Download or read book Heat and Power Management for High performance Integrated Circuits microform written by Arman Vassighi and published by Library and Archives Canada = Bibliothèque et Archives Canada. This book was released on 2004 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer. This book was released on 2008-11-01 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Download or read book Heat Management in Integrated Circuits written by Seda Ogrenci-Memik and published by IET. This book was released on 2015-12 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Download or read book High Performance Energy Efficient Microprocessor Design written by Vojin G. Oklobdzija and published by Springer Science & Business Media. This book was released on 2007-04-27 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by the world’s most prominent microprocessor design leaders from industry and academia, this book provides complete coverage of all aspects of complex microprocessor design: technology, power management, clocking, high-performance architecture, design methodologies, memory and I/O design, computer aided design, testing and design for testability. The chapters provide state-of-the-art knowledge while including sufficient tutorial material to bring non-experts up to speed. A useful companion to design engineers working in related areas.

Download or read book Design of High current and High speed Semiconductor Devices for Power Integrated Circuits Applications microform written by Philip Kwok Tai Mok and published by National Library of Canada = Bibliothèque nationale du Canada. This book was released on 1995 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer. This book was released on 2008-11-01 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Download or read book Differential Common gate Techniques for High Performance Power Management Integrated Circuits written by Yat Hei Lam and published by . This book was released on 2008 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book High performance Power aware Physical Designs for Nanometer scale Integrated Circuits written by Chan-Seok Hwang and published by . This book was released on 2006 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Monthly Catalogue United States Public Documents written by and published by . This book was released on 1991-07 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 1038 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Monthly Catalog of United States Government Publications written by and published by . This book was released on 1994 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Integrated Power thermal Management Circuits and Techniques for Next generation System on chips written by Chen Zheng and published by . This book was released on 2012 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: All the power/thermal management systems have been fabricated and tested successfully to demonstrate the techniques proposed in this research. The measurement results show good performance in both steady state and transient times with high efficiency and effective noise suppression. The proposed techniques are thus evidently suitable for next-generation SoCs.

Download or read book Scalable Package level Power Management for 2 5D Integrated Circuits written by Kramer Kyle Straube and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: With the end of Moore's Law and Dennard scaling becoming increasingly evident, the move to 2.5D integrated designs present new challenges for package-level power management. One of the power management limitations is the number of package power pins allocated for power. Utilizing these pins more efficiently with a dynamic power management design enables higher performance without any additional allocated pins. In this thesis, I design and present Constant Average Power Processing (CAPP) which provides a power management architecture focused on optimizing the performance of a system under a power limit. CAPP is designed to scale to multi-die systems, control the power at sufficiently fast speeds for the power limit requirements, and efficiently control heterogeneous systems. I validate the behavior of this design using circuit simulations and measure its capabilities on CPU-based, GPU-based and heterogeneous systems. This approach achieves average speedups of 15.9% for the CPU-based design, 12% for the GPU-based design, and 21% for the heterogeneous design by using excess available power throughout operation to improve performance. Based on the results found in this thesis, CAPP provides a novel power management design that can support future 2.5D integrated systems and maximize the performance under a power limit.

Download or read book Design and Implementation of the Current mode Power Management Integrated Circuits with High Speed Adaptive Controlling Techniques written by 吳冠儀 and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Thermal Management of Three dimensional Integrated Circuits Using Inter layer Liquid Cooling written by Calvin R. King (Jr) and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat removal technologies are among the most critical needs for three-dimensional (3D) stacking of high-performance microprocessors. This research reports a 3D integration platform that can support the heat removal requirements for 3D integrated circuits that contain high-performance microprocessors in the 3D stack. :This work shows the use of wafer-level batch fabrication to develop advanced electrical and fluidic three-dimensional interconnect networks in a 3D stack. Fabrication results are shown for the integration of microchannels and electrical through-silicon vias (TSVs). A compact physical model is developed to determine the design trade-offs for microchannel heat sink and electrical TSV integration. An experimental thermal measurement test-bed for evaluating a 3D inter-layer liquid cooling platform is developed. Experimental thermal testing results for an air-cooled chip and a liquid-cooled chip are compared. Microchannel heat sink cooling shows a significant junction temperature and heat sink thermal resistance reduction compared to air-cooling. The on-chip integrated microchannel heat sink, which has a thermal resistance of 0.229 °C/W, enables cooling of>100W/cm2 of each high-power density chip, while maintaining an average junction temperature of less than 50°C. Cooling liquid is circulated through the 3D stack (two layers) at flow rates of up to 100 ml/min. :The ability to assemble chips with integrated electrical and fluidic I/Os and seal fluidic interconnections at each strata interface is demonstrated using three assembly and fluidic sealing techniques. Assembly results show the stacking of up to four chips that contain integrated electrical and fluidic I/O interconnects, with an electrical I/O density of ~1600/cm2.

Download or read book Interlayer Thermal Management of High Performance Microprocessor Chip Stacks written by Thomas Brunschwiler and published by Cuvillier Verlag. This book was released on 2012-04-12 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt: Vertical integration of integrated circuit dies offers tremendous opportunities from an architectural as well as from an economical standpoint. Memory proximity supports performance scaling, and might enable significant energy savings. Partitioning of the corresponding functionalities and technologies into individual tiers can improve yield and modularity substantially. The paradigm change of stacking active components has a direct impact on heat-removal concepts and is therefore the motivation of this thesis. A stack comprised of a single logic layer in combination with multiple memory dies was identified as the limit for traditional back-side heat removal. To minimize junction temperatures, a stacking sequence with the high heat-flux component in close proximity to the cold plate is proposed. Interlayer cooling is the only volumetric heat-removal solution that scales with the number of dies in the stack. Hence, the focus of this thesis has been to identify the potential of interlayer cooling and to provide a modeling framework. Fundamental heat-transfer building blocks, such as unit-cell geometries, fluid structure modulation, fluid focusing, as well as four-port fluid delivery supporting power-map-aware heat removal, are discussed. Moreover, the theoretical foundation was experimentally validated on resistively heated convective test cavities. Therefore, specific bonding and insulation schemes were developed. Finally, the interlayer cooling performance was demonstrated on a pyramid chip stack. A multi-scale modeling approach for the efficient design of non-uniform heat-removal cavities was proposed. Periodic arrangements of heat-removal unit-cells in the cavities are described by the porousmedia approximation. Their characteristics are represented by the directional and velocity-dependent modified permeability and convective thermal resistance. An extended tensor description was developed to map the pressure gradient to the DARCY velocity. These parameters were derived from detailed numerical heat and mass transport modeling for arbitrary angle-of-attack of the fluid, using a set of novel routines that support periodic hydrodynamic and thermal boundary conditions. For pin-fin arrays, a biased fluid flow towards directions with maximal permeability could be observed. Fieldcoupling between the two-dimensional porous and adjacent three-dimensional solid domains was performed to derive the temperature field in the chip stack, including heat spreading in the silicon die. The modeling results are conservative and deviate less than 20% from the measured junction temperatures, when considering the temperature dependency of the coolant viscosity. This is a very good value considering the immense complexity reduction, resulting in a low computational time of less than 20 min on a desktop computer, to derive the mass transport and junction temperatures within a chip stack. Sputtered AuSn 80/20 was investigated as eutectic thin-film bond to form leak-tight interfaces with mechanical, electrical, and thermal functionality, as part of the technology development, to enable the use of water as coolant. The resulting bond quality was characterized for various underbump metallizations, atmospheres, and reflow/force profiles. The implementation of a differential pumped chamber allowed the use of formic acid in the flip chip bonder to reduce the tin oxide on the solder surface. The transient liquid-solid nature of the thin-film solder process explains the sensitivity on the underbump metallization and the heat ramp. Finally, processing guidelines supporting the design of leak-tight bond interfaces were summarized. Acceptable intermetallic compound formation was achieved at heat ramps of 100 K/min and with chromium as wetting layer. A bondline thickness of 4μm and a Teflon support provided sufficient compliance to form successful bonds considering the wedge errors of the flip chip bonder. Waterproof, two-level metallizations to mimic processor-like, non-uniform power maps with background and hot-spot heaters were developed for the implementation of single- and multi-cavity test sections. Pin-hole-free dielectric layers (1μm PECVD Si3N4 / 100nm ALD Al2O3) were achieved by conformal thin-film deposition. Numerous heat transfer assessments yielded the following insights: The limited heat capacity and flow rate of the coolant were identified as the major contributor to the thermal gradient in convective interlayer heat removal, even when water using as coolant. This is due to the small hydraulic diameter defined by the interconnect density (pitches 200 μm) and the length of the cross-flow heat exchange cavity ( 10 mm). The circular pin-fin in-line unit-cell was identified as the optimal heat transfer geometry for heat capacity limited cross-flow heat transfer. It results in the highest porosity, beneficial for efficient mass transport, compared with microchannels and other pin shapes at a given minimal radius constraint. Improved convective heat transfer towards the outlet of the cavities caused by transient vortex shedding was observed at increased REYNOLDS numbers ( 100) in the pin-fin in-line case. Fluid cavities with four-port fluid delivery and heat removal geometry modulation need to be considered for chip stacks larger than 2 cm2 and a interconnect pitch of  50 μm. Their effectiveness was demonstrated with cavities that were either partially fully or half populated with pin-fin arrays. These arrangements result in a significant increase in local fluid flow compared with uniform heat transfer cavities. Microchannels have proved to dissipate heat efficiently to multiple fluid cavities in the chip stack because of the improved die-to-die coupling, caused by the 50% fin fill factor. This is advantageous for disparate tier stacking. The high-power die can benefit from heat dissipation into cavities adjacent to low-power tiers. Additional recommendations, critical for electro-thermal co-design, are also discussed: i) Heat spreading in the silicon helps to mitigate hot-spots below a critical spatial dimension of 1mm. ii) High heat flux macros should be placed towards the fluid inlet and die corners if the two- or four-port configuration is implemented, respectively. iii) A manifold width of 1mm should be considered to achieve a fluid maldistribution below 1% between the fluid cavities. iv) A 1.6 ms thermal time constant was derived for an interlayer cooled chip stack. Hence, predictive cooling-loop control schemes need to be implemented to account for the comparable high pump time constant. Finally, for the first time, the superiority of interlayer cooling as a volumetric heat-removal method could be experimentally demonstrated on the pyramid chip stack test vehicle with four fluid cavities and three power dissipating tiers. Aligned hot-spots were included with 250 W/cm2 heat flux each. A total power of 390 W, corresponding to a 3.9 kW/cm3 volumetric heat flow, could be dissipated on the 1 cm2 device at a 54.7 K junction temperature increase. In comparison, back-side cooling would result in a junction temperature increase of 223 K with respect to the fluid inlet temperature of the microchannel cold plate. Using the results of the present work, it is now possible to design and predict mass and heat transport in an interlayer cooled chip stack, with the support of the proposed best-practice design rules in combination with the validated multi-scale modeling framework. The scalable nature of interlayer cooling will enable “Extreme-3D-Integration” with computation in sugar cube form factor chip stacks, extending integration density and efficiency scaling beyond the “End-of-2D-Scaling”.