Download or read book 2021 22nd International Conference on Electronic Packaging Technology ICEPT written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Organic and Inorganic Light Emitting Diodes written by T.D. Subash and published by CRC Press. This book was released on 2023-06-19 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.

Download or read book Transactions on Intelligent Welding Manufacturing written by Shanben Chen and published by Springer Nature. This book was released on 2024-01-26 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: The primary aim of this volume is to provide researchers and engineers from both academic and industry with up-to-date coverage of new results in the field of robotic welding, intelligent systems and automation. The book is mainly based on papers selected from the 2022 International Conference on Robotic Welding, Intelligence and Automation (RWIA’2022) in Shanghai and Lanzhou, China. The articles show that the intelligentized welding manufacturing (IWM) is becoming an inevitable trend with the intelligentized robotic welding as the key technology. The volume is divided into four logical parts: Intelligent Techniques for Robotic Welding, Sensing of Arc Welding Processing, Modeling and Intelligent Control of Welding Processing, as well as Intelligent Control and its Applications in Engineering.

Download or read book The Proceedings of the 17th Annual Conference of China Electrotechnical Society written by Jian Li and published by Springer Nature. This book was released on 2023-03-31 with total page 1411 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding papers presented at the 17th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 17 to 18, 2022. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.

Download or read book Proceedings of the Eighth Asia International Symposium on Mechatronics written by Baoyan Duan and published by Springer Nature. This book was released on 2022-07-12 with total page 2195 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.

Download or read book Security Privacy and Data Analytics written by Udai Pratap Rao and published by Springer Nature. This book was released on 2023-09-19 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes refereed proceedings of the International Conference on Security, Privacy and Data Analytics, ISPDA 2022. The volume covers topics, including big data and analytics, cloud security and privacy, data intelligence, hardware security, network security, blockchain technology and distributed ledger, machine learning for security, and many others. The volume includes novel contributions and the latest developments from researchers across industry and academia working in security, privacy, and data analytics from technological and social perspectives. This book will emerge as a valuable reference for researchers, instructors, students, scientists, engineers, managers, and industry practitioners across the globe.

Download or read book Engineering Applications of Neural Networks written by Lazaros Iliadis and published by Springer Nature. This book was released on with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Download or read book Machine Learning based Design and Optimization of High Speed Circuits written by Vazgen Melikyan and published by Springer Nature. This book was released on 2024-01-31 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.

Download or read book Electrochemistry Editor s Pick 2021 written by Nosang Vincent Myung and published by Frontiers Media SA. This book was released on 2021-06-23 with total page 131 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Download or read book Enabling Industry 4 0 through Advances in Mechatronics written by Ismail Mohd. Khairuddin and published by Springer Nature. This book was released on 2022-05-14 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents part of the iM3F 2021 proceedings from the mechatronics track. It highlights key challenges and recent trends in mechatronics engineering and technology that are non-trivial in the age of Industry 4.0. It discusses traditional as well as modern solutions that are employed in the multitude spectra of mechatronics-based applications. The readers are expected to gain an insightful view on the current trends, issues, mitigating factors as well as solutions from this book.

Download or read book Interconnect Technologies for Integrated Circuits and Flexible Electronics written by Yash Agrawal and published by Springer Nature. This book was released on 2023-10-17 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Download or read book 2020 21st International Conference on Electronic Packaging Technology ICEPT written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Soft Robotics written by and published by Academic Press. This book was released on 2021-07-07 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soft Robotics aims at providing state of art on research and potential approaches of soft robotics. It particularly challenges the traditional thinking of engineers, as the confluence of technologies, ranging from new materials, sensors, actuators and production techniques to new design tools, will make it possible to create new systems whose structures are almost completely made of soft materials, which bring about entirely new functions and behaviors, similar in many ways to natural systems. This is a huge research topic, "hot and with a huge potential due to new possibilities offered by these systems to cope with problems that cannot be addressed by robots built from rigid bodies. - Chemical engineering can take part to the emerging field of soft robotics - Soft and polymer materials can be used in sensing applications - Soft robotics can solve many industrial issues and challenges

Download or read book Proceedings of 2022 Chinese Intelligent Systems Conference written by Yingmin Jia and published by Springer Nature. This book was released on 2022-09-26 with total page 916 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 18th Chinese Intelligent Systems Conference, CISC 2022, which was held during October 15–16, 2022, in Beijing, China. The papers in these proceedings deal with various topics in the field of intelligent systems and control, such as multi-agent systems, complex networks, intelligent robots, complex system theory and swarm behavior, event-triggered control and data-driven control, robust and adaptive control, big data and brain science, process control, intelligent sensor and detection technology, deep learning and learning control guidance, navigation and control of aerial vehicles.

Download or read book Smart Multifunctional Nano inks written by Ram K. Gupta and published by Elsevier. This book was released on 2022-10-26 with total page 728 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart Multifunctional Nano-inks: Fundamentals and Emerging Applications covers nano-inks and how they can be used in inkjet printers for printing complex circuitry on flexible substrates or as a paste for 3D printers. Microstructures can be 3D-printed using nano-inks in a combination of high-resolution plasma printing and subsequent rotogravure printing. In addition, smart multifunctional nano-inks are not only required for the electronic, but also in other applications, such as for secure inks, for currency, and in immigration documents. This book focuses on fundamental design concepts, promising applications, and future challenges of nano-inks in various areas, such as optoelectronics, energy, security and biomedical fields. The current challenge for the successful industrial application of nano-inks is in the preparation of a stable dispersion of advanced materials for nano-inks. The functionalization, synthesizing, and theoretical modeling provide the solution for most of the current issues, but there are still remaining challenges which are covered in this comprehensive resource. - Outlines the major nanomaterials used in the manufacture of smart nano-inks - Provides information on the major industrial applications of nano-inks - Assesses the major challenges of using nano-inks in a cost-effective way, and on an industrial scale