Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 17th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2016 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal and Electro thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Download or read book 2017 18th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2017-04-03 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems
Download or read book 2015 16th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2015 written by and published by . This book was released on 2015 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Simulation and Modeling Methodologies Technologies and Applications written by Mohammad S. Obaidat and published by Springer Nature. This book was released on 2020-07-31 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: The present book includes a set of selected best extended papers from the 9th International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH 2019), that was held in Prague, Czech Republic, from 29 to 31 July 2019. The conference brought together researchers, engineers and practitioners interested in methodologies and applications of modeling and simulation. New and innovative solutions are reported in this book. A selection was made after the conference, based also on the conference chairs assessment, reviewers’ assessment, quality of presentation, and audience interest, so that this book includes the extended and revised versions of the very best papers of the conference. New and innovative solutions are reported in this book.
Download or read book 2017 18th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Development of CMOS MEMS NEMS Devices written by Jaume Verd and published by MDPI. This book was released on 2019-06-25 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]
Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2013 14th International Conference on written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2020 21st International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE written by IEEE Staff and published by . This book was released on 2020-07-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: electronic components, materials, packaging, integration, microfluidics, mems, sensors, microelectronics, nanoelectronics
Download or read book 2015 16th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2015 written by and published by . This book was released on 2015 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation, EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems
Download or read book MEMS Sensors and Resonators written by Frederic Nabki and published by MDPI. This book was released on 2020-05-27 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) have had a profound impact on a wide range of applications. The degree of miniaturization made possible by MEMS technology has significantly improved the functionalities of many systems, and the performance of MEMS has steadily improved as its uses augment. Notably, MEMS sensors have been prevalent in motion sensing applications for decades, and the sensing mechanisms leveraged by MEMS have been continuously extended to applications spanning the detection of gases, magnetic fields, electromagnetic radiation, and more. In parallel, MEMS resonators have become an emerging field of MEMS and affected subfields such as electronic timing and filtering, and energy harvesting. They have, in addition, enabled a wide range of resonant sensors. For many years now, MEMS have been the basis of various industrial successes, often building on novel academic research. Accordingly, this Special Issue explores many research innovations in MEMS sensors and resonators, from biomedical applications to energy harvesting, gas sensing, resonant sensing, and timing.
Download or read book Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2015 16th International Conference on written by and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2014 15th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 written by and published by . This book was released on 2014 with total page 720 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Download or read book MEMS Accelerometers written by Mahmoud Rasras and published by MDPI. This book was released on 2019-05-27 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Download or read book Nanoelectronic Coupled Problems Solutions written by E. Jan W. ter Maten and published by Springer Nature. This book was released on 2019-11-06 with total page 587 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designs in nanoelectronics often lead to challenging simulation problems and include strong feedback couplings. Industry demands provisions for variability in order to guarantee quality and yield. It also requires the incorporation of higher abstraction levels to allow for system simulation in order to shorten the design cycles, while at the same time preserving accuracy. The methods developed here promote a methodology for circuit-and-system-level modelling and simulation based on best practice rules, which are used to deal with coupled electromagnetic field-circuit-heat problems, as well as coupled electro-thermal-stress problems that emerge in nanoelectronic designs. This book covers: (1) advanced monolithic/multirate/co-simulation techniques, which are combined with envelope/wavelet approaches to create efficient and robust simulation techniques for strongly coupled systems that exploit the different dynamics of sub-systems within multiphysics problems, and which allow designers to predict reliability and ageing; (2) new generalized techniques in Uncertainty Quantification (UQ) for coupled problems to include a variability capability such that robust design and optimization, worst case analysis, and yield estimation with tiny failure probabilities are possible (including large deviations like 6-sigma); (3) enhanced sparse, parametric Model Order Reduction techniques with a posteriori error estimation for coupled problems and for UQ to reduce the complexity of the sub-systems while ensuring that the operational and coupling parameters can still be varied and that the reduced models offer higher abstraction levels that can be efficiently simulated. All the new algorithms produced were implemented, transferred and tested by the EDA vendor MAGWEL. Validation was conducted on industrial designs provided by end-users from the semiconductor industry, who shared their feedback, contributed to the measurements, and supplied both material data and process data. In closing, a thorough comparison to measurements on real devices was made in order to demonstrate the algorithms’ industrial applicability.
