Download or read book Advancing MCM Technologies written by Evan E. Davidson and published by . This book was released on 1994 with total page 66 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advancing MCM Technology written by Daryl Ann Doane and published by . This book was released on 1994 with total page 109 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Application of MCM Technologies written by EC-MCM and published by . This book was released on 1999 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advanced Millimeter wave Technologies written by Duixian Liu and published by John Wiley & Sons. This book was released on 2009-04-06 with total page 866 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging

Download or read book Advanced Technology Workshop on MCM Test V written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book MCM C Mixed Technologies and Thick Film Sensors written by W.K. Jones and published by Springer. This book was released on 1995 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the NATO Advanced Research Workshop on `Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994

Download or read book Multichip Module Technologies and Alternatives The Basics written by Daryl Ann Doane and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Download or read book MCM Technology Development at MCC written by David Misunas and published by . This book was released on 1992 with total page 10 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Routing in the Third Dimension written by Naveed A. Sherwani and published by John Wiley & Sons. This book was released on 1995-03 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.

Download or read book Department of Defense Authorization for Appropriations for Fiscal Year 1998 and the Future Years Defense Program written by United States. Congress. Senate. Committee on Armed Services and published by . This book was released on 1997 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Integrated Circuit Industry written by Yangyuan Wang and published by Springer Nature. This book was released on 2023-12-29 with total page 2006 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.

Download or read book Hearings on National Defense Authorization Act for Fiscal Year 1998 H R 1119 and Oversight of Previously Authorized Programs Before the Committee on National Security House of Representatives One Hundred Fifth Congress First Session written by United States. Congress. House. Committee on National Security. Subcommittee on Military Research and Development and published by . This book was released on 1998 with total page 522 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Advanced Microsystems for Automotive Applications 99 written by Detlef E. Ricken and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 317 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microsystems are an important success factor in the automobile industry. In order to fulfil the customers requests for safety convenience and vehicle economy, and to satisfy environmental requirements, microsystems are becoming indispensable. Thus a large number of microsystem applications came into the discussion. With the international conference AMAA '99, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacturers.

Download or read book 3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-29 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Download or read book MCM C Mixed Technologies and Thick Film Sensors written by W.K. Jones and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Download or read book Microengineering Technology for Space Systems written by Henry Helvajian and published by AIAA. This book was released on 1997 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: A follow-on to Micro- and Nanotechnology for Space Systems, this second monograph in the series uses the more universal term microengineering to define the discipline and processes that lead to the development of an integrated and intelligent microinstrument. Microengineering Technology for Space Systems addresses specific issues concerning areas for ASIM application in current space systems, operation in the space environment, ultra-high-density packaging and nonsilicon materials-processing tools, and the feasibility of the nanosatellite concept.