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Book Scientific and Technical Aerospace Reports

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1995 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.

Book Thermal Stress and Strain in Microelectronics Packaging

Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Book Embedded Mechatronic Systems 2

Download or read book Embedded Mechatronic Systems 2 written by Abdelkhalak El Hami and published by ISTE Press - Elsevier. This book was released on 2020-03-03 with total page 298 pages. Available in PDF, EPUB and Kindle. Book excerpt: Embedded Mechatronic Systems 2: Analysis of Failures, Modeling, Simulation and Optimization presents advances in research within the field of mechatronic systems, which integrates reliability into the design process. Providing many detailed examples, this book develops a characterization methodology for faults in mechatronic systems. It analyzes the multi-physical modeling of faults, revealing weaknesses in design and failure mechanisms. This development of meta-models enables us to simulate effects on the reliability of conditions of use and manufacture.

Book Low cycle Thermal Fatigue

Download or read book Low cycle Thermal Fatigue written by Gary R. Halford and published by . This book was released on 1986 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Ball Grid Array Technology

Download or read book Ball Grid Array Technology written by John H. Lau and published by McGraw Hill Professional. This book was released on 1995 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt: A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains bandw photos and diagrams. Annotation copyright by Book News, Inc., Portland, OR

Book Solder Joint Reliability

    Book Details:
  • Author : John H. Lau
  • Publisher : Springer Science & Business Media
  • Release : 1991-05-31
  • ISBN : 9780442002602
  • Pages : 504 pages

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 1991-05-31 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR

Book 10th International Conference on Turbochargers and Turbocharging

Download or read book 10th International Conference on Turbochargers and Turbocharging written by Institution of Mechanical Engineers and published by Elsevier. This book was released on 2012-05-11 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the papers from the latest international conference, following on from the highly successful previous conferences in this series held regularly since 1978. Papers cover all current and novel aspects of turbocharging systems design for boosting solutions for engine downsizing. The focus of the papers is on the application of turbocharger and other pressure charging devices to spark ignition (SI) and compression ignition (CI) engines in the passenger car and commercial vehicles. Novel boosting solutions for diesel engines operating in the industrial and marine market sectors are also included.The current emission legislations and environmental trends for reducing CO2 and fuel consumption are the major market forces in the transport (land and marine) and industry sectors. In these market sectors the internal combustion engine is the key product where downsizing is the driver for development for both SI and CI engines in the passenger car and commercial vehicle applications. The more stringent future market forces and environmental considerations mean more stringent engine downsizing, thus, novel systems are required to provide boosting solutions including hybrid, electric-motor and exhaust waste energy recovery systems for high efficiency, response, reliability, durability and compactness etc. For large engines the big challenge is to enhance the high specific power and efficiency whilst reducing emission levels (Nox and Sox) with variable quality fuels. This will require turbocharging systems for very high boost pressure, efficiency and a high degree of system flexibility. - Presents papers from all the latest international conference - Papers cover all aspects of the turbocharging systems design for boosting solutions for engine downsizing - The focus of the papers is on the application of turbocharger and other pressure charging devices to spark ignition (SI) and compression ignition (CI) engines in the passenger car and commercial vehicles

Book Advances in Multiaxial Fatigue

Download or read book Advances in Multiaxial Fatigue written by David L. McDowell and published by ASTM International. This book was released on 1993 with total page 455 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers presented at the ASTM Symposium on Multiaxial Fatigue, held in San Diego, November 1991, to communicate the most recent international advances in multiaxial cyclic deformation and fatigue research as well as applications to component analysis and design. The 24 papers are grouped into five ca

Book Paper

Download or read book Paper written by and published by . This book was released on 1995 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Component Reliability under Creep Fatigue Conditions

Download or read book Component Reliability under Creep Fatigue Conditions written by Janos Ginsztler and published by Springer. This book was released on 2014-05-04 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure prevention, residual life assessment and life extension of materials in components operating at high temperatures are becoming increasingly important problems in the modern power plant industry. These problems are covered, and industrial examples will be introduced to illustrate the applications of those subjects covered using the results from service records.

Book NASA Technical Paper

Download or read book NASA Technical Paper written by and published by . This book was released on 1984 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Proceedings

Download or read book Proceedings written by and published by . This book was released on with total page 978 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Low Cycle Fatigue and Elasto Plastic Behaviour of Materials

Download or read book Low Cycle Fatigue and Elasto Plastic Behaviour of Materials written by K.T. Rie and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 781 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1979 the first InternationalSymposium on Low CycleFatigue and Elasto-Plastic Behaviour of Materials was held in Stuttgart, FRG. Since then research in low cycle fatigue has proceeded rapidly. The vital interest of engineers and researchers in communicating the rapid advances in the ongoing research in low cycle fatigue has encouraged me to initiate again the Second International Conference which was held in Munich, FRG, 7-11 September 1987. Failure in low cycle fatigue represents a serious problem in the design and opera tion of highly stressed structures. Under complex loading and environmental cir cumstances, especially for high temperature services, reliable life prediction can not be expected without detailed consideration of the failure mechanism and with out extensive use of mechanistic approaches. The purpose of this conference was to provide a forum to discuss the advances in recent research in the field of low cycle fatigue. The conference was intended to help to further bridge the gap between those who are involved in basic research, and the engineers who have to perform the design of highly stressed structural components.

Book Low Cycle Fatigue

Download or read book Low Cycle Fatigue written by Harvey D. Solomon and published by ASTM International. This book was released on 1988 with total page 1289 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Recent Trends in Processing and Degradation of Aluminium Alloys

Download or read book Recent Trends in Processing and Degradation of Aluminium Alloys written by Zaki Ahmad and published by BoD – Books on Demand. This book was released on 2011-11-21 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the recent decade a quantum leap has been made in production of aluminum alloys and new techniques of casting, forming, welding and surface modification have been evolved to improve the structural integrity of aluminum alloys. This book covers the essential need for the industrial and academic communities for update information. It would also be useful for entrepreneurs technocrats and all those interested in the production and the application of aluminum alloys and strategic structures. It would also help the instructors at senior and graduate level to support their text.

Book Damage Mechanisms and Life Assessment of High Temperature Components

Download or read book Damage Mechanisms and Life Assessment of High Temperature Components written by Ramaswamy Viswanathan and published by ASM International. This book was released on 1989 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Fatigue under Thermal and Mechanical Loading  Mechanisms  Mechanics and Modelling

Download or read book Fatigue under Thermal and Mechanical Loading Mechanisms Mechanics and Modelling written by J. Bressers and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Symposium "Fatigue under Thermal and Mechanical Loading", held at Petten (The Netherlands) on May 22-24, 1995, was jointly organized by the Institute for Advanced Materials of The Joint Research Centre, E. C. , and by the Societe Fran~se de Metallurgie et de Materiaux. The fast heating and cooling cycles experienced by many high temperature components cause thermally induced stresses, which often operate in combination with mechanical loads. The resulting thermal / mechanical fatigue cycle leads to material degradation mechanisms and failure modes typical of service cycles. The growing awareness that the synergism between the combined thermal and mechanical loads can not be reproduced by means of isothermal tests, has resulted in an increasing interest in thermal and thermo-mechanical fatigue testing. This trend has been reinforced by the constant pull by industry for more performant, yet safer high temperature systems, pushing the materials to the limit of their properties. Dedicated ASTM meetings in particular have set the scene for this area of research. The proceedings of the symposium organized by D. A. Spera and D. F. Mowbray in 1975 provided a reference book on thermal fatigue which reflects the knowledge and experimental capabilities of the mid-seventies.