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Book 2020 21st International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2020 21st International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2016 17th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2016 17th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Computational Science     ICCS 2021

Download or read book Computational Science ICCS 2021 written by Maciej Paszynski and published by Springer Nature. This book was released on 2021-06-09 with total page 592 pages. Available in PDF, EPUB and Kindle. Book excerpt: The six-volume set LNCS 12742, 12743, 12744, 12745, 12746, and 12747 constitutes the proceedings of the 21st International Conference on Computational Science, ICCS 2021, held in Krakow, Poland, in June 2021.* The total of 260 full papers and 57 short papers presented in this book set were carefully reviewed and selected from 635 submissions. 48 full and 14 short papers were accepted to the main track from 156 submissions; 212 full and 43 short papers were accepted to the workshops/ thematic tracks from 479 submissions. The papers were organized in topical sections named: Part I: ICCS Main Track Part II: Advances in High-Performance Computational Earth Sciences: Applications and Frameworks; Applications of Computational Methods in Artificial Intelligence and Machine Learning; Artificial Intelligence and High-Performance Computing for Advanced Simulations; Biomedical and Bioinformatics Challenges for Computer Science Part III: Classifier Learning from Difficult Data; Computational Analysis of Complex Social Systems; Computational Collective Intelligence; Computational Health Part IV: Computational Methods for Emerging Problems in (dis-)Information Analysis; Computational Methods in Smart Agriculture; Computational Optimization, Modelling and Simulation; Computational Science in IoT and Smart Systems Part V: Computer Graphics, Image Processing and Artificial Intelligence; Data-Driven Computational Sciences; Machine Learning and Data Assimilation for Dynamical Systems; MeshFree Methods and Radial Basis Functions in Computational Sciences; Multiscale Modelling and Simulation Part VI: Quantum Computing Workshop; Simulations of Flow and Transport: Modeling, Algorithms and Computation; Smart Systems: Bringing Together Computer Vision, Sensor Networks and Machine Learning; Software Engineering for Computational Science; Solving Problems with Uncertainty; Teaching Computational Science; Uncertainty Quantification for Computational Models *The conference was held virtually.

Book 2017 18th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2017 18th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2017-04-03 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems

Book Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE   2012 13th International Conference on

Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2012 13th International Conference on written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2014 15th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE 2014

Download or read book 2014 15th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 written by and published by . This book was released on 2014 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2017 18th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2017 18th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Latest Advances in Electrothermal Models

Download or read book Latest Advances in Electrothermal Models written by Krzysztof Górecki and published by MDPI. This book was released on 2021-03-17 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.

Book Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE   2011 12th International Conference on

Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2011 12th International Conference on written by and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2013 14th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2013 14th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Electrical Insulation Society Staff and published by . This book was released on 2013-04-14 with total page 669 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2012 13th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2012 13th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE   2013 14th International Conference on

Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2013 14th International Conference on written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2012 EuroSimE International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Micro Electronics and Micro Systems

Download or read book 2012 EuroSimE International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Micro Electronics and Micro Systems written by and published by . This book was released on 2013 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2015 16th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE

Download or read book 2015 16th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2015-04-19 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems

Book 2015 16th International Conference on Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE 2015

Download or read book 2015 16th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2015 written by and published by . This book was released on 2015 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation, EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems

Book Thermal  Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems  EuroSimE   2015 16th International Conference on

Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2015 16th International Conference on written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: