Download or read book High Performance CMOS SOI Gbps Millimeter Wave Transceivers Phased Arrays and Switching Networks written by Yang Yang and published by . This book was released on 2018 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the CMOS process technology progress, transistor can achieve up to 260 GHz ft and fmax referenced to the top metal, it makes possible to develop lower cost circuits and blocks for THz high speed implementations such as active imagine system, short distance chip to chip communication systems and large scale high speed ultra low power switch networks. The dissertation shows an 8x1 phased array transmitter working at 370-410 GHz with peak EIRP of 8.5 dBm, a QPSK modulated 20 Gbit/s transceiver front end (including modulator, voltage control oscillator, power splitter, doubler, mixer and wide-band baseband amplifier.) at 155 GHz and two cross connected high peed ultra low power switch matrices (an 8x8 matrix up to 25 Gbit/s matrix and a 16x16 matrix built using four 8x8 matrix). All circuits and blocks are built using the Global Foundries 45 nm CMOS SOI (silicon on isotropic) process.

Download or read book Design of Wideband Millimeter Wave Beamformers and Transceivers in Advanced CMOS SOI Technology written by Li Gao and published by . This book was released on 2020 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the development of wireless communications, high data rate is becoming essential since it not only augments the current wireless systems but also enables many emerging applications. In order to achieve multi-gigabit-per-second data rates, the fifth generation communication system (5G) is moving forward to the millimeter-wave band, such as 24-29 GHz and 37-42 GHz. Since the frequency is more than 10 times than the current communication protocols, the wavelength is 10 times smaller, which makes the transmission line effects more notable and increases the design complexity. Moreover, the path loss is much larger and therefore a higher output power or antenna EIRP (effective isotropic radiated power) is required to overcome this loss. Previous millimeter-wave 5G research focused on narrow band, such as 28 GHz and 39 GHz. But if a single system can be wideband and include all of these bands, the simultaneous data rate can be increased and the system cost can be reduced. The research projects in this dissertation, in consequence, focus on different wideband RF ICs, and include power amplifiers (PA), low noise amplifiers (LNA), wideband phased-array receivers with high single-sideband rejection, wideband IQ receivers and wideband front-end circuits including phase-shifters and variable gain amplifiers. All of these circuits were done in advanced CMOS SOI technologies. The thesis concludes with a list of future work to be done in this area.

Download or read book Millimeter Wave Digitally Intensive Frequency Generation in CMOS written by Wanghua Wu and published by Academic Press. This book was released on 2015-09-23 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the digitally intensive time-domain architectures and techniques applied to millimeter-wave frequency synthesis, with the objective of improving performance and reducing the cost of implementation. Coverage includes system architecture, system level modeling, critical building block design, and digital calibration techniques, making it highly suitable for those who want to learn about mm-wave frequency generation for communication and radar applications, integrated circuit implementation, and time-domain circuit and system techniques. Highlights the challenges of frequency synthesis at mm-wave band using CMOS technology Compares the various approaches for mm-wave frequency generation (pros and cons) Introduces the digitally intensive synthesizer approach and its advantages Discusses the proper partitioning of the digitally intensive mm-wave frequency synthesizer into mm-wave, RF, analog, digital and software components Provides detailed design techniques from system level to circuit level Addresses system modeling, simulation techniques, design-for-test, and layout issues Demonstrates the use of time-domain techniques for high-performance mm-wave frequency synthesis

Download or read book Transceiver Technologies for Millimeter Wave Beam Steering Applications Band 71 written by Yi-Fan Tsao and published by Cuvillier Verlag. This book was released on 2022-11-08 with total page 147 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.

Download or read book Packaged X band Phased Arrays and High Data Rate Switching Matrices in Advanced CMOS Processes written by Donghyup Shin and published by . This book was released on 2013 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis explores two areas in RF integrated circuits. The first area of work is X-band phased-array design in CMOS technology. A receiver and a transmitter chip is designed, fabricated, measured on-wafer, and then packaged on printed-circuit boards using chip-on-board technique and in QFN modules to verify the reliable operation of silicon chip after packaging. The high-linearity four-element phased-array receiver for 9-10 GHz application is built using 0.13-[mu]m CMOS process with a single-ended design, and it results in a measured gain of 10 dB, an input P1dB 12.5 dBm, and a noise figure of 3.4 dB at 9.5 GHz. An rms gain error of 0.4 dB and phase error of 8° are obtained at 9-10 GHz using an integrated variable gain amplifier and an 11° phase trim bit. The 4-element X-band transmitter chip is also developed in 0.13-[mu]m CMOS technology. The design contains an active 1:4 power divider, active 5-bit phase shifters (lowest bit is used as a trim bit), 4-bit gain control (to reduce the rms gain error), and power amplifiers capable of delivering a PSAT of 13.5 dBm per channel at 8.5-10.5 GHz. The chip can be used in the linear mode for communication systems and in the saturated mode for FMCW radar systems. Packaging based on chip-on-board and QFN modules have been implemented, and both show a very small nearest neighbor coupling of ~-30 dB at 8-10 GHz, limited by bond-wire coupling. The second area of work is the switching matrices for high data-rate networking. Two generation of design is implemented and the first-generation is the 0.01-8-GHz 4×4 switch matrix in 0.13-[mu]m CMOS technology. A deep n-well series-shunt-series switch is chosen as the switching core, and the transistor sizes are optimized for low insertion loss and high isolation up to 8 GHz. A full electromagnetic analysis is performed on the switching core to result in a compact design with high isolation. The 4×4 switch matrix shows a measured insertion loss of 2.0-3.3 dB and an isolation of 50-44 dB at 2-8 GHz with near-zero power consumption. The measured input P1dB and IP3 are 8-10 and 26-30 dBm at 0.5-8 GHz. The switching matrix has very low dispersion with 6-ps group-delay variation and can switch a 12.5-Gb/s signal with a bit error rate of 10e-12. The second-generation switching matrix is implemented using IBM 45-nm SOI CMOS process, which offers advanced switch performance. The design is focused on the optical/digital wideband signal networking, and therefore optimization is done to maximize the bandwidth and minimize the added jitter after switching. A cross-point architecture with passive CMOS switch is used to achieve switching with near-zero power consumption. Scalability of all-passive design is maximized by introducing isolation switches placed after every 2×2 switching cells. An inductive-peaking buffers are used on passive-active design in order to further increase the bandwidth of the matrix. The measured 3-dB bandwidth of all-passive and passive-active design are 20-25 GHz and 26.5 GHz (measurement limit), with very low group delay variation of ±5 and ±2 psec, respectively. The eye-diagram measurement shows that all-passive design can transfer signals up to 30-Gbps and passive-active design can achieve up to 44-Gbps of data-rate. The scalability of passive-active design ensures constant 3-dB bandwidth up to more than 12×12 matrix.

Download or read book Digitally Assisted Fully Integrated Wideband Transmitters for High Speed Millimeter Wave Wireless Communication Links written by David del Rio and published by Springer. This book was released on 2018-07-07 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents design methods and considerations for digitally-assisted wideband millimeter-wave transmitters. It addresses comprehensively both RF design and digital implementation simultaneously, in order to design energy- and cost-efficient high-performance transmitters for mm-wave high-speed communications. It covers the complete design flow, from link budget assessment to the transistor-level design of different RF front-end blocks, such as mixers and power amplifiers, presenting different alternatives and discussing the existing trade-offs. The authors also analyze the effect of the imperfections of these blocks in the overall performance, while describing techniques to correct and compensate for them digitally. Well-known techniques are revisited, and some new ones are described, giving examples of their applications and proving them in real integrated circuits.

Download or read book Low power High efficiency and High linearity CMOS Millimeter wave Circuits and Transceivers for Wireless Communications written by Eric A. Juntunen and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation presents the design and implementation of circuits and transceivers in CMOS technology to enable many new millimeter-wave applications. A simple approach is presented for accurately modeling the millimeter-wave characteristics of transistors that are not fully captured by contemporary parasitic extraction techniques. Next, the integration of a low-power 60-GHz CMOS on-off keying (OOK) receiver in 90-nm CMOS for use in multi-gigabit per second wireless communications is demonstrated. The use of non-coherent OOK demodulation by a novel demodulator enabled a data throughput of 3.5 Gbps and resulted in the lowest power budget (31pJ/bit) for integrated 60-GHz CMOS OOK receivers at the time of publication. Also presented is the design of a high-power, high-efficiency 45-GHz VCO in 45-nm SOI CMOS. The design is a class-E power amplifier placed in a positive feedback configuration. This circuit achieves the highest reported output power (8.2 dBm) and efficiency (15.64%) to date for monolithic silicon-based millimeter-wave VCOs. Results are provided for the standalone VCO as well as after packaging in a liquid crystal polymer (LCP) substrate. In addition, a high-power high-efficiency (5.2 dBm/6.1%) injection locked oscillator is presented. Finally, the design of a 2-channel 45-GHz vector modulator in 45-nm SOI CMOS for LINC transmitters is presented. A zero-power passive IQ generation network and a low-power Gilbert cell modulator are used to enable continuous 360° vector generation. The IC is packaged with a Wilkinson power combiner on LCP and driven by external DACs to demonstrate the first ever 16-QAM generated by outphasing modulation in CMOS in the Q-band.

Download or read book Millimeter wave Phased array Transmitter in CMOS written by Wei Liat Chan and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power and Area Optimization Techniques for Ultra wideband Millimeter wave CMOS Transceivers written by Venumadhav Bhagavatula and published by . This book was released on 2013 with total page 127 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past decade, opportunities for utilizing the broadband spectrum available at millimeter-wave (mm-wave) frequencies has motivated research on both short and long-range, highly-integrated complementary metal oxide semiconductor (CMOS) transceivers. Prototype mm-wave CMOS transceivers have been demonstrated for application in high-speed data transfer (57-64 GHz), wireless back-haul (71-76 GHz), automotive radar (77GHz) and medical imaging (90 GHz) systems. However, in spite of promising results, large scale deployment of mm-wave CMOS transceivers in portable and hand-held electronics is currently hindered by front-end power-consumptions on the order of several watts. Moreover, as a first order approximation, power consumption is directly proportional to system bandwidth. Therefore, as the bandwidth requirements of systems increase, the challenge with on-chip power consumption will become increasingly difficult to solve. In this dissertation, techniques for optimizing the power and area of ultra-wideband millimeter-wave transceivers are described. This work resulted in the fabrication of three mm-wave integrated circuits (IC), all of which were realized in a 6-metal layer 40-nm CMOS process. The first IC is a multi-stage transformer-feedback based 11-to-13 GHz direct-conversion receiver. The device achieves a 16% fractional-bandwidth, a peak power-gain of 27.6dB, and noise-figure of 5.3dB while consuming 28.8mW from a 0.9V supply. Second, a compact 24-54GHz 2-stage bandpass distributed amplifier utilizing mirror-symmetric Norton transformations to reduce inductor component values allowing efficient layout to occupy an active area of 0.15mm2. The device has a 77% fractional-bandwidth, an overall gain of 6.3dB, a minimum in-band IIP3 of 11dBm, while consuming 34mA from a 1V supply. The third, and the IC which includes the most integration among the three, is an ultra-broadband single-element heterodyne receiver intended for use in low-power phased-array systems. The receiver maintains 17GHz of bandwidth from the mm-wave front end, through a high-IF stage, and to the baseband output. The device occupies 1.2mm2 and exploits properties of gain-equalized transformers throughout the signal path to achieve an overall 17GHz bandwidth 20dB gain with a flat in-band response, 7.8dB DSB NF, and a P[subscript-1dB] of -24dBm, while consuming 104mW off a 1.1V supply.

Download or read book Millimeter Wave Terahertz Circuits and Systems for Wireless Communication written by Siva Viswanathan Thyagarajan and published by . This book was released on 2014 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ubiquitous use of electronic devices has led to an explosive increase in the amount of data transfer across the globe. Several applications such as media sharing, cloud computing, Internet of things (IoT), big-data applications demand high performance interconnects to achieve high data rate communication. The mm-wave/terahertz band offers several gigahertz of spectrum for high data rate communication applications. This thesis explores millimeter-wave/terahertz circuits and terahertz systems for various applications in CMOS technology. Some of them include links for personal area networks, wireless backhauls, chip to chip communication (short-range) links in form factor constrained devices (wireless in a box) and also for long-range high-speed communication (using phased arrays or lenses). In particular, this research explores the feasibility of millimeter-wave/terahertz systems and also the performance of critical blocks such as power amplifiers. A linear power amplifier is designed in a deeply scaled technology node (28 nm) and the various challenges in the design process are discussed. The performance is validated using measurement results and compared across various technology nodes. Non-linear millimeter-wave switching power amplifiers are also explored due to their high efficiencies and a prototype is fabricated to verify the modeling and simulation results. The ideas and modeling strategies from the individual blocks are used in the design of mm-wave/terahertz transceivers. Simple modulation schemes such as on-off keying, binary phase shift keying and quadrature phase shift keying are used for transmission of data. Two transceiver prototypes with different transmitter and receiver architectures are fabricated in bulk CMOS technology. The system level considerations and architecture choices are discussed. Theoretical analysis of critical blocks with design choices are explained along with their implementation details. The system level measurements from the two transceivers confirm the feasibility of such links at millimeter-wave/terahertz frequencies. The work from this thesis demonstrates the world's first fully functional link at frequencies greater than 200 GHz in CMOS technology.

Download or read book Electronically Reconfigurable Circuits for Millimeter Wave and Beyond written by Tissana Kijsanayotin and published by . This book was released on 2015 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Efficiency Improvement Techniques for Millimeter Wave Transmitters written by Narek Rostomyan and published by . This book was released on 2018 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt: Strong demand for mm-wave high data-rate links in emerging 5G communication systems has resulted in substantial interest in mm-wave silicon (Si) based radio front-ends. The efficiency of the PA is a significant factor in the overall power dissipation and thermal management of mm-wave transceivers which have arrays with a large number of antennas (RF channels). This dissertation focused mainly on circuit design techniques for cm/mm-wave CMOS power amplifier efficiency improvement at frequencies from 15 GHz to 28 GHz. In addition, a DSP based solution is proposed to increase efficiency and performance of cellular (LTE band) transmitters in the 1-3 GHz frequency range. For digital communication signals with multi-carrier modulation and high peak-to-average power ratios (PAPRs), high back-off efficiency of the PA is of significant importance. In the first part of the dissertation, possible implementations of linear and efficiency-enhanced CMOS PAs are described. The concept of stacking multiple FETs is applied in the design of symmetric and asymmetric Doherty power amplifiers, as well as compact linear PAs. The dissertation demonstrates that high power density can be achieved with PAs based on 4-stack power devices, while 2-stack devices can be designed to have exceptionally high efficiency due to lower losses. A two stage, high power Doherty PA that uses 4-stack devices in the final stages is demonstrated with more than 25 dBm output power and 25% back-off power added efficiency (PAE) at 6 dB back-off operating in the 15 GHz band. To minimize chip area, the Doherty combiner is based on an optimized, lumped element 90 degrees phase shifter. To overcome the inherent non-linear gain response of Doherty PAs and to minimize the complexity of digital pre-distortion (DPD) due to large channel bandwidth at mm-wave bands, a simple RF domain analog pre-distorter is demonstrated for the first time. Various compact, linear 2-stack PAs are demonstrated based nMOS and pMOS FETs for saturated output powers in the range of 20 dBm in the Ka-band. Performance and reliability advantages of pMOS based PAs are shown. Also, by using inter-node impedance tuning with a shunt feedback drain-source capacitor, the PAE of the 2-stack PAs is increased even further, resulting in world record 46% PAE for the pMOS PA at 26.5 GHz. Due to high passive losses in CMOS, achieving high efficiency Doherty PAs requires careful design and non-conventional synthesis methodology for the Doherty combiner. A high efficiency, symmetric Doherty PA for the Ka-band that is based on efficient 2-stack power devices and a low loss Doherty combiner synthesis technique is presented. At 6 dB back-off, the PAE exceeds 28% which corresponds to 1.4x higher PAE than achievable with ideal class B back-off from peak PAE. Such high efficiency is attained due to low combiner losses of 0.5 dB, which is less than half of what can be achieved with a conventional Doherty combiner. Furthermore, an asymmetric Doherty PA is reported that is based on low loss output Doherty combiner and uses a 2-stack cell in the main path and a 4-stack cell in the peaking path, thus improving efficiency at more than 6 dB back-off and achieving high output power. In addition, a compact modeling approach for large, parasitic-extracted PA transistors is presented, which considerably reduces simulation time and accelerates developments of CMOS PAs. A typical time-division duplex (TDD) transmit/receive (T/R) mm-wave front-end comprises a power amplifier, a low noise amplifier (LNA), an antenna switch, and appropriate passive matching and combining networks. In this thesis, a synthesis methodology is proposed that minimizes the overall losses by combining the PA output and the LNA input matching networks together with the T/R switch into one network. The technique improves mm-wave transceiver performance in terms of PA efficiency and LNA noise figure (NF). The proposed T/R combiner can achieve high linearity and can handle large PA output voltage swings. The architecture can be implemented in any process which provides high integration capability. A Ka-band implementation is demonstrated in CMOS SOI that includes a high power, 4-stack based PA and an inductively source degenerated, cascode based LNA. Within the front-end, the PA achieves saturated output power of 23.6 dBm with peak PAE of 28%, while the LNA achieves NF of 3.2 dB. Finally, in frequency division duplex (FDD) systems, spurious emissions from the transmitter (TX) can fall onto the receive (RX) band and lead to significant receiver desensitization. This dissertation proposes a DSP based solution that relies on a linear auxiliary receiver to cancel the RX band noise from the received signal. This technique allows reduction of duplexer rejection requirements in the RX band, and reduction of insertion loss in the TX band, thus, resulting in high PA efficiency and smaller duplexer footprint. PA architectures that inherently have high receive band noise (envelop tracking and digital PAs) can substantially benefit from this technique. More than 22 dB improvement in the signal to noise ratio (SNR) is shown without the presence of desired signal at the antenna.

Download or read book Integrated 60GHz RF Beamforming in CMOS written by Yikun Yu and published by Springer Science & Business Media. This book was released on 2011-01-06 with total page 123 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated 60GHz RF Beamforming in CMOS describes new concepts and design techniques that can be used for 60GHz phased array systems. First, general trends and challenges in low-cost high data-rate 60GHz wireless system are studied, and the phased array technique is introduced to improve the system performance. Second, the system requirements of phase shifters are analyzed, and different phased array architectures are compared. Third, the design and implementation of 60GHz passive and active phase shifters in a CMOS technology are presented. Fourth, the integration of 60GHz phase shifters with other key building blocks such as low noise amplifiers and power amplifiers are described in detail. Finally, this book describes the integration of a 60GHz CMOS amplifier and an antenna in a printed circuit-board (PCB) package.

Download or read book CMOS Mm wave Transceivers for Gbps Wireless Communication Project Supported in Part by the National Natural Science Foundation of China No 61331003 written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Abstract: The challenges in the design of CMOS millimeter-wave (mm-wave) transceiver for Gbps wireless communication are discussed. To support the Gbps data rate, the link bandwidth of the receiver/transmitter must be wide enough, which puts a lot of pressure on the mm-wave front-end as well as on the baseband circuit. This paper discusses the effects of the limited link bandwidth on the transceiver system performance and overviews the bandwidth expansion techniques for mm-wave amplifiers and IF programmable gain amplifier. Furthermore, dual-mode power amplifier (PA) and self-healing technique are introduced to improve the PA's average efficiency and to deal with the process, voltage, and temperature variation issue, respectively. Several fully-integrated CMOS mm-wave transceivers are also presented to give a short overview on the state-of-the-art mm-wave transceivers.

Download or read book Millimeter Wave Wireless Communications written by Theodore S. Rappaport and published by Pearson Education. This book was released on 2015 with total page 705 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Definitive, Comprehensive Guide to Cutting-Edge Millimeter Wave Wireless Design “This is a great book on mmWave systems that covers many aspects of the technology targeted for beginners all the way to the advanced users. The authors are some of the most credible scholars I know of who are well respected by the industry. I highly recommend studying this book in detail.” —Ali Sadri, Ph.D., Sr. Director, Intel Corporation, MCG mmWave Standards and Advanced Technologies Millimeter wave (mmWave) is today's breakthrough frontier for emerging wireless mobile cellular networks, wireless local area networks, personal area networks, and vehicular communications. In the near future, mmWave products, systems, theories, and devices will come together to deliver mobile data rates thousands of times faster than today's existing cellular and WiFi networks. In Millimeter Wave Wireless Communications, four of the field's pioneers draw on their immense experience as researchers, entrepreneurs, inventors, and consultants, empowering engineers at all levels to succeed with mmWave. They deliver exceptionally clear and useful guidance for newcomers, as well as the first complete desk reference for design experts. The authors explain mmWave signal propagation, mmWave circuit design, antenna designs, communication theory, and current standards (including IEEE 802.15.3c, Wireless HD, and ECMA/WiMedia). They cover comprehensive mmWave wireless design issues, for 60 GHz and other mmWave bands, from channel to antenna to receiver, introducing emerging design techniques that will be invaluable for research engineers in both industry and academia. Topics include Fundamentals: communication theory, channel propagation, circuits, antennas, architectures, capabilities, and applications Digital communication: baseband signal/channel models, modulation, equalization, error control coding, multiple input multiple output (MIMO) principles, and hardware architectures Radio wave propagation characteristics: indoor and outdoor applications Antennas/antenna arrays, including on-chip and in-package antennas, fabrication, and packaging Analog circuit design: mmWave transistors, fabrication, and transceiver design approaches Baseband circuit design: multi–gigabit-per-second, high-fidelity DAC and ADC converters Physical layer: algorithmic choices, design considerations, and impairment solutions; and how to overcome clipping, quantization, and nonlinearity Higher-layer design: beam adaptation protocols, relaying, multimedia transmission, and multiband considerations 60 GHz standardization: IEEE 802.15.3c for WPAN, Wireless HD, ECMA-387, IEEE 802.11ad, Wireless Gigabit Alliance (WiGig)

Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Download or read book 2021 IEEE Radio Frequency Integrated Circuits Symposium RFIC written by IEEE Staff and published by . This book was released on 2021-06-07 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation