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Book An Experimental Technique for the Study of the Mechanical Behavior of Thin Film Materials at Micro  and Nano scale

Download or read book An Experimental Technique for the Study of the Mechanical Behavior of Thin Film Materials at Micro and Nano scale written by Arash Tajik and published by . This book was released on 2008 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: An experimental technique has been presented to probe the mechanical behavior of thin film materials. The method is capable of tensile testing thin films on substrate and free-standing thin film specimens. A mechanical gripper was designed to address the current challenges in gripping thin film specimens. In order to measure the strain field across the gage section, the moire interferometry technique was used and the respective optical setup was designed. A versatile microfabrication process has been developed to fabricate free-standing dog-bone specimens. Aluminum was used as the model material; however, any other metallization material can be integrated in the process. Thin film specimens have been characterized using SEM, AFM, and TEM. A process has been developed to fabrication diffraction gratings on the specimen by FIB milling. Different grating geometries were fabricated and the diffraction efficiency of the gratings was characterized. The structural damage induced by the Ga+ ions during the FIB milling of the specimens was partially characterized using STEM and EDS. In order to extract the strain field information from the moire interferogram data, a numerical postprocessing technique was developed based on continuous wavelet transforms (CWT). The method was applied on simulated uniform and nonuniform strain fields and the wavelet parameters were tuned to achieve the best spatial localization and strain accuracy.

Book Experimental and Applied Mechanics  Volume 4

Download or read book Experimental and Applied Mechanics Volume 4 written by Cesar Sciammarella and published by Springer. This book was released on 2015-10-30 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: Experimental and Applied Mechanics, Volume 4 of the Proceedings of the 2015SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the fourth volume of nine from the Conference, brings together contributions to important areas of research and engineering. The collection presents early findings and case studies on a wide range of topics, including: Advanced Methods for Frontier Applications, Non-Homogeneous Parameters Identification, Teaching Experimental Mechanics in the 21st Century, Material Characterization and Testing, Mechanics of Interfaces Novel Applications of Experimental Mechanics

Book Microelectromechanical Systems and Devices

Download or read book Microelectromechanical Systems and Devices written by Nazmul Islam and published by BoD – Books on Demand. This book was released on 2012-03-28 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: The advances of microelectromechanical systems (MEMS) and devices have been instrumental in the demonstration of new devices and applications, and even in the creation of new fields of research and development: bioMEMS, actuators, microfluidic devices, RF and optical MEMS. Experience indicates a need for MEMS book covering these materials as well as the most important process steps in bulk micro-machining and modeling. We are very pleased to present this book that contains 18 chapters, written by the experts in the field of MEMS. These chapters are groups into four broad sections of BioMEMS Devices, MEMS characterization and micromachining, RF and Optical MEMS, and MEMS based Actuators. The book starts with the emerging field of bioMEMS, including MEMS coil for retinal prostheses, DNA extraction by micro/bio-fluidics devices and acoustic biosensors. MEMS characterization, micromachining, macromodels, RF and Optical MEMS switches are discussed in next sections. The book concludes with the emphasis on MEMS based actuators.

Book Micro and Nano Mechanical Testing of Materials and Devices

Download or read book Micro and Nano Mechanical Testing of Materials and Devices written by Fuqian Yang and published by Springer Science & Business Media. This book was released on 2009-02-28 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoscale and nanostructured materials have exhibited different physical properties from the corresponding macroscopic coarse-grained materials due to the size confinement. As a result, there is a need for new techniques to probe the mechanical behavior of advanced materials on the small scales. Micro and Nano Mechanical Testing of Materials and Devices presents the latest advances in the techniques of mechanical testing on the micro- and nanoscales, which are necessary for characterizing the mechanical properties of low-dimensional materials and structures. Written by a group of internationally recognized authors, this book covers topics such as: Techniques for micro- and nano- mechanical characterization; Size effects in the indentation plasticity; Characterization of low-dimensional structure including nanobelts and nanotubes; Characterization of smart materials, including piezoelectric materials and shape memory alloys; Analysis and modeling of the deformation of carbon-nanotubes. Micro and Nano Mechanical Testing of Materials and Devices is a valuable resource for engineers and researchers working in the area of mechanical characterization of advanced materials.

Book Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials

Download or read book Fundamental Studies of the Mechanical Behavior of Microelectronic Thin Film Materials written by William D. Nix and published by . This book was released on 1987 with total page 50 pages. Available in PDF, EPUB and Kindle. Book excerpt: A fundamental program of research on the mechanical properties of microelectronic thin film materials is underway at Stanford University. The work is being supported under AFOSR Grant No. 86-0051. In this interim Scientific Report, some of the progress made during the second year of the program is reviewed. We have made rapid progress since starting this development of new experimental techniques for measuring mechanical properties of thin films. That work led to several publications and to an equal number of invited oral presentations, both of which are listed at the end of this report. Now much of our work involves the use of these techniques to study mechanical properties of thin film materials of interest in microelectronics.

Book Thin Films  Volume 875

Download or read book Thin Films Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2014-06-05 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

Book MEMS and Nanotechnology  Volume 4

Download or read book MEMS and Nanotechnology Volume 4 written by Tom Proulx and published by Springer Science & Business Media. This book was released on 2011-05-21 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

Book Experimental and Applied Mechanics  Volume 6

Download or read book Experimental and Applied Mechanics Volume 6 written by Tom Proulx and published by Springer Science & Business Media. This book was released on 2011-05-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Experimental and Applied Mechanics represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Challenges in Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

Book Micromechanics and Nanoscale Effects

Download or read book Micromechanics and Nanoscale Effects written by Vasyl Michael Harik and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume consists of the state-of-the-art reports on new developments in micromechanics and the modeling of nanoscale effects, and is a companion book to the recent Kluwer volume on nanomechanics and mul- scale modeling (it is entitled Trends in Nanoscale Mechanics). The two volumes grew out of a series of discussions held at NASA Langley Research Center (LaRC), lectures and other events shared by many researchers from the national research laboratories and academia. The key events include the 2001 Summer Series of Round-Table Discussions on Nanotechnology at ICASE Institute (NASA LaRC) organized by Drs. V. M. Harik and M. D. Salas and the 2002 NASA LaRC Workshop on Multi-scale Modeling. The goal of these interactions was to foster collaborations between academic researchers and the ICASE Institute (NASA LaRC), a universi- based institute, which has pioneered world-class computational, theoretical and experimental research in the disciplines that are important to NASA. Editors gratefully acknowledge help of Ms. E. Todd (ICASE, NASA LaRC), the ICASE Director M. D. Salas and all reviewers, in particular, Dr. B. Diskin (ICASE/NIA, NASA LaRC), Prof. R. Haftka (University of Florida), Dr. V. M. Harik (ICASE/Swales Aerospace, NASA LaRC), Prof.

Book Transducers    01 Eurosensors XV

Download or read book Transducers 01 Eurosensors XV written by Ernst Obermeier and published by Springer. This book was released on 2016-05-12 with total page 1763 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.

Book MEMS Reliability

Download or read book MEMS Reliability written by Allyson L. Hartzell and published by Springer Science & Business Media. This book was released on 2010-11-02 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

Book Mechanics of Time Dependent Materials and Processes in Conventional and Multifunctional Materials  Volume 3

Download or read book Mechanics of Time Dependent Materials and Processes in Conventional and Multifunctional Materials Volume 3 written by Tom Proulx and published by Springer Science & Business Media. This book was released on 2011-05-21 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials; MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

Book The Plasticity of Metals at the Sub micrometer Scale and Dislocation Dynamics in a Thin Film

Download or read book The Plasticity of Metals at the Sub micrometer Scale and Dislocation Dynamics in a Thin Film written by Seok Woo Lee and published by Stanford University. This book was released on 2011 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnology has played a significant role in the development of useful engineering devices and in the synthesis of new classes of materials. For the reliable design of devices and for structural applications of materials with micro- or nano-sized features, nanotechnology has always called for an understanding of the mechanical properties of materials at small length scales. Thus, it becomes important to develop new experimental techniques to allow reliable mechanical testing at small scales. At the same time, the development of computational techniques is necessary to interpret the experimentally observed phenomena. Currently, microcompression testing of micropillars, which are fabricated by focused-ion beam (FIB) milling, is one of the most popular experimental methods for measuring the mechanical properties at the micrometer scale. Also, dislocation dynamics codes have been extensively developed to study the local evolution of dislocation structures. Therefore, we conducted both experimental and theoretical studies that shed new light on the factors that control the strength and plasticity of crystalline materials at the sub-micrometer scale. In the experimental work, we produced gold nanopillars by focused-ion beam milling, and conducted microcompression tests to obtain the stress-strain curves. Firstly, the size effects on the strength of gold nanopillars were studied, and "Smaller is Stronger" was observed. Secondly, we tried to change the dislocation densities to control the strength of gold nanopillars by prestraining and annealing. The results showed that prestraining dramatically reduces the flow strength of nanopillars while annealing restores the strength to the pristine levels. Transmission electron microscopy (TEM) revealed that the high dislocation density (~1015 m-2) of prestrained nanopillars significantly decreased after heavy plastic deformation. In order to interpret this TEM observation, potential dislocation source structures were geometrically analyzed. We found that the insertion of jogged dislocations before relaxation or enabling cross-slip during plastic flow are prerequisites for the formation of potentially strong natural pinning points and single arm dislocation sources. At the sub-micron scale, these conditions are most likely absent, and we argue that mobile dislocation starvation would occur naturally in the course of plastic flow. Two more outstanding issues have also been studied in this dissertation. The first involves the effects of FIB milling on the mechanical properties. Since micropillars are made by FIB milling, the damage layer at the free surface is always formed and would be expected to affect the mechanical properties at a sub-micron scale. Thus, pristine gold microparticles were produced by a solid-state dewetting technique, and the effects of FIB milling on both pristine and prestrained microparticles were examined via microcompression testing. These experiments revealed that FIB milling significantly reduces the strength of pristine microparticles, but does not alter that of prestrained microparticles. Thus, we confirmed that if there are pre-existing mobile-dislocations present in the crystal, FIB milling does not affect the mechanical properties. The second issue is the scaling law commonly used to describe the strength of micropillars as a function of sample size. For the scaling law, the power-law approximation has been widely used without understanding fundamental physics in it. Thus, we tried to analyze the power-law approximation in a quantitative manner with the well-known single arm source model. Material parameters, such as the friction stress, the anisotropic shear modulus, the magnitude of Burgers vector and the dislocation density, were explored to understand their effects on the scaling behavior. Considering these effects allows one to rationalize the observed material-dependent power-law exponents quantitatively. In another part of the dissertation, a computational study of dislocation dynamics in a free-standing thin film is described. We improved the ParaDiS (Parallel Dislocation Simulator) code, which was originally developed at the Lawrence Livermore National Laboratory, to deal with the free surface of a free-standing thin film. The spectral method was implemented to calculate the image stress field in a thin film. The faster convergence in the image stress calculation were obtained by employing Yoffe's image stress, which removes the singularity of the traction at the intersecting point between a threading dislocation and free surface. Using this newly developed code, we studied the stability of dislocation junctions and jogs, which are the potential dislocation sources, in a free standing thin film of a face-centered-cubic metal and discussed the creation of a dislocation source in a thin film. In summary, we have performed both microcompression tests and dislocation dynamics simulations to understand the dislocation mechanisms at the sub-micron scale and the related mechanical properties of metals. We believe that these experimental and computational studies have contributed to the enhancement of our fundamental knowledge of the plasticity of metals at the sub-micron scale.

Book Springer Handbook of Experimental Solid Mechanics

Download or read book Springer Handbook of Experimental Solid Mechanics written by William N. Sharpe, Jr. and published by Springer Science & Business Media. This book was released on 2008-12-04 with total page 1100 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.

Book High Pressure Surface Science and Engineering

Download or read book High Pressure Surface Science and Engineering written by Yury Gogotsi and published by CRC Press. This book was released on 2019-09-19 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: In many instances of mechanical interaction between two materials, the physical contact affects only the outermost surface layer, with little discernible influence on the bulk of the material. The resultant high pressures in these localised regimes can induce surface structural changes such as deformation, phase transformation and amorphization.

Book The Engineering Handbook

Download or read book The Engineering Handbook written by Richard C. Dorf and published by CRC Press. This book was released on 2018-10-03 with total page 3080 pages. Available in PDF, EPUB and Kindle. Book excerpt: First published in 1995, The Engineering Handbook quickly became the definitive engineering reference. Although it remains a bestseller, the many advances realized in traditional engineering fields along with the emergence and rapid growth of fields such as biomedical engineering, computer engineering, and nanotechnology mean that the time has come to bring this standard-setting reference up to date. New in the Second Edition 19 completely new chapters addressing important topics in bioinstrumentation, control systems, nanotechnology, image and signal processing, electronics, environmental systems, structural systems 131 chapters fully revised and updated Expanded lists of engineering associations and societies The Engineering Handbook, Second Edition is designed to enlighten experts in areas outside their own specialties, to refresh the knowledge of mature practitioners, and to educate engineering novices. Whether you work in industry, government, or academia, this is simply the best, most useful engineering reference you can have in your personal, office, or institutional library.

Book Nano Bio  Electronic  Photonic and MEMS Packaging

Download or read book Nano Bio Electronic Photonic and MEMS Packaging written by C. P.(Ching-Ping) Wong and published by Springer Nature. This book was released on 2021-03-17 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.