Download or read book Heat transfer in electronic equipment Papers 1983 written by and published by . This book was released on 1983 with total page 77 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer in Electronic Equipment 1983 written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1983 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer in Electronic Equipment 1983 written by S. Oktay and published by . This book was released on 1983 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer in Electronic Equipment 1983 written by ASME. Heat Transfer Division. K-12 Committee on Aircraft and Astronautical Heat Transfer and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer in Electronic Equipment 1983 written by S. Oktay and published by . This book was released on 1983 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer in Electronic Equipment 1983 written by ASME. Heat Transfer Division. K-12 Committee on Aircraft and Astronautical Heat Transfer and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer in Electronic Equipment 1991 written by A. Ortega and published by . This book was released on 1991 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Heat Transfer written by and published by Academic Press. This book was released on 1990-03-08 with total page 411 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer
Download or read book Heat Transfer in Miniaturized Electronic Equipment written by Cornell Aeronautical Laboratory and published by . This book was released on 1955 with total page 102 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer Equipment Design written by R. K. Shah and published by CRC Press. This book was released on 1988-07-01 with total page 1104 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 1998-02-28 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 2011-06-27 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Download or read book Heat Transfer in Electronic Equipment 1986 written by Avram Bar-Cohen and published by . This book was released on 1986 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer Handbook written by Adrian Bejan and published by John Wiley & Sons. This book was released on 2003-06-30 with total page 1496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
Download or read book Heat Transfer in Electronic Equipment 1985 written by S. Oktay and published by . This book was released on 1985 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt:
