Download or read book Experimental and Numerical Investigation of the Thermomechanical Response of Reticles During the Optical Lithography Process written by Amr Yehia Abdo and published by . This book was released on 2003 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2004 with total page 772 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Annual Symposium on Photomask Technology written by and published by . This book was released on 2001 with total page 702 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonic Instrumentation Engineering written by Society of Photo-optical Instrumentation Engineers (United States) and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1995 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book EUV Sources for Lithography written by Vivek Bakshi and published by SPIE Press. This book was released on 2006 with total page 1104 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive volume, edited by a senior technical staff member at SEMATECH, is the authoritative reference book on EUV source technology. The volume contains 38 chapters contributed by leading researchers and suppliers in the EUV source field. Topics range from a state-of-the-art overview and in-depth explanation of EUV source requirements, to fundamental atomic data and theoretical models of EUV sources based on discharge-produced plasmas (DPP) and laser-produced plasmas, to a description of prominent DPP and LPP designs and other technologies for producing EUV radiation. Additional topics include EUV source metrology and components (collectors, electrodes), debris mitigation, and mechanisms of component erosion in EUV sources. The volume is intended to meet the needs of both practitioners of the technology and readers seeking an introduction to the subject.
Download or read book Mathematical Simulation in Glass Technology written by Dieter Krause and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first book on mathematical simulation on glass technology, and covers all production steps of special glass manufacturing. The enclosed CD-ROM shows 27 simulations of different aspects, such as surprising details of the pressing and casting process.
Download or read book Nanopositioning Technologies written by Changhai Ru and published by Springer. This book was released on 2015-12-22 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the state-of-the-art technologies for positioning with nanometer resolutions and accuracies, particularly those based on piezoelectric actuators and MEMS actuators. The latest advances are described, including the design of nanopositioning devices, sensing and actuation technologies and control methods for nanopositioning. This is an ideal book for mechanical and electrical engineering students and researchers; micro and nanotechnology researchers and graduate students; as well as those working in the precision instrumentation or semiconductor industries.
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Download or read book Piezoelectric MEMS Resonators written by Harmeet Bhugra and published by Springer. This book was released on 2017-01-09 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.
Download or read book Integrated Silicon Optoelectronics written by Horst Zimmermann and published by Springer. This book was released on 2009-10-03 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Silicon Optoelectronics synthesizes topics from optoelectronics and microelectronics. The book concentrates on silicon as the major base of modern semiconductor devices and circuits. Starting from the basics of optical emission and absorption, as well as from the device physics of photodetectors, the aspects of the integration of photodetectors in modern bipolar, CMOS, and BiCMOS technologies are discussed. Detailed descriptions of fabrication technologies and applications of optoelectronic integrated circuits are included. The book, furthermore, contains a review of the newest state of research on eagerly anticipated silicon light emitters. In order to cover the topics comprehensively, also included are integrated waveguides, gratings, and optoelectronic power devices. Numerous elaborate illustrations facilitate and enhance comprehension. This extended edition will be of value to engineers, physicists, and scientists in industry and at universities. The book is also recommended to graduate students specializing on microelectronics or optoelectronics.
Download or read book Three Dimensional Integrated Circuit Design written by Yuan Xie and published by Springer Science & Business Media. This book was released on 2009-12-02 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Download or read book Semiconductor Memories written by Ashok K. Sharma and published by Wiley-IEEE Press. This book was released on 2002-09-10 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor Memories provides in-depth coverage in the areas of design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods including. * Memory cell structures and fabrication technologies. * Application-specific memories and architectures. * Memory design, fault modeling and test algorithms, limitations, and trade-offs. * Space environment, radiation hardening process and design techniques, and radiation testing. * Memory stacks and multichip modules for gigabyte storage.
Download or read book Manufacturing Techniques for Microfabrication and Nanotechnology written by Marc J. Madou and published by CRC Press. This book was released on 2011-06-13 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designed for science and engineering students, this text focuses on emerging trends in processes for fabricating MEMS and NEMS devices. The book reviews different forms of lithography, subtractive material removal processes, and additive technologies. Both top-down and bottom-up fabrication processes are exhaustively covered and the merits of the different approaches are compared. Students can use this color volume as a guide to help establish the appropriate fabrication technique for any type of micro- or nano-machine.
Download or read book Intelligent Mechatronic Systems written by Rochdi Merzouki and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 960 pages. Available in PDF, EPUB and Kindle. Book excerpt: Acting as a support resource for practitioners and professionals looking to advance their understanding of complex mechatronic systems, Intelligent Mechatronic Systems explains their design and recent developments from first principles to practical applications. Detailed descriptions of the mathematical models of complex mechatronic systems, developed from fundamental physical relationships, are built on to develop innovative solutions with particular emphasis on physical model-based control strategies. Following a concurrent engineering approach, supported by industrial case studies, and drawing on the practical experience of the authors, Intelligent Mechatronic Systems covers range of topic and includes: An explanation of a common graphical tool for integrated design and its uses from modeling and simulation to the control synthesis Introductions to key concepts such as different means of achieving fault tolerance, robust overwhelming control and force and impedance control Dedicated chapters for advanced topics such as multibody dynamics and micro-electromechanical systems, vehicle mechatronic systems, robot kinematics and dynamics, space robotics and intelligent transportation systems Detailed discussion of cooperative environments and reconfigurable systems Intelligent Mechatronic Systems provides control, electrical and mechanical engineers and researchers in industrial automation with a means to design practical, functional and safe intelligent systems.
Download or read book Advances in Resist Technology and Processing IV written by M. J. Bowden and published by . This book was released on 1987 with total page 384 pages. Available in PDF, EPUB and Kindle. Book excerpt:
