Download or read book Electrical Characterization and Circuit Modeling of Interconnections and Packages for High Speed Circuits by Time Domain Measurements written by Jyh-ming Jong and published by . This book was released on 1995 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: With edge rates of high speed digital devices pushing into the sub-nano second range, interconnections with the associated packages play a major role in determining the speed, size and performance of digital circuits and systems. The purpose of this study is to develop experimental techniques based on time domain peeling algorithms (dynamic deconvolution) for accurate electrical characterization and circuit modeling of general interconnection structures. This thesis describes the basic principles and computational procedure of these time domain peeling algorithms, accompanied by many illustrations and examples of practical interconnection structures in high speed electronic packages. These include general single (isolated) interconnections with nonuniform cross section, general uniformly/ nonuniformly coupled interconnection structures with discontinuities, power/ ground systems with the associated parallel plane structures, resistive lossy interconnections in thin film single and multi-chip modules, and multilayer high-pin-count packages. It is shown that the distributed circuit models consisting of cascaded transmission line sections lead to an accurate evaluation of the time domain response of high speed interconnection structures. These distributed models are synthesized from the time domain reflection and transmission (TDRIT) measurements, and the impedance profiles of the distributed model are extracted by using scattering matrix-based peeling algorithms By direct time domain integration or frequency domain optimization, the distributed circuit model can also be used to construct the lumped element circuit model as well as the proposed hybrid element model consisting of transmission lines and lumped elements. The hybrid model is intended to combine the efficiency of the lumped element model with the accuracy of the distributed circuit model leading to efficient accurate simulation of circuits in general CAD tools. The accuracy of these circuit models is also confirmed by comparing the simulated data with the measured data for the test fixtures on printed circuit boards (PCBs) and chip-to-chip level interconnections. The techniques developed in this thesis can help to assure the signal fidelity of high speed circuits in the early design stage by incorporating interconnect models into integrated circuit design and simulation.
Download or read book Characterization and Electrical Circuit Modeling of Interconnections and Packages Using Time Domain Network Analysis written by Leonard Hayden and published by . This book was released on 1993 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt: The improved accuracy of Time Domain Reflection and Transmission (TDR/T) measurements made possible by the calibration process known as Time Domain Network Analysis (TDNA) is applied to the problem of characterization and modeling of electronic interconnect and packaging structures. TDNA uses measurements of known and partially known calibration standards to characterize the measurement system allowing for the correction of the raw measurements of an unknown network to eliminate the effects of system non-idealities and resulting in a significant improvement of the measurement quality. The correction process is shown to be analogous to the well established Frequency Domain Vector Network Analyzer calibrations and to have the same capabilities for high precision metrology applications. Methods are developed to extract electrical circuit models from time domain measurements of lossless, nonuniform, multiconductor transmission lines for two broad classes of structures. Although unique solutions are not feasible for general structures that scatter the propagating wave-front, approximate solutions have been identified using the assumption of a single velocity wave-front, the case for homogeneous media. For structures with identical lines, such as a parallel line bus structure, the propagation behavior (eigenvector matrix) is determined only by the number of conductors, N, and is therefore known a priori for the entire structure allowing decoupling of the system into N orthogonal nonuniform transmission lines. Circuit models have been developed for these decoupled nonuniform lines as well as for the equal modal velocity assumption which relies on a matrix impedance profile to fully describe the system. The implications of non-ideal grounding of interconnection circuits is explored. Traditional lumped element methods for modeling these effects are examined and typical examples where distributed circuit models are necessary to adequately describe the system are identified. Techniques for examining power-planes and substrate connections in integrated circuits and integrated circuit packages using the distributed ground model are presented. Novel circuit design methods to circumvent the limitations imposed by non-ideal grounds and nonzero length transmission structures are also proposed.
Download or read book Compact Models and Measurement Techniques for High Speed Interconnects written by Rohit Sharma and published by Springer Science & Business Media. This book was released on 2012-02-17 with total page 81 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.
Download or read book High Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Download or read book Interconnection Noise in VLSI Circuits written by Francesc Moll and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 1999 with total page 840 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 27th International Symposium on Microelectronics written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1997 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Time Domain Characterization of Interconnect Discontinuities written by Jyh-ming Jong and published by . This book was released on 1991 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: The purpose of this study is to develop experimental techniques to characterize typical interconnect discontinuities, including bends, steps, T junctions, vias and pads, which are the most commonly encountered interconnections in high speed digital integrated circuits, hybrid and monolithic microwave circuits and electronic packages. The time domain reflection response of these elements is used to classify the interconnect discontinuities as distributed discontinuity elements or as lumped elements depending upon the reflected waveform. For the cases of general distributed discontinuities including bends, steps and T junctions, the distributed equivalent circuit model is characterized by the time dependent impedance profile which is extracted from the time domain reflection measurements. By using known inverse scattering techniques implemented in terms of a new algorithm based on the transfer scattering matrix method of incremental uniform sections, this nonuniform impedance profile is extracted and is used to construct distributed element circuit models to represent the interconnect discontinuities. A circuit model consisting of lumped/distributed elements, is also developed for the interconnect discontinuities which is intended to combine the accuracy of the distributed model with the simulation efficiency of the lumped models. This hybrid mode reduces computer simulation time when used as a net list for general purpose circuit simulators, such as SPICE. For the case of discontinuities modelled as lumped elements, such as vias and wiring pads, closed form equations based on the transfer scattering matrix solution are derived and used to extract the lumped electrical parameters of these elements from the time domain reflection waveform. All of these lumped, distributed and hybrid models are validated by comparing the time domain simulation results with Time Domain Reflectrometer (TDR) measurements. A procedure for extracting the excess inductances and capacitances associated with the general discontinuities from the synthesized nonuniform impedance profile or the distributed model is also presented in this report. These results for excess lumped inductances and capacitances show close agreement with the published results for these structures which are based on the electromagnetic computation of excess currents and charges and frequency domain measurements. Finally, some typical cases demonstrating the effects of interconnect discontinuities in high speed clocking systems are presented and the procedure for reducing the reflections and transmission noise voltage by chamfering the bends and junctions is described.
Download or read book Microelectronics Technology and Devices written by and published by The Electrochemical Society. This book was released on 2005 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling and Simulation of High Speed VLSI Interconnects written by Michel S. Nakhla and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 104 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.
Download or read book The VLSI Handbook written by Wai-Kai Chen and published by CRC Press. This book was released on 2019-07-17 with total page 1788 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.
Download or read book Signal Propagation on Interconnects written by Hartmut Grabinski and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 150 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises a selection of the most representative contributions to the 1st IEEE Workshop on Signal Propagation on Interconnects that was held at Travemunde, Germany, in May 1997. It represents, therefore, a survey of the actual problems currently concerning researchers and professionals in the field of signal propagation on interconnects. Signal Propagation on Interconnects contains chapters which cover a wide area of important research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. Signal Propagation on Interconnects is intended to give developers and researchers in the field of chip and package design a review of the state of the art regarding the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It is an invaluable text for circuit design engineers, developers and researchers in the field of signal integrity.
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1997 with total page 1316 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific Computing in Electrical Engineering written by Angelo Marcello Anile and published by Springer Science & Business Media. This book was released on 2007-01-10 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of papers presented at the last Scientific Computing in Electrical Engineering (SCEE) Conference, held in Sicily, in 2004. The series of SCEE conferences aims at addressing mathematical problems which have a relevancy to industry. The areas covered at SCEE-2004 were: Electromagnetism, Circuit Simulation, Coupled Problems and General mathematical and computational methods.
Download or read book National Semiconductor Metrology Program Semiconductor Electronics Division NIST List Of Publications LP 103 March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:
