Download or read book Flow Boiling Heat Transfer in Narrow Vertical Channels written by Jianyun Shuai and published by Cuvillier Verlag. This book was released on 2004 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer and Fluid Flow in Minichannels and Microchannels written by Satish Kandlikar and published by Elsevier. This book was released on 2006 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: &Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Download or read book VDI Heat Atlas written by VDI Gesellschaft and published by Springer Science & Business Media. This book was released on 2010-07-21 with total page 1608 pages. Available in PDF, EPUB and Kindle. Book excerpt: For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.
Download or read book Flow Boiling Heat Transfer in Narrow Vertical Channels written by and published by Cuvillier Verlag. This book was released on 2004-10-14 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Saturated flow boiling heat transfer and flow visualization experiments were carried out in three vertical rectangular channels with dimensions (width×height) 2.0×4.0, 0.86×2.0 and 0.54×1.60 mm² (corresponding to hydraulic diameters 2.67, 1.20 and 0.81 mm, respectively). The channels were heated from three sides. Deionized water was used as the working fluid. The channel exit was at atmospheric pressure. Benchmark experiments of single-phase flow were also conducted for pressure drop and heat transfer. Experimental results show that for the 0.54×1.60 mm² channel, the singlephase friction factor is higher than predicted by well-accepted correlations, while for the other two channels it can be well correlated. The heat transfer performance for both laminar and turbulent regimes under asymmetric heating conditions is different from that under uniform heating conditions on which the existing correlations are based. Therefore single-phase heat transfer correlations were modified so that they could be incorporated into the two-phase heat transfer correlations employed for asymmetric heating conditions. For flow boiling, three basic flow patterns are observed for all the channels, viz., bubbly, slug and annular flow. However, based on the developed flow pattern maps, the transition from slug to annular flow for the 2.0×4.0 mm² channel occurs at a lower superficial vapor velocity than for the two small channels. This suggests that the nucleate boiling mechanism, which generally corresponds to slug flow, is more important for the two small channels. Saturated flow boiling heat transfer characteristics were investigated under different heat flux, mass flux and vapor quality. The experimental local heat transfer coefficient for the 2.0×4.0 mm² channel is in good agreement with the modified Kandlikar correlation and the Shah correlation. For the smaller channels (0.86×2.0 mm² and 0.54×1.60 mm²), the heat transfer characteristics are not dominated by the convective boiling mechanism. On the contrary, the nucleate boiling term of the Kandlikar correlation predicts the experimental heat transfer coefficient relatively well. Two new correlations have been developed in which the local two-phase heat transfer coefficient is related to the single-phase heat transfer coefficient by a twophase multiplier, which is a function of the Boiling number and thermodynamic vapor quality. The developed correlations show rather good agreement with experimental results.
Download or read book Energy Efficiency in Process Technology written by P.A. Pilavachi and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since 1975 the Commission has been stimulating R & D work aimed at energy saving. The conference objective was to provide an international forum for the presentation and discussion of recent R & D relevant to energy efficiency, taking into account environmental aspects, in the energy intensive process industries.
Download or read book Encyclopedia Of Thermal Packaging Set 1 Thermal Packaging Techniques A 6 volume Set written by and published by World Scientific. This book was released on 2012-09-25 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Download or read book Critical Heat Flux in Flow Boiling in Microchannels written by Sujoy Kumar Saha and published by Springer. This book was released on 2015-06-04 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,” by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.
Download or read book Convective Flow Boiling written by John C. Chen and published by CRC Press. This book was released on 2019-08-16 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises selected papers from the First International Conference on Convective Flow Boiling. The purpose of the conference is to examine state-of-science and recent developments in technology of flow boiling, i.e., boiling systems which are affected by convective flows.
Download or read book Fluid Flow Heat Transfer and Boiling in Micro Channels written by L. P. Yarin and published by Springer Science & Business Media. This book was released on 2008-09-19 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
Download or read book Innovative Materials for Processes in Energy Systems For Fuel Cells Heat Pumps and Sorption Systems written by and published by Research Publishing Service. This book was released on 2011 with total page 91 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microscale Heat Transfer Fundamentals and Applications written by S. Kakaç and published by Springer Science & Business Media. This book was released on 2006-05-20 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.
Download or read book Microchannel Phase Change Transport Phenomena written by Sujoy Kumar Saha and published by Butterworth-Heinemann. This book was released on 2015-09-27 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity. This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems. A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient. Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis. - Up-to-date information will help delineate further research direction in the microchannel heat transfer - The latest modeling information and recommendations will help in design method and purpose
Download or read book Advances in Two Phase Flow and Heat Transfer written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the past two decades, two-phase flow and heat transfer problems associated with two-phase phenomena have been a challenge to many investigators. Two-phase flow applications are found in a wide range of engineering systems, such as nuclear and conventional power plants, evaporators of refrigeration systems and a wide vari ety of evaporative and condensive heat exchangers in the chemical industry. This publication is based on the invited lectures presented at the NATO Advanced Research Workshop on the Advances in Two-Phase Flow and Heat Transfer. The Horkshop was attended by more than 50 leading scientists and practicing engineers who work actively on two-phase flow and heat transfer research and applications in dif ferent sectors (academia, government, industry) of member countries of NATO. Some scientific leaders and experts on the subject matter from the non-NATO countries were also invited. They convened to discuss the state-of-the-art in two-phase flow and heat transfer and formulated recommendations for future research directions. To achieve these goals, invited key papers and a limited number of contributions were presented and discussed. The specific aspects of the subject were treated in depth in the panel sessions, and the unresolved problems identified. Suitable as a practical reference, these volumes incorporate a systematic approach to two-phase flow analysis.
Download or read book Encyclopedia Of Thermal Packaging Set 2 Thermal Packaging Tools A 4 volume Set written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Download or read book First International Conference on Microchannels and Minichannels written by Satish G. Kandlikar and published by . This book was released on 2003 with total page 1026 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Nuclear Power Engineering written by Zhaoming Meng and published by Frontiers Media SA. This book was released on 2021-02-25 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt:
