Download or read book High Frequency Characterization and Modeling of On chip Interconnects and RF IC Wire Bonds written by Xiaoning Qi and published by . This book was released on 2001 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Interconnect Technology and Design for Gigascale Integration written by Jeffrey A. Davis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
Download or read book Characterization and Modeling of On chip Interconnects for Silicon RFIC Design written by Beng Hwee Ong and published by . This book was released on 2005 with total page 70 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High frequency Characterization and Modeling of High resistivity IC Interconnect written by Orlando Bell and published by . This book was released on 1991 with total page 90 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliable RF Power Amplifier Design Based on a Partitioning Design Approach written by Rui Ma and published by kassel university press GmbH. This book was released on 2010 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: Front cover -- Titelseite -- Impressum -- Acknowledgments -- Contents -- List of Abbreviations and Acronyms -- Abstract -- Zusammenfassung -- Chapter 1 Introduction -- 1.1 Principle of the Partitioning Design Approach -- 1.2 Dissertation Organization -- Chapter 2 Investigation of Planar-Interconnection -- 2.1 Active Chip Device Interconnection -- 2.1.1 Die Attach -- 2.1.2 Wire Bonding Pad-To-Microstrip -- 2.2 Microstrip-to-Microstrip Interconnection -- 2.2.1 Soldering -- 2.2.2 Multi-Wire Bonding -- 2.2.3 Copper Ribbon -- 2.2.4 Silver- Painting -- Chapter 3 Analysis and Modeling of Passive SMD Components -- 3.1 SMD Resistor -- 3.2 SMD Capacitor -- 3.3 SMD Inductor -- Chapter 4 Modeling of AlGaAs/GaAs HEMT Chip Device -- 4.1 AIGaAs/GaGa HEMT Chip -- 4.2 Modeling Approach Overview -- 4.3 Small-Signal Modeling -- 4.3.1 Extrinsic Parameter Extraction -- 4.3.2 Intrinsic Parameter Extraction -- 4.4 Large-Signal Modeling -- 4.4.1 Gate Current and Charge Models -- 4.4.2 Drain Current Model -- 4.4.3 Model Verification -- Chapter 5 Demonstrator Design of a Class-AB Power Amplifier Following -- 5.1 Micro-Packaged Device Characterization -- 5.1.1 Small-Signal Performance -- 5.1.2 Large-Signal Performance -- 5.2 Bias Network Design -- 5.2.1 Drain Bias Network -- 5.2.2 Gate Bias Network -- 5.3 Matching Network Design -- 5.3.1 Matching Impedance Determination -- 5.4 Power Amplifier Performance Evaluation -- 5.4.1 Small-Signal Performance -- 5.4.2 Large-Signal Performance -- Chapter 6 Conclusions and Outlook -- Appendix -- Appendix A THLR In-Fixture Calibration -- Appendix B Precise Determination of Substrate Permittivity -- Appendix C Schematic Circuit of the Designed Power Amplifier Demonstrator -- Appendix D Power Amplifier Design Following the Conventional Design Approach -- References -- Back cover
Download or read book American Doctoral Dissertations written by and published by . This book was released on 2001 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Development of Sub mm Wave Flip Chip Interconnect written by Sirinpa Monayakul and published by Cuvillier Verlag. This book was released on 2016-12-13 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the increasing availability of MMICs at high frequencies beyond 100 GHz low-loss interconnects for module fabrication become essential. This work presents the results of the flip-chip interconnects approach exhibiting bandwidths from 220 GHz up to 500 GHz. Flip-chip transitions in this study were fabricated based on simulated 3D models in three different topologies: coplanar-to-coplanar, stripline-to-coplanar, and stripline-to-stripline. The interconnects were realized with 10 µm-diameter AuSn microbumps. After the flip-chip mounting, scattering parameter measurements were performed to characterize the interconnect quality. The results suggest that the flip-chip technology is currently the most suitable technology for the high frequency range.
Download or read book Interconnect Analysis and Synthesis written by Chung-Kuan Cheng and published by Wiley-Interscience. This book was released on 2000 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Download or read book Modeling and Design Optimization of Multi GHz IC Interconnects written by Xuejue Huang and published by . This book was released on 2002 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Characterisation Modelling and Design of Bond Wire Interconnects for Chip Package Co Design Insertion Loss dB written by and published by . This book was released on 2003 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This work is a comprehensive experimental investigation of chip to package wirebond interconnects for chip-package co-design. Wirebonds are interconnect bottlenecks in RF design, but are difficult to avoid due to their low cost and manufacturing ease. We have shown measurements on wirebonds in coplanar configuration with different return paths and also the cross coupling. We have also extracted lumped and distributed models and demonstrate the excellent agreement with measurements atleast upto 15GHz. We have proposed multi-wirebonds as a potential solution for better impedance matching. Different types of inductors with Q-factors of upto 100 have also been illustrated. We show influence of encapsulant on wirebonds and finally we also demonstrate a methodology to extract the time-domain response from S-parameters.
Download or read book Analysis of IC Interconnects Using High Frequency Modeling Techniques written by Marc E. Goldfarb and published by . This book was released on 1981 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High frequency On chip Interconnect Characterization and Measurement written by Yu Zheng and published by . This book was released on 2003 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Full wave Modeling and Characterization of High Frequency Interconnect in Layered Medium written by Chung-Chi Huang and published by . This book was released on 2003 with total page 316 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Annual Commencement written by Stanford University and published by . This book was released on 2000 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fundamentals of Electromigration Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Download or read book Foundations for Microstrip Circuit Design written by Terry C. Edwards and published by John Wiley & Sons. This book was released on 2016-02-01 with total page 688 pages. Available in PDF, EPUB and Kindle. Book excerpt: Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
