Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Download or read book Essentials of RF Front end Design and Testing written by Ibrahim A. Haroun and published by John Wiley & Sons. This book was released on 2023-12-19 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: Essentials of RF Front-end Design and Testing Highly comprehensive text delivering the RF system essentials required to understand, develop, and evaluate the performance of RF wireless systems Essentials of RF Front-end Design and Testing: A Practical Guide for Wireless Systems is a system-oriented book which provides several wireless communication disciplines in one volume. The book covers a wide range of topics, including antenna fundamentals, phased array antenna and MIMOs that are crucial for the latest 5G mmWave and future 6G wireless systems, high-frequency transmission lines, RF building blocks that are necessary to understand how various RF subsystems are interrelated and implemented in wireless systems, and test setups for conducted and Over-The-Air (OTA) transmitter and receiver tests. The text enables readers to understand, develop, and evaluate the performance of RF wireless systems. The text focuses on RF system performance and testing rather than mathematical proofs, which are available in the provided references. Although the book is intended for testing and building RF system prototypes, it has the sufficient theoretical background needed for RF systems design and testing. Each chapter includes learning objectives, review questions, and references. Sample topics covered in the book include: An overview of cellular phone systems, 5G NR wireless technology, MIMO technology, terahertz communications for 6G wireless technology, and modulation and multiplexing Analog and digital modulation techniques, including AM, SSB, FM, FSK, PSK, QAM, SSFH, DSSS, and OFDM High-frequency transmission lines, S-parameters, low-noise amplifier, RF mixers, filters, power amplifiers, frequency synthesizers, circulators/isolators, directional couplers, RF switches, and RF phase shifters Antenna basics, including antenna gain, radiation pattern, input impedance, polarization, and antenna noise temperature; microstrip antenna, antenna array, propagation path loss, compact antenna test range (CATR), and test setups for antenna measurements. Basics of MIMO and beamforming technology, including analog, digital, and hybrid beamforming Test setups for characterizing the key RF performance parameters of 5G New Radio base station transmitters and receivers. Essentials of RF Front-end Design and Testing: A Practical Guide for Wireless Systems is a highly comprehensive resource on the subject and is intended for graduate engineers and technologists involved in designing, developing, and testing wireless systems, along with undergraduate/graduate students, enhancing their learning experience of RF subsystems/systems characterization.

Download or read book Encyclopedia of Thermal Packaging Set 1 Thermal Packaging Techniques a 6 Volume Set written by Avram Bar-Cohen and published by World Scientific. This book was released on 2012-02-01 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.

Download or read book EPTC written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2013 IEEE 15th Electronics Packaging Technology Conference EPTC 2013 written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronics Packaging Technology Conference written by and published by Springer. This book was released on 2004 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book International Conference on Innovative Computing and Communications written by Ashish Khanna and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes high-quality research papers presented at the Fourth International Conference on Innovative Computing and Communication (ICICC 2021), which is held at the Shaheed Sukhdev College of Business Studies, University of Delhi, Delhi, India, on February 20-21, 2021. Introducing the innovative works of scientists, professors, research scholars, students and industrial experts in the field of computing and communication, the book promotes the transformation of fundamental research into institutional and industrialized research and the conversion of applied exploration into real-time applications.

Download or read book Fluid Mechanics and Fluid Power written by T. Prabu and published by Springer Nature. This book was released on 2021-08-03 with total page 901 pages. Available in PDF, EPUB and Kindle. Book excerpt: div="" style="" This book comprises select proceedings of the 46th National Conference on Fluid Mechanics and Fluid Power (FMFP 2019). The contents of this book focus on aerodynamics and flow control, computational fluid dynamics, fluid structure interaction, noise and aero-acoustics, unsteady and pulsating flows, vortex dynamics, nuclear thermal hydraulics, heat transfer in nanofluids, etc. This book serves as a useful reference beneficial to researchers, academicians and students interested in the broad field of mechanics. ^

Download or read book Advances in Polymer Processing 2020 written by Christian Hopmann and published by Springer Nature. This book was released on 2020-03-10 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers the proceedings of the International Symposium on Plastics Technology, which was held on March 10, 2020 in Aachen, Germany, and was organised by the Institute for Plastics Processing (IKV) in Industry and Craft at RWTH Aachen University. Peer-reviewed by an international scientific committee, the conference proceedings comprise the papers presented by the international speakers. Topics covered include - circular economy- extrusion- lightweight technologies- simulation and digitisation - injection moulding- hybrid materials and additive manufacturing. In these fields, key themes for plastics technologies have been identified that will shape the face of research and industry for the next decade. In their contributions, the authors present the latest scientific findings, and discuss topical issues in plastics technologies. The symposium offered an inspiring forum for the exchange on research and innovation, for discussing urgent questions and providing impulses for the future of plastics technology.

Download or read book Proceedings of 3rd Electronics Packaging Technology Conference EPTC 2000 written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.

Download or read book 2015 IEEE 17th Electronics Packaging and Technology Conference EPTC written by Electronics Packaging and Technology Conference and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Advanced Packaging, TSV Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials and Processes, Electrical Modeling and Simulations Mechanical Modeling and Simulations Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer Package Testing & Characterization.

Download or read book Vegetable Oils in Food Technology written by Frank D. Gunstone and published by CRC Press. This book was released on 2002-10-18 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: Vegetable Oils in Food Technology focuses on the major sources of lipids and the micronutrients that they contain. The book provides accessible, concentrated information on the composition, properties, and uses of the vegetable oils commonly found in the food industry. It includes modifications of these oils that are commercially available by means of partial hydrogenation, fractionation, and seed breeding. The major food uses are linked, wherever possible, to the composition and properties of the oils.

Download or read book Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference EPTC written by EPTC and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Advanced Packaging Flip chip, multiple array leadframe package, POP, embedded passives and actives on substrates, System in Packaging, etc TSV Wafer Level Packaging Wafer level packaging (Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar technology, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Substrates Leadframes Including all that polymer and solder materials, and Substrates Interposer Leadframes PCB etc Processes and Automation Equipments new process development as well as equipment automation development Electrical M.

Download or read book 2012 IEEE 14th Electronics Packaging Technology Conference written by IEEE Staff and published by . This book was released on 2012-12-08 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lead Free Soldering in Electronics written by Katsuaki Suganuma and published by CRC Press. This book was released on 2003-12-11 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Download or read book 2014 IEEE 16th Electronics Packaging Technology Conference EPTC written by IEEE Staff and published by . This book was released on 2014-12-03 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging, TSV Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials & Processes, Electrical Modeling & Simulations Mechanical Modeling & Simulations Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer Package Testing & Characterization