Download or read book Fast Electromagnetic Simulation for Interconnects on High Speed Circuits written by Houfei Chen and published by . This book was released on 2002 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Performance Computing for the Electromagnetic Modeling and Simulation of Interconnects written by National Aeronautics and Space Administration (NASA) and published by Createspace Independent Publishing Platform. This book was released on 2018-07-08 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt: The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance. Schutt-Aine, Jose E. Ames Research Center...
Download or read book Modeling and Simulation of High Speed VLSI Interconnects written by Michel S. Nakhla and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Download or read book Digital Signal Integrity written by Brian Young and published by Prentice Hall. This book was released on 2001 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt: State-of-the-art techniques for predicting and achieving target performance levels Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues Multiconductor interconnects: packages, sockets, connectors and buses Modal decomposition: understanding the outputs generated by commercial modeling software Layer peeling with time-domain reflectometry: its power and limitations Experimental techniques for characterizing interconnect parasitics In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.
Download or read book 2 D Electromagnetic Simulation of Passive Microstrip Circuits written by Alejandro D. Jimenez and published by CRC Press. This book was released on 2018-10-03 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Global Demand for Streamlined Design and Computation The explosion of wireless communications has generated a tidal wave of interest and development in computational techniques for electromagnetic simulation as well as the design and analysis of RF and microwave circuits. Learn About Emerging Disciplines, State-of-the-Art Methods 2-D Electromagnetic Simulation of Passive Microstrip Circuits describes this simple procedure in order to provide basic knowledge and practical insight into quotidian problems of microstrip passive circuits applied to microwave systems and digital technologies. The text dissects the latest emerging disciplines and methods of microwave circuit analysis, carefully balancing theory and state-of-the-art experimental concepts to elucidate the process of analyzing high-speed circuits. The author covers the newer techniques – such as the study of signal integrity within circuits, and the use of field map interpretations – employed in powerful electromagnetic simulation analysis methods. But why and how does the intrinsic two-dimensional simulation model used here reduce numerical error? Step-by-Step Simulation Provides Insight and Understanding The author presents the FDTD electromagnetic simulation method, used to reproduce different microstrip test circuits, as well as an explanation of the complementary electrostatic method of moments (MoM). Each reproduces different microstrip test circuits that are physically constructed and then studied, using a natural methodological progression to facilitate understanding. This approach gives readers a solid comprehension and insight into the theory and practical applications of the microstrip scenario, with emphasis on high-speed interconnection elements.
Download or read book Electromagnetic Modeling of High speed High frequency Interconnects written by Jong-Gwan Yook and published by . This book was released on 1996 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques written by Albert Ruehli and published by John Wiley & Sons. This book was released on 2017-05-25 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: Bridges the gap between electromagnetics and circuits by addressing electrometric modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book provides intuitive solutions to electromagnetic problems by using the Partial Element Equivalent Circuit (PEEC) method. This book begins with an introduction to circuit analysis techniques, laws, and frequency and time domain analyses. The authors also treat Maxwell's equations, capacitance computations, and inductance computations through the lens of the PEEC method. Next, readers learn to build PEEC models in various forms: equivalent circuit models, non-orthogonal PEEC models, skin-effect models, PEEC models for dielectrics, incident and radiate field models, and scattering PEEC models. The book concludes by considering issues like stability and passivity, and includes five appendices some with formulas for partial elements. Leads readers to the solution of a multitude of practical problems in the areas of signal and power integrity and electromagnetic interference Contains fundamentals, applications, and examples of the PEEC method Includes detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and developers who work on the physical layer modeling of IC interconnects and Packaging, PCBs, and high speed links.
Download or read book Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Download or read book Advances in Simulation of High speed Circuits and Interconnects written by Michel S. Nakhla and published by . This book was released on 2000 with total page 65 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Special Issue on Advances in Simulation of High speed Circuits and Interconnects written by Michel S. Nakhla and published by . This book was released on 2000 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromagnetics for High Speed Analog and Digital Communication Circuits written by Ali M. Niknejad and published by Cambridge University Press. This book was released on 2007-02-22 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern communications technology demands smaller, faster and more efficient circuits. This book reviews the fundamentals of electromagnetism in passive and active circuit elements, highlighting various effects and potential problems in designing a new circuit. The author begins with a review of the basics - the origin of resistance, capacitance, and inductance - then progresses to more advanced topics such as passive device design and layout, resonant circuits, impedance matching, high-speed switching circuits, and parasitic coupling and isolation techniques. Using examples and applications in RF and microwave systems, the author describes transmission lines, transformers, and distributed circuits. State-of-the-art developments in Si based broadband analog, RF, microwave, and mm-wave circuits are reviewed. With up-to-date results, techniques, practical examples, illustrations and worked examples, this book will be valuable to advanced undergraduate and graduate students of electrical engineering, and practitioners in the IC design industry. Further resources for this title are available at www.cambridge.org/9780521853507.
Download or read book Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Download or read book Compact Models and Measurement Techniques for High Speed Interconnects written by Rohit Sharma and published by Springer Science & Business Media. This book was released on 2012-02-17 with total page 81 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Download or read book Simulation Modeling and Electrical Design of High speed and High density Interconnects written by and published by . This book was released on 1992 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Nystrom Method in Electromagnetics written by Mei Song Tong and published by John Wiley & Sons. This book was released on 2020-06-29 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive, step-by-step reference to the Nyström Method for solving Electromagnetic problems using integral equations Computational electromagnetics studies the numerical methods or techniques that solve electromagnetic problems by computer programming. Currently, there are mainly three numerical methods for electromagnetic problems: the finite-difference time-domain (FDTD), finite element method (FEM), and integral equation methods (IEMs). In the IEMs, the method of moments (MoM) is the most widely used method, but much attention is being paid to the Nyström method as another IEM, because it possesses some unique merits which the MoM lacks. This book focuses on that method—providing information on everything that students and professionals working in the field need to know. Written by the top researchers in electromagnetics, this complete reference book is a consolidation of advances made in the use of the Nyström method for solving electromagnetic integral equations. It begins by introducing the fundamentals of the electromagnetic theory and computational electromagnetics, before proceeding to illustrate the advantages unique to the Nyström method through rigorous worked out examples and equations. Key topics include quadrature rules, singularity treatment techniques, applications to conducting and penetrable media, multiphysics electromagnetic problems, time-domain integral equations, inverse scattering problems and incorporation with multilevel fast multiple algorithm. Systematically introduces the fundamental principles, equations, and advantages of the Nyström method for solving electromagnetic problems Features the unique benefits of using the Nyström method through numerical comparisons with other numerical and analytical methods Covers a broad range of application examples that will point the way for future research The Nystrom Method in Electromagnetics is ideal for graduate students, senior undergraduates, and researchers studying engineering electromagnetics, computational methods, and applied mathematics. Practicing engineers and other industry professionals working in engineering electromagnetics and engineering mathematics will also find it to be incredibly helpful.
Download or read book Compact Models and Measurement Techniques for High Speed Interconnects written by Rohit Sharma and published by Springer Science & Business Media. This book was released on 2012-02-17 with total page 81 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Download or read book Principles and Techniques of Electromagnetic Compatibility written by Christos Christopoulos and published by CRC Press. This book was released on 2018-10-03 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuits are faster and more tightly packed than ever, wireless technologies increase the electromagnetic (EM) noise environment, new materials entail entirely new immunity issues, and new standards govern the field of electromagnetic compatibility (EMC). Maintaining the practical and comprehensive approach of its predecessor, Principles and Techniques of Electromagnetic Compatibility, Second Edition reflects these emerging challenges and new technologies introduced throughout the decade since the first edition appeared. What's new in the Second Edition? Characterization and testing for high-speed design of clock frequencies up to and above 6 GHz Updates to the regulatory framework governing EM compliance Additional coverage of the printed circuit board (PCB) environment as well as additional numerical tools An entirely new section devoted to new applications, including signal integrity, wireless and broadband technologies, EMC safety, and statistical EMC Added coverage of new materials such as nanomaterials, band gap devices, and composites Along with new and updated content, this edition also includes additional worked examples that demonstrate how estimates can guide the early stages of design. The focus remains on building a sound foundation on the fundamental concepts and linking this to practical applications, rather than supplying application-specific fixes that do not easily generalize to other areas.
