Download or read book Flexible Electronic Packaging and Encapsulation Technology written by Hong Meng and published by John Wiley & Sons. This book was released on 2024-03-25 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

Download or read book The Proceedings of 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment IDCOMPU2023 written by Xuzhu Dong and published by Springer Nature. This book was released on 2024-03-28 with total page 731 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes original, peer-reviewed research papers from the 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023), held in Wuhan, China. The topics covered include but are not limited to: insulation, discharge computations, electric power equipment, and electrical materials. The papers share the latest findings in the field of insulation and discharge computations of electric power equipment, making the book a valuable asset for researchers, engineers, university students, etc.

Download or read book 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging SIITME written by IEEE Staff and published by . This book was released on 2014-10-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The Primary objective of the Conference is to provide an international forum for dissemination of information and scientific results relating to education, research and development activities It is a tradition for all participants of the seminar to present paper(s) which are published in the proceedings SIITME is a premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide field of electronics and microelectronics technology and packaging Based on a unique combination of oral and poster presentations as well as individual meetings, researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during three conference days

Download or read book Advanced Computing and Intelligent Engineering written by Bibudhendu Pati and published by Springer Nature. This book was released on 2020-03-03 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers high-quality research papers presented at the 3rd International Conference on Advanced Computing and Intelligent Engineering (ICACIE 2018). It includes sections describing technical advances and the latest research in the fields of computing and intelligent engineering. Intended for graduate students and researchers working in the disciplines of computer science and engineering, the proceedings will also appeal to researchers in the field of electronics, as they cover hardware technologies and future communication technologies.

Download or read book Advances in Microelectronics Reviews Vol 1 written by Sergey Yurish and published by Lulu.com. This book was released on 2017-12-24 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.

Download or read book Reflow Soldering written by Balázs Illés and published by Elsevier. This book was released on 2020-07-02 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles - Analyses and compares the different reflow ovens - Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality - Introduces Vapor Phase Soldering (VPS) technology

Download or read book Advanced Driver Assistance Systems and Autonomous Vehicles written by Yan Li and published by Springer Nature. This book was released on 2022-10-28 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology

Download or read book Nanopackaging written by James E. Morris and published by Springer. This book was released on 2018-09-22 with total page 1007 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Download or read book Electronic Systems and Intelligent Computing written by Pradeep Kumar Mallick and published by Springer Nature. This book was released on 2020-09-22 with total page 1126 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents selected, high-quality research papers from the International Conference on Electronic Systems and Intelligent Computing (ESIC 2020), held at NIT Yupia, Arunachal Pradesh, India, on 2 – 4 March 2020. Discussing the latest challenges and solutions in the field of smart computing, cyber-physical systems and intelligent technologies, it includes papers based on original theoretical, practical and experimental simulations, developments, applications, measurements, and testing. The applications and solutions featured provide valuable reference material for future product development.

Download or read book Nanofluids and Mass Transfer written by Mohammad Reza Rahimpour and published by Elsevier. This book was released on 2021-09-04 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the recent decades, efficiency enhancement of refineries and chemical plants has been become a focus of research and development groups. Use of nanofluids in absorption, regeneration, liquid-liquid extraction and membrane processes can lead to mass transfer and heat transfer enhancement in processes which results in an increased efficiency in all these processes. Nanofluids and Mass Transfer introduces the role of nanofluids in improving mass transfer phenomena and expressing their characteristics and properties. The book also covers the theory and modelling procedures in details and finally illustrates various applications of Nanofluids in mass transfer enhancement in various processes such as absorption, regeneration, liquid-liquid extraction and membrane processes and how can nanofluids increase mass transfer in processes. - Introduces specifications of nanofluids and mechanisms of mass transfer enhancement by nanofluids in various mass transfer processes - Discusses mass transfer enhancement in various mass transfer processes such as: absorption, regeneration, liquid-liquid extraction and membrane processes - Offers modelling mass transfer and flow in nanofluids - Challenges industrialization and scale up of nanofluids

Download or read book Business Modeling and Software Design written by Boris Shishkov and published by Springer. This book was released on 2018-06-29 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 8th International Symposium on Business Modeling and Software Design, BMSD 2018, held in Vienna, Austria, in July 2018. The 14 full papers and 21 short papers selected for inclusion in this book deal with a large number of research topics: (i) Some topics concern Business Processes (BP), such as BP modeling / notations / visualizations, BP management, BP variability, BP contracting, BP interoperability, BP modeling within augmented reality, inter-enterprise collaborations, and so on; (ii) Other topics concern Software Design, such as software ecosystems, specification of context-aware software systems, service-oriented solutions and micro-service architectures, product variability, software development monitoring, and so on; (iii) Still other topics are crosscutting with regard to business modeling and software design, such as data analytics as well as information security and privacy; (iv) Other topics concern hot technology / innovation areas, such as blockchain technology and internet-of-things. Underlying with regard to all those topics is the BMSD’18 theme: Enterprise Engineering and Software Engineering - Processes and Systems for the Future.

Download or read book Online Engineering Internet of Things written by Michael E. Auer and published by Springer. This book was released on 2017-09-14 with total page 1066 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses online engineering and virtual instrumentation, typical working areas for today’s engineers and inseparably connected with areas such as Internet of Things, cyber-physical systems, collaborative networks and grids, cyber cloud technologies, and service architectures, to name just a few. It presents the outcomes of the 14th International Conference on Remote Engineering and Virtual Instrumentation (REV2017), held at Columbia University in New York from 15 to 17 March 2017. The conference addressed fundamentals, applications and experiences in the field of online engineering and virtual instrumentation in the light of growing interest in and need for teleworking, remote services and collaborative working environments as a result of the globalization of education. The book also discusses guidelines for education in university-level courses for these topics.

Download or read book Recent Progress in Lead Free Solder Technology written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2022-03-01 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Download or read book 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging SIITME 2014 written by and published by . This book was released on 2014 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Innovative Security Solutions for Information Technology and Communications written by Ion Bica and published by Springer. This book was released on 2016-10-04 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the thoroughly refereed post-conference proceedings of the 9th International Conference on Security for Information Technology and Communications, SECITC 2016, held in Bucharest, Romania, in June 2016. The 16 revised full papers were carefully reviewed and selected from 35 submissions. In addition with 4 invited talks the papers cover topics such as Cryptographic Algorithms and Protocols, and Security Technologies for ITC.

Download or read book Mobile Computing and Sustainable Informatics written by Subarna Shakya and published by Springer Nature. This book was released on 2021-07-22 with total page 875 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers selected high-quality research papers presented at International Conference on Mobile Computing and Sustainable Informatics (ICMCSI 2021) organized by Pulchowk Campus, Institute of Engineering, Tribhuvan University, Nepal, during 29–30 January 2021. The book discusses recent developments in mobile communication technologies ranging from mobile edge computing devices, to personalized, embedded and sustainable applications. The book covers vital topics like mobile networks, computing models, algorithms, sustainable models and advanced informatics that supports the symbiosis of mobile computing and sustainable informatics.

Download or read book Proceedings of the 9th Mathematics Science and Computer Science Education International Seminar MSCEIS 2023 written by Fitri Khoerunnisa and published by Springer Nature. This book was released on 2024 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: