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EBookClubs

Read Books & Download eBooks Full Online

Book 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems

Download or read book 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2009 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book EPEPS

    Book Details:
  • Author : Institute of Electrical and Electronics Engineers
  • Publisher :
  • Release : 2017
  • ISBN :
  • Pages : 698 pages

Download or read book EPEPS written by Institute of Electrical and Electronics Engineers and published by . This book was released on 2017 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems  EPEPS

Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by Institute of Electrical and Electronics Engineers (New York, NY) and published by . This book was released on 2013-10-27 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Leonove

    Book Details:
  • Author :
  • Publisher :
  • Release : 1979
  • ISBN :
  • Pages : pages

Download or read book Leonove written by and published by . This book was released on 1979 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book EPEPS 2010

Download or read book EPEPS 2010 written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Electrical Design of Through Silicon Via

Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Book EPEPS 2020

Download or read book EPEPS 2020 written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Energy Science and Applied Technology

Download or read book Energy Science and Applied Technology written by Zhigang Fang and published by CRC Press. This book was released on 2015-11-17 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Science and Applied Technology includes contributions on a wide range of topics:- Technologies in geology, mining, oil and gas exploration and exploitation of deposits- Energy transfer and conversion, materials and chemical technologies- Environmental engineering and sustainable development- Electrical and electronic technology, power system