Download or read book Cooling of Electronic Equipment written by Allan W. Scott and published by Wiley-Interscience. This book was released on 1974 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Cooling of Electronic Systems written by Sadik Kakaç and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 953 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Download or read book Cooling Techniques for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 1991-10-22 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Download or read book Electronics Cooling written by S. M. Sohel Murshed and published by BoD – Books on Demand. This book was released on 2016-06-15 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Download or read book Thermal Design of Electronic Equipment written by Ralph Remsburg and published by CRC Press. This book was released on 2017-12-19 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt: In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Download or read book Advanced Thermal Design of Electronic Equipment written by Ralph Remsburg and published by Springer Science & Business Media. This book was released on 1998-02-28 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt: With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Download or read book Thermal Computations for Electronics written by Gordon Ellison and published by CRC Press. This book was released on 2010-11-08 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (MathcadTM worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
Download or read book Thermal Computations for Electronics written by Gordon N. Ellison and published by CRC Press. This book was released on 2020-05-13 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.
Download or read book Thermal Measurements in Electronics Cooling written by Kaveh Azar and published by CRC Press. This book was released on 2020-08-26 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Download or read book Thermal Computations for Electronic Equipment written by Gordon N. Ellison and published by . This book was released on 1989 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Download or read book Vibration Analysis for Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 2000-07-11 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.
Download or read book Waste Electrical and Electronic Equipment WEEE Handbook written by Vannessa Goodship and published by Woodhead Publishing. This book was released on 2019-07-13 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt: Waste Electrical and Electronic Equipment (WEEE) Handbook, Second Edition, is a one-stop reference on current electronic waste legislation initiatives, their impact, and the latest technological considerations for reducing electronic waste (e-waste) and increasing the efficiency of materials recovery. It also provides a wide-range of global and corporate examples and perspectives on the challenges that face specific regions and companies, along with the solutions they are implementing in managing e-waste, offering further insights on how discarded products can be treated. Sections introduce the reader to legislation and initiatives to manage WEEE and discuss technologies for the refurbishment, treatment and recycling of waste electronics. Further sections focus on electronic products that present particular challenges for recyclers, explore sustainable design of electronics and supply chains, discuss national and regional WEEE management schemes, and more. - Addresses the latest challenges and opportunities for electronic waste (e-waste) management, including e-waste collection models, circular economy implications, rare earth metal recovery, and much more - Draws lessons for waste electrical and electronic equipment (WEEE) policy and practice from around the world - Discusses legislation and initiatives to manage WEEE, including global e-waste initiatives, EU legislation relating to electronic waste, and eco-efficiency evaluation of WEEE take-back systems
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Hot Air Rises and Heat Sinks written by Tony Kordyban and published by American Society of Mechanical Engineers. This book was released on 1998 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: A collection of myths, mistakes, and anecdotal lessons from practicing engineers involved in the field of electronic equipment cooling. The author's approach is to provide 31 case studies, each of which teaches a lesson. Topics include thermal conductivity, natural vs. forced convection, junction temperature operating limits, fans, thermocouples, thermal time constants, transient convection, and conjugate heat transfer. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Preventing Thermal Cycling and Vibration Failures in Electronic Equipment written by Dave S. Steinberg and published by Wiley-Interscience. This book was released on 2001-07-11 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.
Download or read book Thermosyphons and Heat Pipes Theory and Applications written by Marcia Barbosa Henriques Mantelli and published by Springer Nature. This book was released on 2020-12-22 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about theories and applications of thermosyphons and heat pipes. It discusses the physical phenomena that drive the working principles of thermosyphons, heat pipes and related technologies. Many applications are discussed in this book, including: rationalizing energy use in industry, solar heating of houses, decrease of water consumption in cooling towers, improvement of the thermal performance of industrial and domestic ovens and driers and new devices for heating stored oil and gas in petrochemical plants. Besides, the book also presents heat pipe and thermosyphon technologies for the thermal management of electronic devices, from portable equipment to airplanes and satellites. The first part of the book explores the physical working principles of thermosyphons and heat pipes, by explaining current heat transfer and thermal resistance models. The author discusses the new heat pipe and thermosyphon technologies that have been developed in the last decade for solving a myriad of electronic, environment and industrial heat and thermal problems. The focus then shifts to the thermosyphon technology applications, and the models and simulations necessary for each application – including vehicles, domestic appliances, water conservation technologies and the thermal control of houses and other structures. Finally, the book looks at the new technologies for heat pipes (mini/micro) and similar devices (loop heat pipes), including new models for prediction of the thermal performance of porous media. This book inspires engineers to adopt innovative approaches to heat transfer problems in equipment and components by applying thermosyphon and heat pipe technologies. It is also of interest to researchers and academics working in the heat transfer field, and to students who wish to learn more about heat transfer devices.
