Download or read book 2016 International Conference on Simulation of Semiconductor Processes and Devices SISPAD written by IEEE Staff and published by . This book was released on 2016-09-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Following the 20 years tradition of the SISPAD conference series as the leading forum for Technology Computer Aided Design (TCAD), the conference provides an opportunity for the presentation and discussion of recent advances in modeling and simulation of semiconductor devices, processes and equipment The scientific program consists of invited and contributed presentations and a poster session Companion workshops are planned for September 5, 2016
Download or read book SISPAD 2016 written by Eberhard Bär and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2003 IEEE International Conference on Simulation of Semiconductor Processes and Devices written by and published by IEEE Computer Society Press. This book was released on 2003 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Taken from the proceedings of the 2003 International Conference of the Simulation of Semiconductor Processes and Devices (SISPAD 2003), this volume looks at electron devices.
Download or read book 1997 International Conference on Simulation of Semiconductor Processes and Devices written by and published by . This book was released on 1997 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book SISPAD 2017 written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2000 International Conference on Simulation of Semiconductor Processes and Devices written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2000. Topics include: device simulation; quantum effects and novel devices; process simulation; lithography simulation; user interfaces and visualization; calibration; and more.
Download or read book 1997 International Conference on Simulation of Semiconductor Processes and Devices written by IEEE Electron Devices Society and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997-01-01 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: This conference is aimed at providing an opportunity for presentation and discussion of topics in process, device and circuit modelling for semiconductors. The proceedings contains all papers presented and should serve as a source for scientists and engineers engaged in research and development.
Download or read book 2014 International Conference on Simulation of Semiconductor Processes and Devices SISPAD written by Institute of Electrical and Electronics Engineers and published by . This book was released on 2014 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Non volatile Memory and Storage Technology written by Yoshio Nishi and published by Woodhead Publishing. This book was released on 2019-06-15 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Nonvolatile Memory and Storage Technology, Second Edition, addresses recent developments in the non-volatile memory spectrum, from fundamental understanding, to technological aspects. The book provides up-to-date information on the current memory technologies as related by leading experts in both academia and industry. To reflect the rapidly changing field, many new chapters have been included to feature the latest in RRAM technology, STT-RAM, memristors and more. The new edition describes the emerging technologies including oxide-based ferroelectric memories, MRAM technologies, and 3D memory. Finally, to further widen the discussion on the applications space, neuromorphic computing aspects have been included. This book is a key resource for postgraduate students and academic researchers in physics, materials science and electrical engineering. In addition, it will be a valuable tool for research and development managers concerned with electronics, semiconductors, nanotechnology, solid-state memories, magnetic materials, organic materials and portable electronic devices. Discusses emerging devices and research trends, such as neuromorphic computing and oxide-based ferroelectric memories Provides an overview on developing nonvolatile memory and storage technologies and explores their strengths and weaknesses Examines improvements to flash technology, charge trapping and resistive random access memory
Download or read book SISPAD 2017 written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2013 International Conference on Simulation of Semiconductor Processes and Devices SISPAD written by IEEE Electrical Insulation Society Staff and published by . This book was released on 2013-09-03 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2015 International Conference on Simulation of Semiconductor Processes and Devices SISPAD written by IEEE Staff and published by . This book was released on 2015-09-09 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: SISPAD provides an international forum for the presentation of leading edge research, development, and application in all areas of process and device simulation SISPAD is one of the longest running conferences devoted exclusively to TCAD and advanced modeling of novel semiconductor devices and nano electronic structures Topics for original contributions to SISPAD include just about every conceivable aspect of modelling & simulation of nanoelectronics
Download or read book Simulation of Semiconductor Processes and Devices 2007 written by Tibor Grasser and published by Springer Science & Business Media. This book was released on 2007-09-18 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presentaƯ tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad specƯ trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites
Download or read book Simulation of Semiconductor Processes and Devices 2004 written by Gerhard Wachutka and published by Springer. This book was released on 2011-03-30 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fabless Semiconductor Manufacturing written by Chinmay K. Maiti and published by CRC Press. This book was released on 2022-11-17 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Download or read book Stress and Strain Engineering at Nanoscale in Semiconductor Devices written by Chinmay K. Maiti and published by CRC Press. This book was released on 2021-06-29 with total page 275 pages. Available in PDF, EPUB and Kindle. Book excerpt: Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.
Download or read book 2010 International Conference on Simulation of Semiconductor Processes and Devices SISPAD 2010 written by Institute of Electrical and Electronics Engineers and published by . This book was released on 2010 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt:
