Download or read book Effects of Film Microstructure and Line Geometry on the Reliability of Passivated Copper Interconnects written by Julie Ann Nucci and published by . This book was released on 1996 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Abstracts written by and published by . This book was released on 2002 with total page 2540 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Performance and Reliability of Ultra thin Diffusion Barriers for Sub half Micron MOS Devices Integrated with Copper Metallization written by Matthew Stephen Angyal and published by . This book was released on 1996 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructure and Reliability of Copper Interconnects written by Changsup Ryu and published by . This book was released on 1998 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Download or read book Effect of Downscaling Copper Interconnects on the Microstructure Revealed by High Resolution Tem Orientation Mapping written by Jai Ganesh Kameswaran and published by . This book was released on 2011 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: The scaling required to accommodate faster chip performance in microelectronic devices has necessitated a reduction in the dimensions of copper interconnects at the back end of the line. The constant downscaling of copper interconnects has resulted in changes to the microstructure, and these variations are known to impact electrical resistivity and reliability issues in interconnects. In this work, a novel electron diffraction technique called Diffraction Scanning Transmission Electron Microscopy (D-STEM) has been developed and coupled with precession electron microscopy to obtain quantitative local texture information in damascene copper lines (1.8 \mu m to 70 nm in width) with a spatial resolution of less than 5 nm. Misorientation and trace analysis has been performed to investigate the the grain boundary distribution in these lines. The results reveal strong variations in texture and grain boundary distribution of the copper lines upon downscaling. 1.8 \mu m wide lines exhibit strong 111 normal texture and comprise large bamboo-type grains. Upon downscaling to 180 nm, a {111} 110 biaxial texture has been observed. In contrast, narrower lines of widths 120 nm and 70 nm reveal sidewall growth of {111} grains and a dominant 110 normal texture. The fraction of coherent twin boundaries also reduces with decreasing line width. The microstructure changes from bamboo-type in wider lines to one comprising clusters of small grains separated by high angle boundaries in the vicinity of large grains. The evolution of such a microstructure has been discussed in terms of overall energy minimization and dimensional constraints. Finite element analysis has been performed to correlate misorientations between grains and local thermal stresses associated with stress migration. Effect of variations in the copper interconnect microstructure on electromigration flux divergence has also been discussed.
Download or read book Metal Based Thin Films for Electronics written by Klaus Wetzig and published by John Wiley & Sons. This book was released on 2006-03-06 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: This up-to-date handbook covers the main topics of preparation, characterization and properties of complex metal-based layer systems. The authors -- an outstanding group of researchers -- discuss advanced methods for structure, chemical and electronic state characterization with reference to the properties of thin functional layers, such as metallization and barrier layers for microelectronics, magnetoresistive layers for GMR and TMR, sensor and resistance layers. As such, the book addresses materials specialists in industry, especially in microelectronics, as well as scientists, and can also be recommended for advanced studies in materials science, analytics, surface and solid state science.
Download or read book Integrated Circuit Quality and Reliability written by Eugene R. Hnatek and published by CRC Press. This book was released on 2018-10-03 with total page 809 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.
Download or read book Constrained Deformation of Materials written by Y.-L. Shen and published by Springer Science & Business Media. This book was released on 2010-08-09 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Download or read book Metals Abstracts written by and published by . This book was released on 1994 with total page 1584 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Metallization for Devices and Circuits science Technology and Manufacturability written by S. P. Murarka and published by . This book was released on 1994 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Noble and Precious Metals written by Mohindar Seehra and published by BoD – Books on Demand. This book was released on 2018-07-04 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.
Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2304 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dissertation Abstracts International written by and published by . This book was released on 1995 with total page 638 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Metallization Conference 2002 AMC 2002 written by and published by . This book was released on 2003 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings written by and published by . This book was released on 2000 with total page 1796 pages. Available in PDF, EPUB and Kindle. Book excerpt:
