Download or read book Contribution to failure mechanism driven qualification of electronic power devices and design guidelines for high temperature automotive applications written by Pravin Sinha and published by . This book was released on 2009 with total page 115 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aujourd'hui, environ 80% de l'innovation dans le secteur automobile est le fait de l'électronique. Les projections pour 2010 prédisent que les systèmes électroniques représenteront 40% du coût du véhicule. De plus, les conditions d'application sont de plus en plus exigeantes, le marché de l'industrie automobile cherchant des systèmes plus fiables avec une durée de vie prolongée. Les standards actuels de qualification sont entièrement basés sur une méthode de qualification comportant des tests de conformité sur des échantillons, la durée de ces tests étant prédéfinie. Une partie importante des informations demeure donc inconnue à l'issue des tests de cette méthode de qualification. Notamment, les questions suivantes demeurent: où se situe la fin de vie du produit? Quel est le mécanisme de défaillance? Les points clés de nouvellement proposé méthodologie sont d'évaluer les exigences des applications en terme charges environnementales (stress mécanique, la température) et de charges appliquées et leur impact sur l'accélération de la défaillance les transistor MOSFET. A grace de test il a été prouvé que les connexions sources (câblage filaire de sources) et les brasure sous la puce Power MOSFET sont les points faibles du système. Il a également été prouvé que, dans le cas de charges environnementales, les soudures du circuit intégré sur le substrat sont les plus faibles alors que dans le cas de charges appliquées, les connexions sources (câblage filaire de sources) sont le facteur limitant. Les données obtenues par les tests de vieillissement accéléré ont été analysées et modélises afin de comprendre la fiabilité de ces composants. Finalement, une nouvelle technologie de packaging Power MOSFET nommée LFPAK, qui utilise des clips en cuivre au lieu des connexions sources (câblage filaire de sources), a été analysée pour comprendre son comportement en haute température. Les résultant des tests de viellissement accéléré obtenus dans ce travail peuvent être utlisés pour le design d'un nouvelle génération de composant électronique hautes températures sur cartes de circuit imprimé (PCB).
Download or read book Reliability of High Power Mechatronic Systems 2 written by Abdelkhalak El Hami and published by Elsevier. This book was released on 2017-10-17 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: This second volume of a series dedicated to the reliability of high-power mechatronic systems focuses specifically on issues, testing and analysis in automotive and aerospace applications. In the search to improve industrial competitiveness, the development of methods and tools for the design of products is especially pertinent in the context of cost reduction. This book proposes new methods that simultaneously allow for a quicker design of future mechatronic devices in the automotive and aerospace industries while guaranteeing their increased reliability. The reliability of these critical elements is further validated digitally through new multi-physical and probabilistic models that could ultimately lead to new design standards and reliable forecasting. Presents a methodological guide that demonstrates the reliability of fractured mechatronic components and devices Includes numerical and statistical models to optimize the reliability of the product architecture Develops a methodology to characterize critical elements at the earliest stage in their development
Download or read book High Temperature Electronics written by F. Patrick McCluskey and published by CRC Press. This book was released on 1996-12-13 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book Failure Mechanism Driven Reliability Monitoring of Silicon Devices written by and published by . This book was released on 1991 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dependable Multicore Architectures at Nanoscale written by Marco Ottavi and published by Springer. This book was released on 2017-08-28 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides comprehensive coverage of the dependability challenges in today's advanced computing systems. It is an in-depth discussion of all the technological and design-level techniques that may be used to overcome these issues and analyzes various dependability-assessment methods. The impact of individual application scenarios on the definition of challenges and solutions is considered so that the designer can clearly assess the problems and adjust the solution based on the specifications in question. The book is composed of three sections, beginning with an introduction to current dependability challenges arising in complex computing systems implemented with nanoscale technologies, and of the effect of the application scenario. The second section details all the fault-tolerance techniques that are applicable in the manufacture of reliable advanced computing devices. Different levels, from technology-level fault avoidance to the use of error correcting codes and system-level checkpointing are introduced and explained as applicable to the different application scenario requirements. Finally the third section proposes a roadmap of future trends in and perspectives on the dependability and manufacturability of advanced computing systems from the special point of view of industrial stakeholders. Dependable Multicore Architectures at Nanoscale showcases the original ideas and concepts introduced into the field of nanoscale manufacturing and systems reliability over nearly four years of work within COST Action IC1103 MEDIAN, a think-tank with participants from 27 countries. Academic researchers and graduate students working in multi-core computer systems and their manufacture will find this book of interest as will industrial design and manufacturing engineers working in VLSI companies.
Download or read book Thermal Reliability of Power Semiconductor Device in the Renewable Energy System written by Xiong Du and published by Springer. This book was released on 2023-07-09 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Download or read book Bulletin of the Atomic Scientists written by and published by . This book was released on 1971-09 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Bulletin of the Atomic Scientists is the premier public resource on scientific and technological developments that impact global security. Founded by Manhattan Project Scientists, the Bulletin's iconic "Doomsday Clock" stimulates solutions for a safer world.
Download or read book ITHERM written by and published by . This book was released on 2000 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Bulletin of the Atomic Scientists written by and published by . This book was released on 1970-06 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Bulletin of the Atomic Scientists is the premier public resource on scientific and technological developments that impact global security. Founded by Manhattan Project Scientists, the Bulletin's iconic "Doomsday Clock" stimulates solutions for a safer world.
Download or read book NASA Tech Briefs written by and published by . This book was released on 2003 with total page 960 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Components and Systems written by W. H. Dennis and published by Elsevier. This book was released on 2013-10-22 with total page 273 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Components and Systems focuses on the principles and processes in the field of electronics and the integrated circuit. Covered in the book are basic aspects and physical fundamentals; different types of materials involved in the field; and passive and active electronic components such as capacitors, inductors, diodes, and transistors. Also covered in the book are topics such as the fabrication of semiconductors and integrated circuits; analog circuitry; digital logic technology; and microprocessors. The monograph is recommended for beginning electrical engineers who would like to know the fundamental concepts, theories, and processes in the related fields.
Download or read book Bulletin of the Atomic Scientists written by and published by . This book was released on 1953-05 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Bulletin of the Atomic Scientists is the premier public resource on scientific and technological developments that impact global security. Founded by Manhattan Project Scientists, the Bulletin's iconic "Doomsday Clock" stimulates solutions for a safer world.
Download or read book NUREG CR written by U.S. Nuclear Regulatory Commission and published by . This book was released on 1977 with total page 48 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Study of Electromigration Failure Mechanism in Micro Solder Joint written by Hossein Madanipour and published by . This book was released on 2021 with total page 103 pages. Available in PDF, EPUB and Kindle. Book excerpt: The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint. This type of the joint enables devices with far higher interconnect density and miniaturized form factors which are ideal for mobile applications. The focus of this research is to conduct comprehensive investigation on the electromigration (EM) reliability of micro solder joint. For that purpose, a series of EM tests on micro solder joints under direct current (DC) load was conducted with variation in the contributing factors to EM failure, including solder joint arrangement (change of interfacial layer addition), Cu pillar geometry (elliptical vs. cylindrical),EM test temperature, and current density. For this research, a customized EM test system with an oil-bath was developed to enable effective joule heat dissipation and maintenance of temperature uniformity and stability for the duration of EM testing. Our studies on EM failure kinetics and microstructural mechanism have produced a few important findings: 1) failure rate does not follow a single activation energy model, and it is far more sensitive to test temperature than the predicted by a conventional model. This is determined to be resulted by a limited amount of the solder material that is under two competing processes during EM test, a formation of intermetallic compound (IMC) and EM damage by voiding. The failure mode changes by change of dominant process among these two. Our extensive failure analysis on EM tested samples at different temperatures revealed that EM void damage due to EM of Sn is the dominant factor for the samples tested at low range of EM testing. On the other hand, IMC formation rate is the process that controls the failure kinetics of the joints tested at high temperature range of EM testing. 2) It is found that failure can happen even if the solder joint fully converted to IMC even though IMC joints are immune against EM damage. The results showed that failure location shifted to the interface of Cu interconnect and IMC joint. Unbalanced interdiffusion of Cu and Sn through IMC joint is the source of discontinuity formation, also known as the Kirkendall effect. 3) The investigation of micro solder joints isolated from Cu pillar by a Ni interfacial layer showed that the EM failure can be suppressed by the back-stress effect. Very thin thickness of micro solder joint along with low aspect ratio (thickness to length) makes the back-stress effect to be sufficient to prevent EM damage. The back-stress effect is found to be very sensitive to test temperature, and the back-stress effect diminishes at high temperature as it is outcompeted by EM rate of Sn. 4) Our study on fine pitched solder joint with cylindrical joint geometry leads to a finding of a unique failure mechanism caused by a formation of extended solid solution. The EM testing at extremely high current density causes interdiffusion of Cu and Sn to continue even after full conversion of the solder joint to the I MC. In this case, we observed that grain boundaries in Cu interconnects are the main routes of interdiffusion and responsible for the unique failure mechanism. Finally, our findings suggest the complexity of failure mechanism in this type of solder joint compared to conventional solder joints like BGA (ball grid array) or flip-chip joints. Small amount of solder material along with low aspect ratio of the joint makes the failure kinetics and mechanism to be very sensitive to test temperature and joint geometry. Our findings also suggest that failure mechanism of micro solder joint under EM cannot be understood by considering a single metallurgical process but demands considerations on various contributing factors.
Download or read book Bulletin of the Atomic Scientists written by and published by . This book was released on 1955-04 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Bulletin of the Atomic Scientists is the premier public resource on scientific and technological developments that impact global security. Founded by Manhattan Project Scientists, the Bulletin's iconic "Doomsday Clock" stimulates solutions for a safer world.
