Download or read book Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Download or read book Handbook of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf and published by Butterworth-Heinemann. This book was released on 2019-10-22 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Download or read book Assembly and Reliability of Lead Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Download or read book Lead Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Download or read book Proceedings written by and published by . This book was released on 2004 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 2000 with total page 920 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 1948 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fundamentals of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and published by Springer. This book was released on 2014-11-05 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2004 with total page 882 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book China written by World Bank and published by World Bank Publications. This book was released on 1993 with total page 1422 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Republic of Korea's industrial policy has directed that nation's economy through nearly three decades of spectacular growth. But the authors of this paper maintain that this policy is showing signs of being outmoded. The time has come, the authors argue, for the Korean government to stop managing the economy's structural development and to redefine the responsibilities of business and government. Under this proposed compact, the allocation of resources would shift from the government to the private industrial and financial sectors. The transformation of the government bureaucracy from an ad hoc policy role to one of a transparent and predictable regulator is a key to the success of this undertaking. These new directions would present the government with enormous challenges. Greater competitive discipline and regulatory oversight would be required. While dealing with the complexities of the transition, the government would have to maintain macroeconomic stability and the momentum of savings and investment. For comparison, the study examines the industrial economies of France, Germany, Japan, and the United States, which underwent similar shifts.
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Electronic Thin Film Reliability written by King-Ning Tu and published by Cambridge University Press. This book was released on 2010-11-25 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
