Download or read book Flexible and Stretchable Electronics written by Run-Wei Li and published by CRC Press. This book was released on 2019-10-31 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the recently well developed areas of Internet of Thing, consumer wearable gadgets and artificial intelligence, flexible and stretchable electronic devices have spurred great amount of interest from both the global scientific and industrial communities. As an emerging technology, flexible and stretchable electronics requires the scale-span fabrication of devices involving nano-features, microstructures and macroscopic large area manufacturing. The key factor behind covers the organic, inorganic and nano materials that exhibit completely different mechanical and electrical properties, as well as the accurate interfacial control between these components. Based on the fusion of chemistry, physics, biology, materials science and information technology, this review volume will try to offer a timely and comprehensive overview on the flexible and stretchable electronic materials and devices. The book will cover the working principle, materials selection, device fabrication and applications of electronic components of transistors, solar cells, memories, sensors, supercapacitors, circuits and etc.

Download or read book Electronics Design Materials written by William Frederick Waller and published by Springer. This book was released on 1971-06-18 with total page 221 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electrical and Electronic Devices Circuits and Materials written by Suman Lata Tripathi and published by John Wiley & Sons. This book was released on 2021-03-24 with total page 608 pages. Available in PDF, EPUB and Kindle. Book excerpt: The increasing demand for electronic devices for private and industrial purposes lead designers and researchers to explore new electronic devices and circuits that can perform several tasks efficiently with low IC area and low power consumption. In addition, the increasing demand for portable devices intensifies the call from industry to design sensor elements, an efficient storage cell, and large capacity memory elements. Several industry-related issues have also forced a redesign of basic electronic components for certain specific applications. The researchers, designers, and students working in the area of electronic devices, circuits, and materials sometimesneed standard examples with certain specifications. This breakthrough work presents this knowledge of standard electronic device and circuit design analysis, including advanced technologies and materials. This outstanding new volume presents the basic concepts and fundamentals behind devices, circuits, and systems. It is a valuable reference for the veteran engineer and a learning tool for the student, the practicing engineer, or an engineer from another field crossing over into electrical engineering. It is a must-have for any library.

Download or read book Electronics Design Materials written by William F. Waller and published by MacMillan. This book was released on 1971-01-01 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Packaging written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.

Download or read book Reliability and Failure of Electronic Materials and Devices written by Milton Ohring and published by Academic Press. This book was released on 2014-10-14 with total page 759 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Download or read book Flexible Electronics From Materials To Devices written by Guozhen Shen and published by World Scientific. This book was released on 2016-04-27 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive overview of the recent development of flexible electronics. This is a fast evolving research field and tremendous progress has been made in the past decade. In this book, new material development and novel flexible device, circuit design, fabrication and characterizations will be introduced. Particularly, recent progress of nanomaterials, including carbon nanotubes, graphene, semiconductor nanowires, nanofibers, for flexible electronic applications, assembly of nanomaterials for large scale device and circuitry, flexible energy devices, such as solar cells and batteries, etc, will be introduced. And through reviewing these cutting edge research, the readers will be able to see the key advantages and challenges of flexible electronics both from material and device perspectives, as well as identify future directions of the field.

Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Download or read book Robust Electronic Design Reference Book written by John R. Barnes and published by Springer. This book was released on 2004-03-31 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements. Robust Electronic Design Reference Book is an electronics designer's reference library condensed into two volumes. It guides you through the entire process of: -Gathering user requirements. -Developing the design specification. -Partitioning the design into electronics, software, and other technologies. -Designing circuits for signal integrity, EMC, EMI, and ESD. -Choosing components and materials. -Reviewing the design. -Designing printed circuit boards, backplanes, and cables. -Bringing up prototypes. -Testing, characterizing, and refining your design. -Getting approvals. -Putting your product into production, or your equipment into service. Includes over 600 illustrations, nearly 200 tables, and an extensive Glossary and Index.

Download or read book Advanced Materials for Printed Flexible Electronics written by Colin Tong and published by Springer Nature. This book was released on 2021-10-04 with total page 641 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to printed flexible electronics and their applications, including the basics of modern printing technologies, printable inks, performance characterization, device design, modeling, and fabrication processes. A wide range of materials used for printed flexible electronics are also covered in depth. Bridging the gap between the creation of structure and function, printed flexible electronics have been explored for manufacturing of flexible, stretchable, wearable, and conformal electronics device with conventional, 3D, and hybrid printing technologies. Advanced materials such as polymers, ceramics, nanoparticles, 2D materials, and nanocomposites have enabled a wide variety of applications, such as transparent conductive films, thin film transistors, printable solar cells, flexible energy harvesting and storage devices, electroluminescent devices, and wearable sensors. This book provides students, researchers and engineers with the information to understand the current status and future trends in printed flexible electronics, and acquire skills for selecting and using materials and additive manufacturing processes in the design of printed flexible electronics.

Download or read book Electrical and Electronic Devices Circuits and Materials written by Suman Lata Tripathi and published by CRC Press. This book was released on 2021-03-16 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The increasing demand in home and industry for electronic devices has encouraged designers and researchers to investigate new devices and circuits using new materials that can perform several tasks efficiently with low IC (integrated circuit) area and low power consumption. Furthermore, the increasing demand for portable devices intensifies the search to design sensor elements, an efficient storage cell, and large-capacity memory elements. Electrical and Electronic Devices, Circuits and Materials: Design and Applications will assist the development of basic concepts and fundamentals behind devices, circuits, materials, and systems. This book will allow its readers to develop their understanding of new materials to improve device performance with even smaller dimensions and lower costs. Additionally, this book covers major challenges in MEMS (micro-electromechanical system)-based device and thin-film fabrication and characterization, including their applications in different fields such as sensors, actuators, and biomedical engineering. Key Features: Assists researchers working on devices and circuits to correlate their work with other requirements of advanced electronic systems. Offers guidance for application-oriented electrical and electronic device and circuit design for future energy-efficient systems. Encourages awareness of the international standards for electrical and electronic device and circuit design. Organized into 23 chapters, Electrical and Electronic Devices, Circuits and Materials: Design and Applications will create a foundation to generate new electrical and electronic devices and their applications. It will be of vital significance for students and researchers seeking to establish the key parameters for future work.

Download or read book High Temperature Electronics Design for Aero Engine Controls and Health Monitoring written by Lucian Stoica and published by CRC Press. This book was released on 2022-09-01 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.

Download or read book VLSI and Post CMOS Electronics written by Rohit Dhiman and published by Institution of Engineering and Technology. This book was released on 2019-09 with total page 369 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI, or Very-Large-Scale-Integration, is the practice of combining billions of transistors to create an integrated circuit. At present, VLSI circuits are realised using CMOS technology. However, the demand for ever smaller, more efficient circuits is now pushing the limits of CMOS. Post-CMOS refers to the possible future digital logic technologies beyond the CMOS scaling limits. This 2-volume set addresses the current state of the art in VLSI technologies and presents potential options for post-CMOS processes. VLSI and Post-CMOS Electronics is a useful reference guide for researchers, engineers and advanced students working in the area of design and modelling of VLSI and post-CMOS devices and their circuits. Volume 1 focuses on design, modelling and simulation, including applications in low voltage and low power VLSI, and post-CMOS devices and circuits. Volume 2 addresses a wide range of devices, circuits and interconnects.

Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages

Download or read book Introduction To Electronic Materials For Engineers An 2nd Edition written by Wei Gao and published by World Scientific Publishing Company. This book was released on 2011-05-16 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: An Introduction to Electronic Materials for Engineers aims to give a basic understanding and comprehensive overview of a wide range of materials, such as conducting materials, semiconductors, magnetic materials, optical materials, dielectric materials, superconductors, thermoelectric materials and ionic materials. The new chapters added into this latest edition include thin film electronic materials, organic electronic materials and nanostructured materials. These chapters aim to reflect the new developments made in electronic materials and nanotechnology research towards the design and fabrication of modern equipment and electronic devices.This book is designed for undergraduate engineering and technology students who have background knowledge of physics and chemistry, as well as for engineers who work on materials processing or application, or electric/electronic engineering.It emphasizes on the synthesis, performance and application of electronic materials and will enable readers to understand and relate to the devices and materials.

Download or read book Flexible and Stretchable Medical Devices written by Kuniharu Takei and published by John Wiley & Sons. This book was released on 2018-06-11 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book introduces flexible and stretchable wearable electronic systems and covers in detail the technologies and materials required for healthcare and medical applications. A team of excellent authors gives an overview of currently available flexible devices and thoroughly describes their physical mechanisms that enable sensing human conditions. In dedicated chapters, crucial components needed to realize flexible and wearable devices are discussed which include transistors and sensors and deal with memory, data handling and display. Additionally, suitable power sources based on photovoltaics, thermoelectric energy and supercapacitors are reviewed. A special chapter treats implantable flexible sensors for neural recording. The book editor concludes with a perspective on this rapidly developing field which is expected to have a great impact on healthcare in the 21st century.

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.