bond for metals evaporated onto cured polyimide surfaces and for spun-on and subsequently imidized polyamic acid films on metal surfaces. Depending on the preparation of the interface, e.g. metal on polymer or polymer on bulk metal, different phenomena are observed. (rh).
Download or read book Polymer Interface and Adhesion written by Wu and published by CRC Press. This book was released on 1982-03-31 with total page 654 pages. Available in PDF, EPUB and Kindle. Book excerpt: Poly mer Interface and Adhesion provides the critical basis for further advancement in thisfield. Combining the principles of interfacial science, rheology, stress analysis, and fracturemechanics, the book teaches a new approach to the analysis of long standing problemssuch as: how is the interface formed; what are its physical and mechanical properties;and how does the interface modify the stress field and fracture strength of the material.The book offers many outstanding features, including extensive listings of pertinent references, exhaustive tabulations of the interfacial properties of polymers, critical reviews ofthe many conflicting theories, and complete discussions of coupling agents, adhesion promotion, and surface modifications. Emphasis is placed on physical concepts and mechanisms, using clear, understandable mathematics.Polymer Interface and Adhesion promotes a more thorough understanding of the physical, mechanical, and adhesive properties of multiphase, polymer systems. Polymer scientistsand engineers, surface chemists, materials scientists, rheologists, as well as chemical andmechanical engineers interested in the research, development or industrial applications ofpolymers, plastics, fibers, coatings, adhesives, and composites need this important newsource b
Download or read book Fundamentals of Adhesion written by L.H. Lee and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polyimides and other high temperature polymers written by K. L. Mittal and published by VSP. This book was released on 2001-06-18 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume chronicles the proceedings of the International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, November 29 – December 1, 1999. Polyimides constitute an important class of materials because of their many desirable traits, for example: low dielectric constant, high breakdown voltage, good planarization, wear resistance, radiation resistance, inertness to solvents, good adhesion properties, good hydrolytic stability, low thermal expansion, long-term stability and excellent mechanical properties.This volume contains a total of 21 papers, all rigorously peer reviewed and revised before inclusion, addressing many aspects and new developments in polyimides and other high temperature polymers. The book is divided into two parts: “Synthesis, Properties and Bulk Characterization†and “ Interfacial or Adhesion Aspects and Applicationsâ€. The topics covered include: structure-property relationships in polyimides; photochemistry and photophysics of polyimides; thermal and UV laser pyrolyses of polyimides; residual stress evaluation in polyimides; synthesis and characterization of a variety of polyimides; high Tg polyimide; fluorinated polyimides; highly oriented polyimide films; high-temperature aromatic copolymer thermosets; shape-memory polymers; polyimides as liquid crystal alignment layers; surface properties of polyimides; metal-containing polyimides for optoelectronic applications; polyimide L-B films; polyimides coated with copper sulfide; carbon fiber/polyimide composites; and simulations of the polyimide/silica interface.This volume offers a wealth of information and represents current commentary on the R&D activity taking place in the technologically highly important field of polyimides and other high temperature polymers and is of value and interest to anyone interested in the fundamental or applied aspects of this topic.
Download or read book Adhesion Science and Engineering written by and published by Elsevier. This book was released on 2002-11-14 with total page 2020 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Adhesion shows that adhesion science and technology is inherently an interdisciplinary field, requiring fundamental understanding of mechanics, surfaces, and materials. This volume comprises 19 chapters. Starting with a background and introduction to stress transfer principles; fracture mechanics and singularities; and an energy approach to debonding, the volume continues with analysis of structural lap and butt joint configurations. It then continues with discussions of test methods for strength and constitutive properties; fracture; peel; coatings, the case of adhesion to a single substrate; elastomeric adhesives such as sealants. The role of mechanics in determining the locus of failure in bonded joints is discussed, followed by a chapter on rheology relevant to adhesives and sealants. Pressure sensitive adhesive performance; the principles of tack and tack measurements; and contact mechanics relevant to wetting and surface energy measurements are then covered. The volume concludes with sections on fibermatrix bonding and reinforcement; durability considerations for adhesive bonds; ultrasonic non-destructive evaluation of adhesive bonds; and design of adhesive bonds from a strength perspective. This book will be of interest to practitioners in the fields of engineering and to those with an interest in adhesion science.
Download or read book Efects of Crystallization and Interdiffusion on the Interfacial Adhesion Between Semicrystalline Polymers written by Chieh-Tsung Lo and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
Download or read book Polymer Adhesion written by Vladimir Leontʹevich Vakula and published by Prentice Hall. This book was released on 1991 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Very Good,No Highlights or Markup,all pages are intact.
Download or read book Transducers 01 Eurosensors XV written by Ernst Obermeier and published by Springer. This book was released on 2016-05-12 with total page 1763 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.
Download or read book Handbook of Adhesion written by D. E. Packham and published by John Wiley & Sons. This book was released on 2006-02-08 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second edition of the successful Handbook of Adhesion provides concise and authoritative articles covering many aspects of the science and technology associated with adhesion and adhesives. It is intended to fill a gap between the necessarily simplified treatment of the student textbook and the full and thorough treatment of the research monograph and review article. The articles are structured in such a way, with internal cross-referencing and external literature references, that the reader can build up a broader and deeper understanding, as their needs require. This second edition includes many new articles covering developments which have risen in prominence in the intervening years, such as scanning probe techniques, the surface forces apparatus and the relation between adhesion and fractal surfaces. Advances in understanding polymer - polymer interdiffusion are reflected in articles drawing out the implications for adhesive bonding. In addition, articles derived from the earlier edition have been revised and updated where needed. Throughout the book there is a renewed emphasis on environmental implications of the use of adhesives and sealants. The scope of the Handbook, which features nearly 250 articles from over 60 authors, includes the background science - physics, chemistry and material science - and engineering, and also aspects of adhesion relevant to the use of adhesives, including topics such as: Sealants and mastics Paints and coatings Printing and composite materials Welding and autohesion Engineering design The Handbook of Adhesion is intended for scientists and engineers in both academia and industry, requiring an understanding of the various facets of adhesion.
