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Book Microwave Materials and Applications  2 Volume Set

Download or read book Microwave Materials and Applications 2 Volume Set written by Mailadil T. Sebastian and published by John Wiley & Sons. This book was released on 2017-05-08 with total page 1021 pages. Available in PDF, EPUB and Kindle. Book excerpt: The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.

Book Multilayered Low Temperature Cofired Ceramics  LTCC  Technology

Download or read book Multilayered Low Temperature Cofired Ceramics LTCC Technology written by Yoshihiko Imanaka and published by Springer Science & Business Media. This book was released on 2006-05-28 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.

Book Tunable Ferroelectric Meta material Phase Shifter Embedded Inside Low Temperature Co fired Ceramics  LTCC

Download or read book Tunable Ferroelectric Meta material Phase Shifter Embedded Inside Low Temperature Co fired Ceramics LTCC written by Hossam S. Tork and published by . This book was released on 2012 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation describes electrically tunable microwave devices utilizing low temperature co-fired ceramics (LTCC) and thick film via filled with the ferroelectric materials barium strontium titanate (BST) and barium zirconate titanate (BZT). Tunable ferroelectric capacitors, zero meta-material phase shifters, and tunable meta-material phase shifters are presented.

Book Tunable Materials with Applications in Antennas and Microwaves

Download or read book Tunable Materials with Applications in Antennas and Microwaves written by John N. Sahalos and published by Springer Nature. This book was released on 2022-06-01 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tunable Materials with Applications in Antennas and Microwaves is a stimulating topic in these modern times. With the explosion of the new generation of the wireless world, greater emphasis than ever before is being placed on the analysis and applications of modern materials. This book describes the characteristics of Ferrites and Ferroelectrics and introduces the reader to Multiferroics. Represents, in a simple manner, the solid state physics and explains the permittivity and permeability tensor characteristics for the tunable materials of infinite and finite dimensions. Gives the applications of tunable materials in resonators, filters, microstrips, striplines, antennas, phase shifters, capacitors, varactors, and frequency selective surfaces. Describes in detail the mathematical analysis for spin and magnetostatic waves for infinite medium, thin slab films, and finite circular discs. The analysis contains original work, which the reader may extend in the future. Provides multiferroics, which are ferrite and ferroelectric composites. Multiferroics are very promising tunable materials which are believed will offer many applications in the near future. Contains the planar transmission lines with analytic formulas for multilayer microstrips, transmission lines, and waveguides with isotropic as well as anisotropic dielectric and magnetic materials. Also, gives the formulas to analyze the layered category of transmission lines with multiferroics. This book is intended for antenna and microwave engineers as well as for graduate students of Materials Science and Engineering, Electrical & Computer Engineering, and Physics Departments.

Book Introduction To Modern Planar Transmission Lines

Download or read book Introduction To Modern Planar Transmission Lines written by Anand K. Verma and published by John Wiley & Sons. This book was released on 2021-06-02 with total page 946 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a comprehensive discussion of planar transmission lines and their applications, focusing on physical understanding, analytical approach, and circuit models Planar transmission lines form the core of the modern high-frequency communication, computer, and other related technology. This advanced text gives a complete overview of the technology and acts as a comprehensive tool for radio frequency (RF) engineers that reflects a linear discussion of the subject from fundamentals to more complex arguments. Introduction to Modern Planar Transmission Lines: Physical, Analytical, and Circuit Models Approach begins with a discussion of waves on transmission lines and waves in material medium, including a large number of illustrative examples from published results. After explaining the electrical properties of dielectric media, the book moves on to the details of various transmission lines including waveguide, microstrip line, co-planar waveguide, strip line, slot line, and coupled transmission lines. A number of special and advanced topics are discussed in later chapters, such as fabrication of planar transmission lines, static variational methods for planar transmission lines, multilayer planar transmission lines, spectral domain analysis, resonators, periodic lines and surfaces, and metamaterial realization and circuit models. Emphasizes modeling using physical concepts, circuit-models, closed-form expressions, and full derivation of a large number of expressions Explains advanced mathematical treatment, such as the variation method, conformal mapping method, and SDA Connects each section of the text with forward and backward cross-referencing to aid in personalized self-study Introduction to Modern Planar Transmission Lines is an ideal book for senior undergraduate and graduate students of the subject. It will also appeal to new researchers with the inter-disciplinary background, as well as to engineers and professionals in industries utilizing RF/microwave technologies.

Book Ceramic Interconnect Technology

Download or read book Ceramic Interconnect Technology written by and published by . This book was released on 2003 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Low Temperature Co fired Ceramic  LTCC  Substrate for High Temperature Microelectronics

Download or read book Low Temperature Co fired Ceramic LTCC Substrate for High Temperature Microelectronics written by Devin Alexander Smarra and published by . This book was released on 2017 with total page 74 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry is Low Temperature Co-fired Ceramic (LTCC). LTCC is a multi-layer design and packaging system that can embed passive components and thermal management structures within a substrate. This thesis compiles research done to evaluate LTCC as a high-performance electronic packaging technique by determining the performance of embedded passives and thermal management structures at temperatures from -55°C to 225°C. The passive structures and thermal management structures are evaluated using theoretical calculations, simulations, and measurements of fabricated devices.

Book A Low Temperature Co fired Ceramic  LTCC  Interposer Based Three dimensional Stacked Wire Bondless Power Module

Download or read book A Low Temperature Co fired Ceramic LTCC Interposer Based Three dimensional Stacked Wire Bondless Power Module written by Atanu Dutta and published by . This book was released on 2017 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless stack is realized with two stand-alone power modules in a half-bridge configuration. Each stand-alone power module consists of two 1200 V 25 A silicon insulated-gate bipolar transistor (IGBT) devices in parallel and two 1200 V 20 A Schottky barrier diodes (SBD) in an antiparallel configuration. A novel interconnection scheme with conductive clamps and a spring loaded LTCC interposer is introduced to establish electrical connection between the stand-alone power modules to connect them in series to realize a half-bridge stack. Process development to fabricate the LTCC based 3-D stack is performed. In traditional power modules, wire bonds are used as a top side interconnections that introduce additional parasitic inductance in the current conduction path and prone to failure mechanism under high thermomechanical stresses. The loop inductance of the proposed 3-D half-bridge module exhibits 71% lower parasitic inductance compared to a wire bonded module. The 3-D stack exhibits better switching performance compared to the wire bonded counterpart. The measurement results for the 3-D stack shows 30% decrease in current overshoot at turn-on and 43% voltage overshoot at turn-off compared to the wire bonded module. Through measurements, it has been shown that the conducted noise reduces by 20 dB in the frequency range 20-30 MHz for the 3-D stack compared to the wire bonded counterpart. A simulation methodology using co-simulation techniques using ANSYS EM software tools is developed to predict EMI of a power module. Hardware verification of the proposed simulation methodology is performed to validate the co-simulation technique. The correlation coefficient between the measurement and simulation is found to be 0.73. It is shown that 53% of the variability in the simulation can be explained by the simulated result. Moreover, the simulated and measured amplitudes of the EMI spectrum closely match with each other with some variations due to round-off errors due to the FFT conversion.

Book Asian Ceramic Science for Electronics III and Electroceramics in Japan XII

Download or read book Asian Ceramic Science for Electronics III and Electroceramics in Japan XII written by Tadashi Takenaka and published by Trans Tech Publications Ltd. This book was released on 2009-12-03 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This special collection brings to the reader the latest developments in the science and technology of electroceramics. It focuses on contributing to the exchange of Electroceramics knowledge; both scientific and industrial.

Book Low Temperature Cofired Ceramics  LTCC  Bandpass Filter and Integrated Passives Design

Download or read book Low Temperature Cofired Ceramics LTCC Bandpass Filter and Integrated Passives Design written by Joonhyung Chung and published by . This book was released on 2005 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Novel Low Temperature Cofired Ceramic Manufacturing Techniques for a Magnetron Field Emission Cathode

Download or read book Novel Low Temperature Cofired Ceramic Manufacturing Techniques for a Magnetron Field Emission Cathode written by Daylon Michael Black and published by . This book was released on 2019 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Low Temperature Cofired Ceramic (LTCC) is a material system that is ideal for integrated microelectronic packaging technology, because of its rapid prototyping and easy integration of passive components such as resistors, capacitors, and conductors. LTCC's electrical properties makes it especially suitable for high frequency applications such as magnetrons. Recently, there has been an increased demand for greater power capacities which is resolved by phase locking multiple low power (inexpensive) magnetrons together to achieve the same power as one high power (expensive) magnetron. The Vacuum Electron Devices (VED) and Ceramic Micro Electrical Mechanical Systems (CMEMS) labs at Boise State University have designed a new field emission cathode for the L3 Technologies industrial magnetron that will precisely inject electrons into the system. This controllable electron injection, has been shown by simulation to decrease startup times, increase efficiency, and even allow for active phase control during oscillation. In this research, new LTCC manufacturing techniques were developed in order to fabricate the newly designed cathode. Two different cathode wrapping techniques were compared and the layer by group technique was faster, more easily aligned, and had a shorter learning curve. Two different via filling techniques were compared and the flat fill technique was slightly slower but, more repeatable and was less likely to cause electrical shorting. Two different facet plate manufacturing techniques were compared and the mill technique was more precise and extremely repeatable. Four different stands were compared and the square post stand had the best circularity and linearity measurements of the fired cathode. Finally, the spiral embedded stripline line was prototyped and an elementary version was assembled which matched simulations."--Boise State University ScholarWorks.

Book LTCC

    Book Details:
  • Author : Reinhard Kulke
  • Publisher :
  • Release : 2001
  • ISBN :
  • Pages : 55 pages

Download or read book LTCC written by Reinhard Kulke and published by . This book was released on 2001 with total page 55 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Microwave Materials and Applications

Download or read book Microwave Materials and Applications written by Mailadil T. Sebastian and published by John Wiley & Sons. This book was released on 2017-03-02 with total page 1000 pages. Available in PDF, EPUB and Kindle. Book excerpt: The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.