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Book 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS

Download or read book 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2019-10-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society

Book EPEPS 2019

Download or read book EPEPS 2019 written by and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Leonove

    Leonove

    Book Details:
  • Author :
  • Publisher :
  • Release : 1979
  • ISBN :
  • Pages : pages

Download or read book Leonove written by and published by . This book was released on 1979 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book EPEPS 2010

Download or read book EPEPS 2010 written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book EPEPS 2020

Download or read book EPEPS 2020 written by and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book EPEPS

    EPEPS

    Book Details:
  • Author : Institute of Electrical and Electronics Engineers
  • Publisher :
  • Release : 2017
  • ISBN :
  • Pages : 698 pages

Download or read book EPEPS written by Institute of Electrical and Electronics Engineers and published by . This book was released on 2017 with total page 698 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

Download or read book 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2011 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book EPEPS 2018

    EPEPS 2018

    Book Details:
  • Author :
  • Publisher :
  • Release : 2018
  • ISBN :
  • Pages : pages

Download or read book EPEPS 2018 written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Exploration of semiconductor Product

Download or read book Exploration of semiconductor Product written by Andrew .J and published by Andrew .J. This book was released on 2024-05-11 with total page 591 pages. Available in PDF, EPUB and Kindle. Book excerpt: The semiconductor market refers to the industry involved in the design, development, manufacturing, and distribution of semiconductors, which are the building blocks of electronic devices. Semiconductors are materials with electrical conductivity between that of conductors (such as metals) and insulators (such as plastics). They are primarily made of silicon, although other materials like gallium arsenide, germanium, and indium phosphide are also used. The semiconductor market has experienced significant growth over the years due to the increasing demand for electronic devices and advancements in technology. The market is driven by various factors such as the growing demand of smartphones and mobile devices, the expansion of the automotive industry, the rise of Internet of Things (IoT) devices, and the development of emerging technologies like artificial intelligence (AI), virtual reality (VR), and autonomous vehicles, etc. To sum up, the semiconductor market is a dynamic and rapidly evolving industry that plays a critical role in shaping the modern technological landscape. Its growth is driven by advancements in various sectors, and it continues to be a key enabler of innovation and technological progress. The range of individual technological elements necessary for the semiconductor industry is extensive, leading to the publication of numerous technical books across various domains. (while it is understandable that advanced technologies specific to each company are not publicly disclosed due to concerns regarding potential leaks) These publications have undeniably played a significant role in aiding professionals and students for establishing a solid foundation of knowledge. In addition to the importance of individual technologies, it is necessary to examine what final products emerge as these technologies converge. While consumer electronics such as PCs and smartphones vary, there are common aspects among the semiconductor products that constitute them. Should one seek more comprehensive materials, it often entails a costly purchase of white paper. In this book, we aim to delve into a more in-depth discussion of the semiconductor market, with an emphasis on the product perspective. To accomplish this, we will extensively draw upon various academic and market resources. Additionally, in order to foster a comprehensive understanding of the market, it is necessary to have a certain level of familiarity with technical elements. Therefore, some technical explanations alongside the discussions is provided. In this book, we primarily focus on the FAB (Fabrication) domain. This book is divided into three major parts. Part 1 provides an overview of the semiconductor market, covering the definition, significance, supply chain structure, regional characteristics, challenges, and more within the semiconductor industry. Part 2, the major portion of this book, offers a comprehensive explanation of the most widely used types of semiconductor products. Particularly high market share products, notably Microcomponents, APs, and memory semiconductors, will have separate in-depth descriptions provided in the appendix. Finally, Part 3 will outline the general process by which these products are designed, focusing on a typical perspective, up to the stage just before Foundry.