Download or read book 2016 IEEE 37th International Electronics Manufacturing Technology IEMT and 18th Electronics Materials and Packaging EMAP Conference written by IEEE Staff and published by . This book was released on 2016-09-20 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field
Download or read book 2016 IEEE 37th International Electronics Manufacturing Technology IEMT 18th Electronics Materials and Packaging EMAP Conference written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation It is a major forum, providing opportunities to network and meet leading experts, in addition to exchange of up to date knowledge in the field.
Download or read book Electronic Enclosures Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-15 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Download or read book Proceedings of Innovative Research and Industrial Dialogue 2016 written by and published by Centre for Advanced Research on Energy. This book was released on 2017-06-07 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Innovative Research and Industrial Dialogue 2016 (IRID’16) organized by Advanced Manufacturing Centre (AMC) of the Faculty of Manufacturing Engineering of UTeM which is held in Main Campus, Universiti Teknikal Malaysia Melaka on 20 December 2016. The open access e-proceeding contains a compilation of 96 selected manuscripts from this Research event.
Download or read book Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference EPTC written by EPTC and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Advanced Packaging Flip chip, multiple array leadframe package, POP, embedded passives and actives on substrates, System in Packaging, etc TSV Wafer Level Packaging Wafer level packaging (Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar technology, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Substrates Leadframes Including all that polymer and solder materials, and Substrates Interposer Leadframes PCB etc Processes and Automation Equipments new process development as well as equipment automation development Electrical M.
Download or read book The 17th International Conference on Electronic Packaging Technology written by Keyun Bi and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 International Conference on Electronics Packaging ICEP written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mems for Biomedical Applications written by Shekhar Bhansali and published by Elsevier. This book was released on 2012-07-18 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Download or read book Multiword expressions written by Manfred Sailer and published by Language Science Press. This book was released on with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multiword expressions (MWEs) are a challenge for both the natural language applications and the linguistic theory because they often defy the application of the machinery developed for free combinations where the default is that the meaning of an utterance can be predicted from its structure. There is a rich body of primarily descriptive work on MWEs for many European languages but comparative work is little. The volume brings together MWE experts to explore the benefits of a multilingual perspective on MWEs. The ten contributions in this volume look at MWEs in Bulgarian, English, French, German, Maori, Modern Greek, Romanian, Serbian, and Spanish. They discuss prominent issues in MWE research such as classification of MWEs, their formal grammatical modeling, and the description of individual MWE types from the point of view of different theoretical frameworks, such as Dependency Grammar, Generative Grammar, Head-driven Phrase Structure Grammar, Lexical Functional Grammar, Lexicon Grammar.
Download or read book Innovations in Smart Cities Applications Edition 2 written by Mohamed Ben Ahmed and published by Springer. This book was released on 2019-02-06 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights cutting-edge research presented at the third installment of the International Conference on Smart City Applications (SCA2018), held in Tétouan, Morocco on October 10–11, 2018. It presents original research results, new ideas, and practical lessons learned that touch on all aspects of smart city applications. The respective papers share new and highly original results by leading experts on IoT, Big Data, and Cloud technologies, and address a broad range of key challenges in smart cities, including Smart Education and Intelligent Learning Systems, Smart Healthcare, Smart Building and Home Automation, Smart Environment and Smart Agriculture, Smart Economy and Digital Business, and Information Technologies and Computer Science, among others. In addition, various novel proposals regarding smart cities are discussed. Gathering peer-reviewed chapters written by prominent researchers from around the globe, the book offers an invaluable instructional and research tool for courses on computer and urban sciences; students and practitioners in computer science, information science, technology studies and urban management studies will find it particularly useful. Further, the book is an excellent reference guide for professionals and researchers working in mobility, education, governance, energy, the environment and computer sciences.
Download or read book Proceedings of First International Conference on Computing Communications and Cyber Security IC4S 2019 written by Pradeep Kumar Singh and published by Springer Nature. This book was released on 2020-04-27 with total page 886 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book features selected research papers presented at the First International Conference on Computing, Communications, and Cyber-Security (IC4S 2019), organized by Northwest Group of Institutions, Punjab, India, Southern Federal University, Russia, and IAC Educational Trust, India along with KEC, Ghaziabad and ITS, College Ghaziabad as an academic partner and held on 12–13 October 2019. It includes innovative work from researchers, leading innovators and professionals in the area of communication and network technologies, advanced computing technologies, data analytics and intelligent learning, the latest electrical and electronics trends, and security and privacy issues.
Download or read book Nitride Semiconductors and Devices written by Hadis Morkoç and published by Springer Science & Business Media. This book was released on 2013-03-08 with total page 511 pages. Available in PDF, EPUB and Kindle. Book excerpt: This timely monograph addresses an important class of semiconductors and devices that constitute the underlying technology for blue lasers. It succinctly treats structural, electrical and optical properties of nitrides and the substrates on which they are deposited, band structures of nitrides, optical processes, deposition and fabrication technologies, light-emitting diodes, and lasers. It also includes many tables and figures detailing the properties and performance of nitride semiconductors and devices.
Download or read book Legal Knowledge and Information Systems written by A. Wyner and published by IOS Press. This book was released on 2017-12-20 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: Like every other walk of modern life, the law has embraced digital technology, and is increasingly reliant on information systems for its efficient functioning. This book presents papers from the 30th International Conference on Legal Knowledge and Information Systems (JURIX 2017), held in Luxembourg City, Luxembourg, in December 2017. In the three decades since they began, the JURIX conferences have been held under the auspices of the Dutch Foundation for Legal Knowledge Based Systems, and have become a fully European conference series which addresses familiar topics and extends known techniques, as well as exploring newer topics such as question answering and the use of data mining and machine learning. Of the 42 submissions received for this edition, 12 have been selected for publication as full papers and 13 as short papers, with an acceptance rate of around 59%. The papers address a wide range of topics in artificial intelligence and law, such as argumentation, norms, evidence, belief revision, citations, case-based reasoning and ontologies. Diverse techniques such as information retrieval and extraction, machine learning, semantic web, and network analysis were applied, among others, and textual sources include legal cases, bar examinations, and legislative/regulatory documents. The book will be of interest to all those working in the legal system who wish to keep abreast of the latest developments in information systems.
Download or read book Fluorinated Materials for Energy Conversion written by Tsuyoshi Nakajima and published by Elsevier. This book was released on 2005-05-20 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fluorinated Materials for Energy Conversion offers advanced information on the application of fluorine chemistry to energy conversion materials for lithium batteries, fuel cells, solar cells and so on. Fluorine compounds and fluorination techniques have recently gained important roles in improving the electrochemical characteristics of such energy production devices. The book therefore focuses on new batteries with high performance, the improvements of cell performance and the improvement of electrode and cell characteristics. The authors present new information on the effect of fluorine and how to make use of fluorination techniques and fluorine compounds. With emphasis on recent developments, this book is suitable for students, researchers and engineers working in chemistry, materials science and electrical engineering. Contains practical information, supported by examples Provides an update on recent developments in the field Written by specialists working in fluorine chemistry, electrochemistry, polymer and solid state chemistry
Download or read book Proceedings of Second International Conference on Computing Communications and Cyber Security written by Pradeep Kumar Singh and published by Springer Nature. This book was released on 2021-05-24 with total page 1027 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book features selected research papers presented at the Second International Conference on Computing, Communications, and Cyber-Security (IC4S 2020), organized in Krishna Engineering College (KEC), Ghaziabad, India, along with Academic Associates; Southern Federal University, Russia; IAC Educational, India; and ITS Mohan Nagar, Ghaziabad, India during 3–4 October 2020. It includes innovative work from researchers, leading innovators, and professionals in the area of communication and network technologies, advanced computing technologies, data analytics and intelligent learning, the latest electrical and electronics trends, and security and privacy issues.
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
