Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Power Electronics Handbook written by Muhammad H. Rashid and published by Elsevier. This book was released on 2023-09-27 with total page 1472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronics Handbook, Fifth Edition delivers an expert guide to power electronics and their applications. The book examines the foundations of power electronics, power semiconductor devices, and power converters, before reviewing a constellation of modern applications. Comprehensively updated throughout, this new edition features new sections addressing current practices for renewable energy storage, transmission, integration, and operation, as well as smart-grid security, intelligent energy, artificial intelligence, and machine learning applications applied to power electronics, and autonomous and electric vehicles. This handbook is aimed at practitioners and researchers undertaking projects requiring specialist design, analysis, installation, commissioning, and maintenance services. - Provides a fully comprehensive work addressing each aspect of power electronics in painstaking depth - Delivers a methodical technical presentation in over 1500 pages - Includes 50+ contributions prepared by leading experts - Offers practical support and guidance with detailed examples and applications for lab and field experimentation - Includes new technical sections on smart-grid security and intelligent energy, artificial intelligence, and machine learning applications applied to power electronics and autonomous and electric vehicles - Features new chapter level templates and a narrative progression to facilitate understanding
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Download or read book Practical Guide to the Packaging of Electronics written by Ali Jamnia and published by CRC Press. This book was released on 2016-12-01 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Download or read book Journal of Microelectronics and Electronic Packaging written by and published by . This book was released on 2004 with total page 690 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Download or read book Power Electronic Modules written by William W. Sheng and published by CRC Press. This book was released on 2004-09-29 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engine
Download or read book Innovations in Army Energy and Power Materials Technologies written by Edward C. Shaffer and published by Materials Research Forum LLC. This book was released on 2018-09-20 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium reports fundamental science and engineering advances of the US Army Research Labratory (ARL) within the area of Energy and Power technologies. Although, in general, ARL's Materials Research encompasses a broad range of materials technologies (e.g.: Photonics, Electronics, Biological and Bio-inspired Materials, Structural Materials, High Strain and Ballistic Materials, and Manufacturing Science), this publication specifically addresses selected energy and power material related work at ARL. While this work includes electrochemical energy storage (batteries and capacitors) and electrochemical energy conversion (fuel cells, photoelectrochemistry, and photochemistry), special emphasis is given on electrochemical energy storage: • Micro Electro-Mechanical Systems (MEMS): Power density, efficiency, and robustness of motors, generators, and actuators while also reducing their life cycle costs. • Energy Storage: Electrical and electrochemical energy storage devices to decrease device size, weight, and cost as well as increase their capabilities in extreme temperatures and operating conditions. • Power Control and Distribution: Tactical, deployable power systems using conventional fuels, alternative fuels, and energy harvested from renewable/ambient sources. • Power Generation/Energy Conversion: Smart energy networks for platforms, forward operating bases, and facilities using modeling and simulation tools as well as new, greater capability and efficiency components. • Thermal Transport and Control: Heat and higher power density systems, advanced components, system modeling, and adaptive or hybrid-cycle technologies. Keywords: Electrochemical Energy Storage, Batteries, Capacitors, Electrochemical Energy Conversion, Fuel Cells, Photoelectrochemistry, Photochemistry, High Voltage Electrolytes, Li-ion Batteries, Li-ion Chemistry, Lithium–Sulphur Batteries, Nuclear Metastables, Pyroelectric Energy Conversion, Charged Quantum Dots, High-Efficiency Photovoltaics, IR Sensing, GaN Power Schottky Diodes, Threshold-Voltage Instability, Reliability Testing, SiC MOSFETs, Power Electronics Packaging, High Voltage 4H-SiC GTOs, Silicon Carbide, Avalanche Breakdown Diode, SiC PiN Diodes, Thyristor Protection, Compact DC-DC Battery Chargers
Download or read book The Electrical Engineering Handbook written by Wai Kai Chen and published by Elsevier. This book was released on 2004-11-16 with total page 1227 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electrical Engineer's Handbook is an invaluable reference source for all practicing electrical engineers and students. Encompassing 79 chapters, this book is intended to enlighten and refresh knowledge of the practicing engineer or to help educate engineering students. This text will most likely be the engineer's first choice in looking for a solution; extensive, complete references to other sources are provided throughout. No other book has the breadth and depth of coverage available here. This is a must-have for all practitioners and students! The Electrical Engineer's Handbook provides the most up-to-date information in: Circuits and Networks, Electric Power Systems, Electronics, Computer-Aided Design and Optimization, VLSI Systems, Signal Processing, Digital Systems and Computer Engineering, Digital Communication and Communication Networks, Electromagnetics and Control and Systems.About the Editor-in-Chief...Wai-Kai Chen is Professor and Head Emeritus of the Department of Electrical Engineering and Computer Science at the University of Illinois at Chicago. He has extensive experience in education and industry and is very active professionally in the fields of circuits and systems. He was Editor-in-Chief of the IEEE Transactions on Circuits and Systems, Series I and II, President of the IEEE Circuits and Systems Society and is the Founding Editor and Editor-in-Chief of the Journal of Circuits, Systems and Computers. He is the recipient of the Golden Jubilee Medal, the Education Award, and the Meritorious Service Award from the IEEE Circuits and Systems Society, and the Third Millennium Medal from the IEEE. Professor Chen is a fellow of the IEEE and the American Association for the Advancement of Science.* 77 chapters encompass the entire field of electrical engineering.* THOUSANDS of valuable figures, tables, formulas, and definitions.* Extensive bibliographic references.
Download or read book Reliability of Power Electronic Converter Systems written by Henry Shu-hung Chung and published by IET. This book was released on 2015-12-07 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main aims of power electronic converter systems (PECS) are to control, convert, and condition electrical power flow from one form to another through the use of solid state electronics. This book outlines current research into the scientific modeling, experimentation, and remedial measures for advancing the reliability, availability, system robustness, and maintainability of PECS at different levels of complexity.
Download or read book Handbook of Automotive Power Electronics and Motor Drives written by Ali Emadi and published by CRC Press. This book was released on 2017-12-19 with total page 736 pages. Available in PDF, EPUB and Kindle. Book excerpt: Initially, the only electric loads encountered in an automobile were for lighting and the starter motor. Today, demands on performance, safety, emissions, comfort, convenience, entertainment, and communications have seen the working-in of seemingly innumerable advanced electronic devices. Consequently, vehicle electric systems require larger capacities and more complex configurations to deal with these demands. Covering applications in conventional, hybrid-electric, and electric vehicles, the Handbook of Automotive Power Electronics and Motor Drives provides a comprehensive reference for automotive electrical systems. This authoritative handbook features contributions from an outstanding international panel of experts from industry and academia, highlighting existing and emerging technologies. Divided into five parts, the Handbook of Automotive Power Electronics and Motor Drives offers an overview of automotive power systems, discusses semiconductor devices, sensors, and other components, explains different power electronic converters, examines electric machines and associated drives, and details various advanced electrical loads as well as battery technology for automobile applications. As we seek to answer the call for safer, more efficient, and lower-emission vehicles from regulators and consumer insistence on better performance, comfort, and entertainment, the technologies outlined in this book are vital for engineering advanced vehicles that will satisfy these criteria.
Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2018-10-03 with total page 2322 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the new millenium, Wai-Kai Chen introduced a monumental reference for the design, analysis, and prediction of VLSI circuits: The VLSI Handbook. Still a valuable tool for dealing with the most dynamic field in engineering, this second edition includes 13 sections comprising nearly 100 chapters focused on the key concepts, models, and equations. Written by a stellar international panel of expert contributors, this handbook is a reliable, comprehensive resource for real answers to practical problems. It emphasizes fundamental theory underlying professional applications and also reflects key areas of industrial and research focus. WHAT'S IN THE SECOND EDITION? Sections on... Low-power electronics and design VLSI signal processing Chapters on... CMOS fabrication Content-addressable memory Compound semiconductor RF circuits High-speed circuit design principles SiGe HBT technology Bipolar junction transistor amplifiers Performance modeling and analysis using SystemC Design languages, expanded from two chapters to twelve Testing of digital systems Structured for convenient navigation and loaded with practical solutions, The VLSI Handbook, Second Edition remains the first choice for answers to the problems and challenges faced daily in engineering practice.
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Silicon Photonics III written by Lorenzo Pavesi and published by Springer Science & Business Media. This book was released on 2016-01-08 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.
Download or read book Proceedings written by and published by . This book was released on 1998 with total page 1072 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NASA Reports Required by Congress written by United States. Congress. House. Committee on Science, Space, and Technology. Subcommittee on Space Science and Applications and published by . This book was released on 1990 with total page 1188 pages. Available in PDF, EPUB and Kindle. Book excerpt:
