Download or read book Design Rules in a Semiconductor Foundry written by Eitan N. Shauly and published by CRC Press. This book was released on 2022-11-30 with total page 831 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Download or read book Proceedings of International Conference on Communication Circuits and Systems written by Sukanta Kumar Sabut and published by Springer Nature. This book was released on 2021-04-02 with total page 575 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book proposes new technologies and discusses innovative solutions to various problems in the field of communication, circuits, and systems, as reflected in high-quality papers presented at International Conference on Communication, Circuits, and Systems (IC3S 2020) held at KIIT, Bhubaneswar, India from 16 – 18 October 2020. It brings together new works from academicians, scientists, industry professionals, scholars, and students together to exchange research outcomes and open up new horizons in the areas of signal processing, communications, and devices.
Download or read book ASIC Design Implementation Process written by Khosrow Golshan and published by Springer Nature. This book was released on with total page 143 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book VLSI Design written by M. Michael Vai and published by CRC Press. This book was released on 2017-12-19 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Very Large Scale Integration (VLSI) has become a necessity rather than a specialization for electrical and computer engineers. This unique text provides Engineering and Computer Science students with a comprehensive study of the subject, covering VLSI from basic design techniques to working principles of physical design automation tools to leading edge application-specific array processors. Beginning with CMOS design, the author describes VLSI design from the viewpoint of a digital circuit engineer. He develops physical pictures for CMOS circuits and demonstrates the top-down design methodology using two design projects - a microprocessor and a field programmable gate array. The author then discusses VLSI testing and dedicates an entire chapter to the working principles, strengths, and weaknesses of ubiquitous physical design tools. Finally, he unveils the frontiers of VLSI. He emphasizes its use as a tool to develop innovative algorithms and architecture to solve previously intractable problems. VLSI Design answers not only the question of "what is VLSI," but also shows how to use VLSI. It provides graduate and upper level undergraduate students with a complete and congregated view of VLSI engineering.
Download or read book Intellectual Property for Integrated Circuits written by Kiat Seng Yeo and published by J. Ross Publishing. This book was released on 2010 with total page 241 pages. Available in PDF, EPUB and Kindle. Book excerpt: Intellectual Property for Integrated Circuits provides inventors with the know-how to effectively search for and interpret prior arts and equips them with the knowledge to be granted exclusive rights to control the results of their creativity and to benefit financially from those rights.
Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Download or read book EDA for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2018-10-03 with total page 762 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2009-12-08 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Download or read book Automatic Layout Modification written by Michael Reinhardt and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is a welcome effort towards improving some of the practices in chip design today. The authors provide a comprehensive reference work on Automatic Layout Modification which will be valuable to VLSI courses at universities, and to CAD and circuit engineers and engineering managers.
Download or read book Istc cstic 2009 cistc written by David Huang and published by The Electrochemical Society. This book was released on 2009-03 with total page 1124 pages. Available in PDF, EPUB and Kindle. Book excerpt: ISTC/CSTIC is an annual semiconductor technology conference covering all the aspects of semiconductor technology and manufacturing, including devices, design, lithography, integration, materials, processes, manufacturing as well as emerging semiconductor technologies and silicon material applications. ISTC/CSTIC 2009 was merged by ISTC (International Semiconductor Technology Conference) and CSTIC (China Semiconductor Technology International Conference), the two industry leading technical conferences in China, and consisted of one plenary session and nine technical symposia. This issue of ECS Transactions contains 159 papers from the conference.
Download or read book Nano CMOS Circuit and Physical Design written by Ban Wong and published by John Wiley & Sons. This book was released on 2005-04-08 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
Download or read book MEMS Product Development written by Alissa M. Fitzgerald and published by Springer Nature. This book was released on 2021-03-16 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Drawing on their experiences in successfully executing hundreds of MEMS development projects, the authors present the first practical guide to navigating the technical and business challenges of MEMS product development, from the initial concept stage all the way to commercialization. The strategies and tactics presented, when practiced diligently, can shorten development timelines, help avoid common pitfalls, and improve the odds of success, especially when resources are limited. MEMS Product Development illuminates what it really takes to develop a novel MEMS product so that innovators, designers, entrepreneurs, product managers, investors, and executives may properly prepare their companies to succeed.
Download or read book Locating Global Advantage written by Martin Kenney and published by Stanford University Press. This book was released on 2004 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume explores how industries organize their global operations, through case studies of seven manufacturing industries. The chapters provide a nuanced understanding of the complex matrix of factor costs, access to inimitable capabilities, and time-based pressures that influence where firms decide to locate particular segments of the value chain.
Download or read book Silicon Photonics for Telecommunications and Biomedicine written by Sasan Fathpour and published by CRC Press. This book was released on 2016-04-19 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Given silicon's versatile material properties, use of low-cost silicon photonics continues to move beyond light-speed data transmission through fiber-optic cables and computer chips. Its application has also evolved from the device to the integrated-system level. A timely overview of this impressive growth, Silicon Photonics for Telecommunications
Download or read book Understanding Logic Locking written by Kimia Zamiri Azar and published by Springer Nature. This book was released on 2023-10-24 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book demonstrates the breadth and depth of IP protection through logic locking, considering both attacker/adversary and defender/designer perspectives. The authors draw a semi-chronological picture of the evolution of logic locking during the last decade, gathering and describing all the DO’s and DON’Ts in this approach. They describe simple-to-follow scenarios and guide readers to navigate/identify threat models and design/evaluation flow for further studies. Readers will gain a comprehensive understanding of all fundamentals of logic locking.
Download or read book Integrated Circuit Design for Radiation Environments written by Stephen J. Gaul and published by John Wiley & Sons. This book was released on 2019-12-03 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.
Download or read book Demystifying Chipmaking written by Richard F. Yanda and published by Elsevier. This book was released on 2005-06-06 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book takes the reader through the actual manufacturing process of making a typical chip, from start to finish, including a detailed discussion of each step, in plain language. The evolution of today's technology is added to the story, as seen through the eyes of the engineers who solved some of the problems. The authors are well suited to that discussion since they are three of those same engineers. They have a broad exposure to the industry and its technology that extends all the way back to Shockley Laboratories, the first semiconductor manufacturer in Silicon Valley. The CMOS (Complementary Metal-Oxide-Semiconductor) process flow is the focus of the discussion and is covered in ten chapters. The vast majority of chips made today are fabricated using this general method. In order to ensure that all readers are comfortable with the vocabulary, the first chapter carefully and clearly introduces the science concepts found in later chapters. A chapter is devoted to pointing out the differences in other manufacturing methods, such as the gallium arsenide technology that produces chips for cell phones. In addition, a chapter describing the nature of the semiconductor industry from a business perspective is included. "The entire process of making a chip is surprisingly easy to understand. The part of the story that defies belief is the tiny dimensions: the conducting wires and other structures on a chip are more than a hundred times thinner than a hair - and getting thinner with every new chip design." Authors are actual engineers who have a broad range of exposure and experience with chip technology Contains a unique chapter describing the nature of the semiconductor industry from a business perspective
