Download or read book A Methodology for Measuring Strain in Power Semiconductors written by and published by . This book was released on 2015 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this work is to develop a strain measurement methodology for use in power electronics during electrical operation; such that strain models can be developed and used as the basis of an active strain controller - improving the reliability of power electronics modules. This research involves developing electronic speckle pattern interferometry (ESPI) into a technology capable of measuring thermal-mechanical strain in electrically active power semiconductors. ESPI is a non-contact optical technique capable of high resolution (approx. 10 nm) surface displacement measurements. This work has developed a 3-D ESPI test stand, where simultaneous in- and out-of-plane measured components are combined to accurately determine full-field surface displacement. Two cameras are used to capture both local (interconnect level) displacements and strains, and global (device level) displacements. Methods have been developed to enable strain measurements of larger loads, while avoiding speckle decorrelation (which limits ESPI measurement of large deformations). A method of extracting strain estimates directly from unfiltered and wrapped phase maps has been developed, simplifying data analysis. Experimental noise measurements are made and used to develop optimal filtering using model-based tracking and determined strain noise characteristics. The experimental results of this work are strain measurements made on the surface of a leadframe of an electrically active IGBT. A model-based tracking technique has been developed to allow for the optimal strain solution to be extracted from noisy displacement results. Also, an experimentally validated thermal-mechanical FE strain model has been developed. The results of this work demonstrate that in situ strain measurements in power devices are feasible. Using the procedures developed in the work, strain measurements at critical locations of strain, which limit device reliability, at relevant power levels can be completed.

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by United States. National Bureau of Standards and published by . This book was released on 1972-04 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by W. Murray Bullis and published by . This book was released on 1972 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by W. Murray Bullis and published by . This book was released on 1969 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Strain Metrology written by Terence K. S. Wong and published by Bentham Science Publishers. This book was released on 2012 with total page 141 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterizati

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by W. Murray Bullis and published by . This book was released on 1973 with total page 84 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by W. Murray Bullis and published by . This book was released on 1973 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Strain Effect in Semiconductors written by Yongke Sun and published by Springer Science & Business Media. This book was released on 2009-11-14 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: Strain Effect in Semiconductors: Theory and Device Applications presents the fundamentals and applications of strain in semiconductors and semiconductor devices that is relevant for strain-enhanced advanced CMOS technology and strain-based piezoresistive MEMS transducers. Discusses relevant applications of strain while also focusing on the fundamental physics pertaining to bulk, planar, and scaled nano-devices. Hence, this book is relevant for current strained Si logic technology as well as for understanding the physics and scaling for future strained nano-scale devices.

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by and published by . This book was released on 1971 with total page 64 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by United States. National Bureau of Standards and published by . This book was released on 1971 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Methods of Measurement for Semiconductor Materials Process Control and Devices written by W. Murray Bullis and published by . This book was released on 1971 with total page 60 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book NBS Special Publication written by and published by . This book was released on 1968 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Download or read book Publications of the National Bureau of Standards 1978 Catalog written by United States. National Bureau of Standards and published by . This book was released on 1979 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Publications written by United States. National Bureau of Standards and published by . This book was released on 1980 with total page 668 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Publications of the National Institute of Standards and Technology Catalog written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1977 with total page 746 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Devices Mechanical and Climatic Test Methods Board Level Drop Test Method Using a Strain Gauge written by British Standards Institute Staff and published by . This book was released on 1911-09-30 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor devices, Integrated circuits, Electronic equipment and components, Mechanical testing, Environmental testing, Surface mounting devices, Printed-circuit boards, Drop tests, Impact testing, Accelerated testing, Strain measurement