Download or read book Dielectric and Conductor loss Characterization and Measurements on Electronic Packaging Materials written by James Baker-Jarvis and published by . This book was released on 2001 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low and high temperature co-fired ceramic substrates, printed wiring boards, and other packaging materials. The most commonly used methods are presented. We particularly emphasize method that can be used nondestructively either in the laboratory or on the assembly line. We begin with an overview of pertinent electrical properties of sustrate materials and conductors. We then describe frequency-dependent metal losses on conductors. We also overview cavity and dielectric resonators, full-sheet resonance, coaxial probe, stripline, and capacitive methods. The frequency ranges of applicability and typical uncertainties associated with the methods are summarized. We also present measurement results of many substrate materials.
Download or read book Dielectric and Conductor Loss Characterization and Measurements on Electronic Packaging Materials Classic Reprint written by James Baker-Jarvis and published by Forgotten Books. This book was released on 2017-10-31 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: Excerpt from Dielectric and Conductor-Loss Characterization and Measurements on Electronic Packaging Materials This technical note is an introductory overview of dielectric and magnetic measure ment metrology on packaging materials. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
Download or read book Dielectric and Conductor loss Characterization and Measurements on Electronic Packaging Materials written by and published by . This book was released on 2002 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Packaging Materials and Their Properties written by Michael Pecht and published by CRC Press. This book was released on 2017-12-19 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Download or read book Microwave and Millimeter Wave Electronic Packaging written by Rick Sturdivant and published by Artech House. This book was released on 2013-12-01 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.
Download or read book Transmit Receive Modules for Radar and Communication Systems written by Rick Sturdivant and published by Artech House. This book was released on 2015-12-01 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: The use of electronically scanned phased arrays is increasing in systems such as radar, wireless networks, and satellite ground terminals. An important and necessary component for these systems is the transmit receive (T/R) module, which provides the amplification and electronic beam steering that is required for proper function. This new resource presents a comprehensive overview of all design, fabrication, integration, and implementation issues associated with T/R modules for radar and communications. This book provides engineers and researchers with practical designs and 44 examples of analysis, circuits, and components used in T/R modules. It also provides a solid explanation of the theory for how T/R modules operate and how they can be optimized. In addition, this book shows how the latest technical advances in silicon germanium (SiGe) and gallium nitride (GaN) are allowing levels of performance that were previously unachievable. The book concludes with informative chapters on testing, cost considerations, and the future of next generation T/R modules.
Download or read book Proceedings of the 10th National Technical Seminar on Underwater System Technology 2018 written by Zainah Md Zain and published by Springer. This book was released on 2019-02-08 with total page 635 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents cutting-edge research papers in the field of Underwater System Technology in Malaysia and Asia in general. The topics covered include intelligent robotics, novel sensor technologies, control algorithms, acoustic signal processing, imaging techniques, biomimetic robots, green energy sources, and underwater communication backbones and protocols. The book showcases some of the latest technologies and applications developed to facilitate local marine exploration and exploitation. It also addresses related topics concerning the Sustainable Development Goals (SDG) outlined by the United Nations.
Download or read book High Frequency Characterization of Electronic Packaging written by Luc Martens and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Download or read book Advanced Materials and Design for Electromagnetic Interference Shielding written by Xingcun Colin Tong and published by CRC Press. This book was released on 2016-04-19 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Download or read book Advanced Millimeter wave Technologies written by Duixian Liu and published by John Wiley & Sons. This book was released on 2009-03-03 with total page 850 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Download or read book Morphotropic Phase Boundary Perovskites High Strain Piezoelectrics and Dielectric Ceramics written by Ruyan Guo and published by John Wiley & Sons. This book was released on 2012-04-11 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the Symposium on Dielectric Materials and Multilayer Electronic Devices and the Symposium on Morphotropic Phase Boundary Phenomena and Perovskite Materials, held April 28 - May 1, 2002, in St. Louis, Missouri, during the 104th Annual Meeting of the American Ceramic Society, and the Focused Session on High Strain Piezoelectrics, held April 22-25, 2001, in Indianapolis, Indiana, during the 103rd Annual Meeting of the American Ceramic Society.
Download or read book Characterization of Integrated Circuit Packaging Materials written by Thomas Moore and published by Elsevier. This book was released on 2013-10-22 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Download or read book Materials for High Density Electronic Packaging and Interconnection written by Committee on Materials for High-Density Electronic Packaging and published by . This book was released on 1990-01-15 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Comparative Characterization of Electronic Packaging Materials Through Steady State Thermal Conductivity Measurements written by John Franklin Maddox and published by . This book was released on 2010 with total page 147 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Packaging Materials Science V Volume 203 written by Edwin D. Lillie and published by . This book was released on 1991-06-07 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Microwaves Millimeter Wave and Terahertz Liquid Crystals written by Anyong Qing and published by Springer Nature. This book was released on with total page 283 pages. Available in PDF, EPUB and Kindle. Book excerpt:
