Download or read book Development of Advanced Cooling Technologies for High Powered Electronic Devices written by Sanskar Shrikant Panse and published by . This book was released on 2021 with total page 177 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Cooling Technologies and Applications written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2019-01-30 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.
Download or read book Embedded Cooling Of Electronic Devices Conduction Evaporation And Single And Two phase Convection written by Madhusudan Iyengar and published by World Scientific. This book was released on 2024-01-10 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Download or read book Air Cooling Technology for Electronic Equipment written by Sung Jin Kim and published by CRC Press. This book was released on 2020-07-24 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Download or read book Thermal Management for Opto electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-05-29 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Making Appropriations for the Department of Defense for the Fiscal Year Ending September 30 2006 and for Other Purposes written by United States. Congress and published by . This book was released on 2005 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: House Report 109-359. To Accompany the bill H.R. 2863, which was not yet enacted into law when this conference report was ordered to be printed on December 18, 2005. This conference report is part of the legislative history of the proposed Department of Defense Appropriations Act, 2006.
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Hybrid Technologies for Medium to Heavy duty Commercial Trucks written by United States. Congress. House. Committee on Science and Technology (2007). Subcommittee on Energy and Environment and published by . This book was released on 2008 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cooling Techniques for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 1991-10-22 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Download or read book Emerging Two Phase Cooling Technologies for Power Electronic Inverters written by J. S. Hsu and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: In order to meet the Department of Energy's (DOE's) FreedomCAR and Vehicle Technologies (FVCT) goals for volume, weight, efficiency, reliability, and cost, the cooling of the power electronic devices, traction motors, and generators is critical. Currently the power electronic devices, traction motors, and generators in a hybrid electric vehicle (HEV) are primarily cooled by water-ethylene glycol (WEG) mixture. The cooling fluid operates as a single-phase coolant as the liquid phase of the WEG does not change to its vapor phase during the cooling process. In these single-phase systems, two cooling loops of WEG produce a low temperature (around 70 C) cooling loop for the power electronics and motor/generator, and higher temperature loop (around 105 C) for the internal combustion engine. There is another coolant option currently available in automobiles. It is possible to use the transmission oil as a coolant. The oil temperature exists at approximately 85 C which can be utilized to cool the power electronic and electrical devices. Because heat flux is proportional to the temperature difference between the device's hot surface and the coolant, a device that can tolerate higher temperatures enables the device to be smaller while dissipating the same amount of heat. Presently, new silicon carbide (SiC) devices and high temperature direct current (dc)-link capacitors, such as Teflon capacitors, are available but at significantly higher costs. Higher junction temperature (175 C) silicon (Si) dies are gradually emerging in the market, which will eventually help to lower hardware costs for cooling. The development of high-temperature devices is not the only way to reduce device size. Two-phase cooling that utilizes the vaporization of the liquid to dissipate heat is expected to be a very effective cooling method. Among two-phase cooling methods, different technologies such as spray, jet impingement, pool boiling and submersion, etc. are being developed. The Oak Ridge National Laboratory (ORNL) is leading the research on a novel floating refrigerant loop that cools high-power electronic devices and the motor/generator with very low cooling energy. The loop can be operated independently or attached to the air conditioning system of the vehicle to share the condenser and other mutually needed components. The ability to achieve low cooling energy in the floating loop is attributable to the liquid refrigerant operating at its hot saturated temperature (around 50 C+). In an air conditioning system, the liquid refrigerant is sub-cooled for producing cool air to the passenger compartment. The ORNL floating loop avoids the sub-cooling of the liquid refrigerant and saves significant cooling energy. It can raise the coefficient of performance (COP) more than 10 fold from that of the existing air-conditioning system, where the COP is the ratio of the cooled power and the input power for dissipating the cooled power. In order to thoroughly investigate emerging two-phase cooling technologies, ORNL subcontracted three university/companies to look into three leading two-phase cooling technologies. ORNL's assessments on these technologies are summarized in Section I. Detailed descriptions of the reports by the three university/companies (subcontractors) are in Section II.
Download or read book Making appropriations for the Department of Defense for the fiscal year ending September 30 2006 and for other purposes conference report to accompany H R 2863 written by United States. Congress and published by DIANE Publishing. This book was released on 2005 with total page 533 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Thermal Management Materials written by Guosheng Jiang and published by Springer Science & Business Media. This book was released on 2012-09-13 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book NASA Tech Briefs written by and published by . This book was released on 2016-06 with total page 76 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microfluidic Cooling Technology Principles Design and Applications written by Charles Nehme and published by Charles Nehme. This book was released on with total page 79 pages. Available in PDF, EPUB and Kindle. Book excerpt: Overview of Microfluidic Cooling Microfluidic cooling technology represents a cutting-edge approach to thermal management, leveraging the principles of microfluidics—the manipulation of fluids at the microscale—to effectively dissipate heat in high-performance electronic devices and other applications. This technology has emerged as a vital solution in response to the growing demands for efficient, compact, and reliable cooling systems in various fields, particularly as electronic components become increasingly powerful and densely packed. The journey of microfluidic cooling began with the advent of microelectromechanical systems (MEMS) in the late 20th century. As electronic devices became smaller and more powerful, traditional cooling methods, such as air and liquid cooling, began to reach their physical and practical limits. This limitation necessitated the exploration of alternative cooling strategies, leading to the development of microfluidic cooling systems. These systems utilize networks of microchannels through which a coolant is circulated, enabling localized and efficient heat removal directly at the source of heat generation.
Download or read book Advanced Liquid Metal Cooling For Chip Device And System written by Jing Liu and published by World Scientific. This book was released on 2022-04-08 with total page 961 pages. Available in PDF, EPUB and Kindle. Book excerpt: This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.
