Download or read book Advances in electronic circuit packaging 1 written by and published by . This book was released on 1960 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by Springer. This book was released on 2013-12-11 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-11 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by University of Colorado (Boulder campus) and published by . This book was released on 1964 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by and published by . This book was released on 1965 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by and published by . This book was released on 1969 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on 1962 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Advances in Electronic Circuit Packaging Volume 1 written by University of Colorado (Boulder campus) and published by . This book was released on 1962 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Download or read book Electronic Packaging of High Speed Circuitry written by Stephen G. Konsowski and published by McGraw Hill Professional. This book was released on 1997 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Download or read book Advances in Electronic Circuit Packaging written by Gerald A. Walker and published by . This book was released on with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Power Electronic Packaging written by Yong Liu and published by Springer Science & Business Media. This book was released on 2012-02-15 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by . This book was released on 1965 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Download or read book Advances in Electronic Circuit Packaging written by Michael A. Marrese and published by . This book was released on 1964 with total page 502 pages. Available in PDF, EPUB and Kindle. Book excerpt:
