Download or read book Design and Analysis of Heat Sinks written by Allan D. Kraus and published by Wiley-Interscience. This book was released on 1995-10-03 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: A powerful methodology for producing superior thermal performance at low cost with minimum added mass . . . Here is the only available comprehensive treatment of the design and analysis of heat sinks. It provides all the theoretical and practical information necessary to successfully design and/or select cost-effective heat sinks for electronic equipment. The presentation includes detailed explanations of the governing heat transfer phenomena, complete coverage of thermal modeling tools for geometrically complex fin structures, and extensive discussion on recognizing thermal optimization opportunities. Other topics covered include: Fundamentals of heat transfer Thermal modeling of electronic packages Mathematical tools for heat-sink analysis and design Prevailing thermal transport processes Models for a variety of fin geometries Simple "transfer function" relations for single fin, cascaded fin, and fin array heat sinks Thermal characterization and optimization of plate-fin heat sinks Completely self-contained and filled with valuable information not available from any other single source, Design and Analysis of Heat Sinks is both a superior reference for accomplished thermal specialists and an excellent textbook for graduate courses in advanced thermal applications for mechanical engineering students. This book can also serve as a text in thermal science for students of electrical engineering.
Download or read book Thermal Design written by H. S. Lee and published by John Wiley & Sons. This book was released on 2010-11-17 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.
Download or read book EngOpt 2018 Proceedings of the 6th International Conference on Engineering Optimization written by H.C. Rodrigues and published by Springer. This book was released on 2018-09-13 with total page 1486 pages. Available in PDF, EPUB and Kindle. Book excerpt: The papers in this volume focus on the following topics: design optimization and inverse problems, numerical optimization techniques,efficient analysis and reanalysis techniques, sensitivity analysis and industrial applications. The conference EngOpt brings together engineers, applied mathematicians and computer scientists working on research, development and practical application of optimization methods in all engineering disciplines and applied sciences.
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Download or read book Thermally Aware Design written by Yong Zhan and published by Now Publishers Inc. This book was released on 2008 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides an overview of analysis and optimization techniques for thermally-aware chip design.
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Download or read book Constructal Theory of Social Dynamics written by Adrian Bejan and published by Springer Science & Business Media. This book was released on 2007-10-26 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Constructal Theory of Social Dynamics brings together for the first time social scientists and engineers who present predictive theory of social organization, as a conglomerate of mating flows that morph in time to flow more easily. The book offers a new way to look at social phenomena as part of natural phenomena, and examines a new domain of application of engineering such as thermodynamic optimization, thermoeconomics and "design as science".
Download or read book Shape and Structure from Engineering to Nature written by Adrian Bejan and published by Cambridge University Press. This book was released on 2000-10-16 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.
Download or read book Design of Thermal Energy Systems written by Pradip Majumdar and published by John Wiley & Sons. This book was released on 2021-06-01 with total page 708 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design of Thermal Energy Systems Pradip Majumdar, Northern Illinois University, USA A comprehensive introduction to the design and analysis of thermal energy systems Design of Thermal Energy Systems covers the fundamentals and applications in thermal energy systems and components, including conventional power generation and cooling systems, renewable energy systems, heat recovery systems, heat sinks and thermal management. Practical examples are used throughout and are drawn from solar energy systems, fuel cell and battery thermal management, electrical and electronics cooling, engine exhaust heat and emissions, and manufacturing processes. Recent research topics such as steady and unsteady state simulation and optimization methods are also included. Key features: Provides a comprehensive introduction to the design and analysis of thermal energy systems, covering fundamentals and applications. Includes a wide range of industrial application problems and worked out example problems. Applies thermal analysis techniques to generate design specification and ratings. Demonstrates how to design thermal systems and components to meet engineering specifications. Considers alternative options and allows for the estimation of cost and feasibility of thermal systems. Accompanied by a website including software for design and analysis, a solutions manual, and presentation files with PowerPoint slides. The book is essential reading for: practicing engineers in energy and power industries; consulting engineers in mechanical, electrical and chemical engineering; and senior undergraduate and graduate engineering students.
Download or read book Modeling Analysis Design and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. - Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging - Features experimental characterization and qualifications for the analysis and verification of electronic packaging design - Provides multiphysics modeling and analysis techniques of electronic packaging
Download or read book Advances in Heat Transfer and Thermal Engineering written by Chuang Wen and published by Springer Nature. This book was released on 2021-06-01 with total page 914 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected papers from the 16th UK Heat Transfer Conference (UKHTC2019), which is organised every two years under the aegis of the UK National Heat Transfer Committee. It is the premier forum in the UK for the local and international heat transfer community to meet, disseminate ongoing work, and discuss the latest advances in the heat transfer field. Given the range of topics discussed, these proceedings offer a valuable asset for engineering researchers and postgraduate students alike.
Download or read book Fluid Mechanics and Fluid Power Contemporary Research written by Arun K. Saha and published by Springer. This book was released on 2016-09-20 with total page 1638 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume comprises the proceedings of the 42nd National and 5th International Conference on Fluid Mechanics and Fluid Power held at IIT Kanpur in December, 2014.The conference proceedings encapsulate the best deliberations held during the conference. The diversity of participation in the conference, from academia, industry and research laboratories reflects in the articles appearing in the volume. This contributed volume has articles from authors who have participated in the conference on thematic areas such as Fundamental Issues and Perspectives in Fluid Mechanics; Measurement Techniques and Instrumentation; Computational Fluid Dynamics; Instability, Transition and Turbulence; Turbomachinery; Multiphase Flows; Fluid‐Structure Interaction and Flow‐Induced Noise; Microfluidics; Bio‐inspired Fluid Mechanics; Internal Combustion Engines and Gas Turbines; and Specialized Topics. The contents of this volume will prove useful to researchers from industry and academia alike.
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Download or read book Topology Optimization in Engineering Structure Design written by Jihong Zhu and published by Elsevier. This book was released on 2016-11-08 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topology Optimization in Engineering Structure Design explores the recent advances and applications of topology optimization in engineering structures design, with a particular focus on aircraft and aerospace structural systems.To meet the increasingly complex engineering challenges provided by rapid developments in these industries, structural optimization techniques have developed in conjunction with them over the past two decades. The latest methods and theories to improve mechanical performances and save structural weight under static, dynamic and thermal loads are summarized and explained in detail here, in addition to potential applications of topology optimization techniques such as shape preserving design, smart structure design and additive manufacturing.These new design strategies are illustrated by a host of worked examples, which are inspired by real engineering situations, some of which have been applied to practical structure design with significant effects. Written from a forward-looking applied engineering perspective, the authors not only summarize the latest developments in this field of structure design but also provide both theoretical knowledge and a practical guideline. This book should appeal to graduate students, researchers and engineers, in detailing how to use topology optimization methods to improve product design. - Combines practical applications and topology optimization methodologies - Provides problems inspired by real engineering difficulties - Designed to help researchers in universities acquire more engineering requirements
