Download or read book Instructions for Plastic Encapsulated Microcircuit pem Selection Screening and Qualification written by National Aeronautics and Space Adm Nasa and published by Independently Published. This book was released on 2018-09-20 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of Plastic Encapsulated Microcircuits (PEMs) is permitted on NASA Goddard Space Flight Center (GSFC) spaceflight applications, provided each use is thoroughly evaluated for thermal, mechanical, and radiation implications of the specific application and found to meet mission requirements. PEMs shall be selected for their functional advantage and availability, not for cost saving; the steps necessary to ensure reliability usually negate any initial apparent cost advantage. A PEM shall not be substituted for a form, fit and functional equivalent, high reliability, hermetic device in spaceflight applications. Due to the rapid change in wafer-level designs typical of commercial parts and the unknown traceability between packaging lots and wafer lots, lot specific testing is required for PEMs, unless specifically excepted by the Mission Assurance Requirements (MAR) for the project. Lot specific qualification, screening, radiation hardness assurance analysis and/or testing, shall be consistent with the required reliability level as defined in the MAR. Developers proposing to use PEMs shall address the following items in their Performance Assurance Implementation Plan: source selection (manufacturers and distributors), storage conditions for all stages of use, packing, shipping and handling, electrostatic discharge (ESD), screening and qualification testing, derating, radiation hardness assurance, test house selection and control, data collection and retention.King, Terry and Teverovsky, Alexander and Leidecker, HenningGoddard Space Flight CenterENCAPSULATED MICROCIRCUITS; MICROELECTRONICS; WAFERS; MATERIALS SELECTION; MECHANICAL PROPERTIES; QUALITY CONTROL; EDUCATION; SEMICONDUCTOR DEVICES; MISSION PLANNING; SPACECRAFT INSTRUMENTS
Download or read book Pem Inst 001 written by National Aeronautics and Space Administration (NASA) and published by Createspace Independent Publishing Platform. This book was released on 2018-06-11 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt: Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect
Download or read book Pem Inst 001 written by Alexander Teverovsky and published by BiblioGov. This book was released on 2013-07 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt: The NASA Technical Reports Server (NTRS) houses half a million publications that are a valuable means of information to researchers, teachers, students, and the general public. These documents are all aerospace related with much scientific and technical information created or funded by NASA. Some types of documents include conference papers, research reports, meeting papers, journal articles and more. This is one of those documents.
Download or read book Instructions for Plastic Encapsulated Microcircuit Selection Screening and Qualification written by Terry King and published by BiblioGov. This book was released on 2013-08 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of Plastic Encapsulated Microcircuits (PEMs) is permitted on NASA Goddard Space Flight Center (GSFC) spaceflight applications, provided each use is thoroughly evaluated for thermal, mechanical, and radiation implications of the specific application and found to meet mission requirements. PEMs shall be selected for their functional advantage and availability, not for cost saving; the steps necessary to ensure reliability usually negate any initial apparent cost advantage. A PEM shall not be substituted for a form, fit and functional equivalent, high reliability, hermetic device in spaceflight applications. Due to the rapid change in wafer-level designs typical of commercial parts and the unknown traceability between packaging lots and wafer lots, lot specific testing is required for PEMs, unless specifically excepted by the Mission Assurance Requirements (MAR) for the project. Lot specific qualification, screening, radiation hardness assurance analysis and/or testing, shall be consistent with the required reliability level as defined in the MAR. Developers proposing to use PEMs shall address the following items in their Performance Assurance Implementation Plan: source selection (manufacturers and distributors), storage conditions for all stages of use, packing, shipping and handling, electrostatic discharge (ESD), screening and qualification testing, derating, radiation hardness assurance, test house selection and control, data collection and retention.
Download or read book Reliable Application of Plastic Encapsulated Microcircuits RAC Parts Seclection Application and Control Series written by and published by . This book was released on 1996 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report summarizes and analyzes the issues relating to Plastic Encapsulated Microcircuit (PEM) Reliability. Included is: (1) discussion of current research efforts within the government and industry, (2) failure modes and mechanisms associated with PEMs, (3) test data on PEMs subjected to HAST, life test, Autoclave, high temperature storage, 85 deg C/85%RH tests, (4) field reliability data, (5) analysis of both test data and field data, (6) a reliability assessment model derived from the data and (7) conclusions regarding the selection and applications of PEMs.
Download or read book Requirements for Plastic Encapsulated Microcircuits in Space Applications written by CE-12 Solid State Devices and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments. This document defines the requirements for screening, qualification and lot acceptance testing for use of plastic encapsulated microcircuits (PEMs) in space flight applications. The level of testing on PEMs should be dependent on a risk based approach, the application, reliability and radiation requirements of the mission. It shall be the responsibility of the user to have the tests conducted using the requirements specified herein. Reporting procedures shall be documented on how the tests are conducted and results obtained. This document addresses many of the concerns associated with PEMs such as narrower operating temperature ranges and greater susceptibility to infant mortality and moisture absorption than space grade products.
Download or read book The Test and Launch Control Technology for Launch Vehicles written by Zhengyu Song and published by Springer. This book was released on 2018-04-19 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents technologies and solutions related to the test and launch control of rockets and other vehicles, and offers the first comprehensive and systematic introduction to the contributions of the Chinese Long March (Chang Zheng in Chinese, or abbreviated as CZ) rockets in this field. Moreover, it discusses the role of this technology in responsive, reliable, and economical access to space, which is essential for the competitiveness of rockets. The need for rapid development of the aerospace industry for both governmental and commercial projects is addressed. This book is a valuable reference resource for practitioners, and many examples and resources are included, not only from Chinese rockets but also from many other vehicles. It covers guidelines, technologies, and solutions on testing and launch control before rocket takeoff, covering equipment-level testing, system-level testing, simulation tests, etc.
Download or read book Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications written by CE-12 Solid State Devices and published by . This book was released on 2018 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This SAE Aerospace Standard (AS) documents and establishes common industry practices, and screening and qualification testing, of Plastic Encapsulated Microcircuits (PEMs) for use in military and avionics application environments. This document provides requirements for screening and qualification for use of plastic encapsulated microcircuits (PEMs) in military and avionics applications. The level of testing on PEMs depends on the application and reliability requirements of the system allocated to the PEMs. It is the responsibility of the user to assure compliance with the requirements specified herein, or to assure that any tailoring of requirements meets the end application requirements. This document addresses many of the concerns associated with PEM construction and manufacturing, primarily the non-hermetic packaging and the supply chain situation of multiple material sets and assembly sites.The approach to establishing PEM reliability defined herein leverages several existing industry standards, including AEC Q100, JESD47, MSFC-STD-3012, and SAE SSB-1.
Download or read book Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military Aerospace and Other Rugged Applications written by CE-12 Solid State Devices and published by . This book was released on 2020 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments. This document is intended to provide guidance for Using Plastic Encapsulated Microcircuits and Semiconductors (PEMs) in Military, Aerospace, and other rugged applications. This document addesses the various qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in military and aerospace applications. The users can use this document to evaluate the potential suitability of a PEM product or the manufacturer for its intended application. SSB-1 Rev D has been updated from SSB-1 Rev C to take into account the comments from various CE-12 members. The changes from SSB-1 Rev C to SSB-1 Rev D are shown in Appendix A: (informative) Differences between SSB-1 Rev C and SSB-1 Rev D.
Download or read book Plastic Encapsulated Microcircuit Reliability and Cost Effectiveness Study written by and published by . This book was released on 1996 with total page 15 pages. Available in PDF, EPUB and Kindle. Book excerpt: This study evaluates the reliability and cost-effectiveness of using commercial plastic-encapsulated microcircuits (PEM) in a typical military system, with a view to increasing their acceptability in military applications. The cost comparison indicates an average 6-fold decrease in cost when commercial devices are used. Assurance testing did not reveal any special problems with commercial parts. Thus, if commercial PEM were proven to be sufficiently reliable for an intended military application, large cost savings would be gained by using them instead of hermetic packages. The 4.5 sigma enhanced inspection program and the process-control methods suggested here would enhance the manufacturing yield of the PLGR (precision lightweight global positioning system receiver) by encouraging improvements in the manufacturing process while simultaneously cutting the cost of a 100% rescreen to qualify the final product. Neither the requirements assurance tests (including the step-stress test-analyze-and-fix test), nor the reliability demonstration test, nor the operational test, showed more failures than are typical for any new development, and no problems unique to PEM were observed. Thus, the use of PEM did not lead to any special problems that caused PLGR-use specifications to be violated.
Download or read book Reliable Application of Plastic Encapsulated Microcircuits RAC Parts Seclection Application and Control Series written by William Denson and published by . This book was released on 1996 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: This report summarizes and analyzes the issues relating to Plastic Encapsulated Microcircuit (PEM) Reliability. Included is: (1) discussion of current research efforts within the government and industry, (2) failure modes and mechanisms associated with PEMs, (3) test data on PEMs subjected to HAST, life test, Autoclave, high temperature storage, 85 deg C/85%RH tests, (4) field reliability data, (5) analysis of both test data and field data, (6) a reliability assessment model derived from the data and (7) conclusions regarding the selection and applications of PEMs.
Download or read book Army written by and published by . This book was released on 1994 with total page 1146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Commerce Business Daily written by and published by . This book was released on 1999-03 with total page 2040 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plastic Packaging of Microelectronic Devices written by Louis T. Manzione and published by Van Nostrand Reinhold Company. This book was released on 1990 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NUREG CR written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encapsulation Technologies for Electronic Applications written by Haleh Ardebili and published by William Andrew. This book was released on 2018-10-23 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
