Download or read book IEEE Transactions on Components Packaging and Manufacturing Technology written by and published by . This book was released on 1998 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Contributions from the First IEEE International Symposium on Polymeric Electronics Packaging written by James E. Morris and published by . This book was released on 1998 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book NIST Serial Holdings written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2002 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Contributions from the Third Topical Meeting on Electrical Performance of Electronic Packaging written by John L. Prince and published by . This book was released on 1996 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Contributions from the 4th Topical Meeting on Electrical Performance of Electronic Packaging written by Alina Deutsch and published by . This book was released on 1996 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronic Packaging written by and published by . This book was released on 1981 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Encyclopedia of Packaging Materials Processes and Mechanics written by Avram Bar-Cohen and published by World Scientific. This book was released on 2019 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories. The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications"--Publisher's website

Download or read book Parts Selection and Management written by Michael Pecht and published by John Wiley & Sons. This book was released on 2005-03-11 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial-if not more-to a company's success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available; many have failed when a technology was not effectively selected and managed. Parts Selection and Management is a guide to increasing company profitability and reducing the time-to-profit through the efficient management of the process of parts selection and management. Taking an "eyes-on, hands-off" approach to parts selection, this guidebook addresses risk-assessment, decision-making steps, and subsequent management activities. The book covers everything from methodologies for parts selection and management, product requirements and specifications, and manufacturer assessment procedures to ways to track part changes through the supply chain, reliability assessment, and environmental, legislative, and legal issues. Written by a seasoned professional, teacher, and author in the field, the book enables companies to: * Employ effective risk assessment and mitigation techniques * Make an informed company-wide decision about parts selection and management * Choose parts to fit the functionality of the product and other constraints * Maximize system supportability by preparing for parts obsolescence * Improve supply-chain interactions and communications with customers and regulatory agencies to minimize time-to-profit Shedding light on a neglected but essential aspect of product development, Parts Selection and Management will give your organization the tools you need to avoid the risks associated with product use while promoting flexibility, innovation, and creativity in your product development.

Download or read book Fast Simulation of Electro Thermal MEMS written by Tamara Bechtold and published by Springer Science & Business Media. This book was released on 2006-11-01 with total page 185 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.

Download or read book Phosphorus Acids Advances in Research and Application 2012 Edition written by and published by ScholarlyEditions. This book was released on 2012-12-26 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt: Phosphorus Acids—Advances in Research and Application: 2012 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Phosphorus Acids. The editors have built Phosphorus Acids—Advances in Research and Application: 2012 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Phosphorus Acids in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Phosphorus Acids—Advances in Research and Application: 2012 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Download or read book Advancing MCM Technologies written by Evan E. Davidson and published by . This book was released on 1994 with total page 66 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book High Temperature Polymer Dielectrics written by Jun-Wei Zha and published by John Wiley & Sons. This book was released on 2024-01-24 with total page 405 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a complete overview of the state-of-the-art high temperature polymer dielectrics, with a focus on fundamental background and recent advances.

Download or read book Flexible Wearable and Stretchable Electronics written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2020-11-19 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Remarkable progress has been achieved within recent years in developing flexible, wearable, and stretchable (FWS) electronics. These electronics will play an increasingly significant role in the future of electronics and will open new product paradigms that conventional semiconductors are not capable of. This is because flexible electronics will allow us to build flexible circuits and devices on a substrate that can be bent, stretched, or folded without losing functionality. This revolutionary change will impact how we interact with the world around us. Future electronic devices will use flexible electronics as part of ambient intelligence and ubiquitous computing for many different applications such as consumer electronics, medical, healthcare, and security devices. Thus, these devices have the potential to create a huge market all over the world. Flexible, Wearable, and Stretchable Electronics, provide a comprehensive technological review of the state-of-the-art developments in FWS electronics. This book offers the reader a taste of what is possible with FWS electronics and describes how these electronics can provide unique solutions for a wide variety of applications. Furthermore, the book introduces and explains new applications of flexible technology that has opened up the future of FWS electronics.

Download or read book Hybrid Electric Vehicles written by Chris Mi and published by John Wiley & Sons. This book was released on 2017-11-29 with total page 597 pages. Available in PDF, EPUB and Kindle. Book excerpt: The latest developments in the field of hybrid electric vehicles Hybrid Electric Vehicles provides an introduction to hybrid vehicles, which include purely electric, hybrid electric, hybrid hydraulic, fuel cell vehicles, plug-in hybrid electric, and off-road hybrid vehicular systems. It focuses on the power and propulsion systems for these vehicles, including issues related to power and energy management. Other topics covered include hybrid vs. pure electric, HEV system architecture (including plug-in & charging control and hydraulic), off-road and other industrial utility vehicles, safety and EMC, storage technologies, vehicular power and energy management, diagnostics and prognostics, and electromechanical vibration issues. Hybrid Electric Vehicles, Second Edition is a comprehensively updated new edition with four new chapters covering recent advances in hybrid vehicle technology. New areas covered include battery modelling, charger design, and wireless charging. Substantial details have also been included on the architecture of hybrid excavators in the chapter related to special hybrid vehicles. Also included is a chapter providing an overview of hybrid vehicle technology, which offers a perspective on the current debate on sustainability and the environmental impact of hybrid and electric vehicle technology. Completely updated with new chapters Covers recent developments, breakthroughs, and technologies, including new drive topologies Explains HEV fundamentals and applications Offers a holistic perspective on vehicle electrification Hybrid Electric Vehicles: Principles and Applications with Practical Perspectives, Second Edition is a great resource for researchers and practitioners in the automotive industry, as well as for graduate students in automotive engineering.

Download or read book Surface Electromagnetics written by Fan Yang and published by Cambridge University Press. This book was released on 2019-06-20 with total page 489 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by the leading experts in the field, this text provides systematic coverage of the theory, physics, functional designs, and engineering applications of advanced engineered electromagnetic surfaces. All the essential topics are included, from the fundamental theorems of surface electromagnetics, to analytical models, general sheet transmission conditions (GSTC), metasurface synthesis, and quasi-periodic analysis. A plethora of examples throughout illustrate the practical applications of surface electromagnetics, including gap waveguides, modulated metasurface antennas, transmit arrays, microwave imaging, cloaking, and orbital angular momentum (OAM ) beam generation, allowing readers to develop their own surface electromagnetics-based devices and systems. Enabling a fully comprehensive understanding of surface electromagnetics, this is an invaluable text for researchers, practising engineers and students working in electromagnetics antennas, metasurfaces and optics.

Download or read book Noise Coupling in System on Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.