Download or read book 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2018 written by and published by . This book was released on 2018 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2017-10-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: PEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs
Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2020-10-05 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society and IEEE Microwave Theory and Techniques Society
Download or read book 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2016-10-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm wave applications
Download or read book 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2019-10-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society
Download or read book IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems 2014 written by and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Bio Inspired Technology written by Ruby Srivastava and published by BoD – Books on Demand. This book was released on 2019-09-18 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomimetic devices are designed and produced by materials, structures, and systems that are modelled on biological entities and processes. These devices are used to synthesize novel materials and their functions at the multiscale level for various applications. Molecular computing biological devices play a key role in the logical processing of the cellular machinery of all living organisms. This book includes information on both biomedical and technological applications of bioactive devices for hard tissue regeneration; design of chip-based disease diagnostic platforms; neuromorphic computing biomaterials that transfer techniques of neuroscience to a silicon chip; various top-down and bottom-up designs; and electrical characterization and transport mechanisms of DNA as nanowires.
Download or read book Advances and Trends in Artificial Intelligence Theory and Applications written by Hamido Fujita and published by Springer Nature. This book was released on with total page 525 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Machine Learning based Design and Optimization of High Speed Circuits written by Vazgen Melikyan and published by Springer Nature. This book was released on 2024-01-31 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.
Download or read book EPEPS 2010 written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2014 written by and published by . This book was released on 2014 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2022-10-09 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnects and packaging structures of electronic systems covering all pertinent applications and wide range of frequency including digital, RF, microwave, mm wave and optical applications
Download or read book 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2014 written by and published by . This book was released on 2014 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Embedded and Fan Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
