Download or read book 2017 18th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2017 18th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2017-04-03 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems
Download or read book Thermal and Electro thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2020 21st International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2020-07-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: electronic components, materials, packaging, integration, microfluidics, mems, sensors, microelectronics, nanoelectronics
Download or read book Proceedings of 10th International Conference on Recent Advances in Civil Aviation written by Oleg Anatolyevich Gorbachev and published by Springer Nature. This book was released on 2022-10-19 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt: The volume comprises proceedings of the 10th International Conference on Recent Advances in Civil Aviation. The contents focus on air traffic control and management, quality control and reliability improvement of radio equipment and avionics, designing and testing aircraft assemblies and mechanisms, reliability improvement of aircraft management systems, aviation enterprise management, etc. There is also emphasis on the current problems and prospects for development of unmanned aircraft systems. This volume will be beneficial to researchers, practitioners, and policy-makers alike.
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
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Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2011 12th International Conference on written by and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Thermal Mechanical and Multi Physics Simulation Experiments in Microelectronics and Micro Systems 2007 EuroSime 2007 International Conference on written by Institute of Electrical and Electronics Engineers and published by . This book was released on 2007 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2013 14th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Electrical Insulation Society Staff and published by . This book was released on 2013-04-14 with total page 669 pages. Available in PDF, EPUB and Kindle. Book excerpt:
