Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by Institute of Electrical and Electronics Engineers (New York, NY) and published by . This book was released on 2013-10-27 with total page 269 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Bio Inspired Technology written by Ruby Srivastava and published by BoD – Books on Demand. This book was released on 2019-09-18 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomimetic devices are designed and produced by materials, structures, and systems that are modelled on biological entities and processes. These devices are used to synthesize novel materials and their functions at the multiscale level for various applications. Molecular computing biological devices play a key role in the logical processing of the cellular machinery of all living organisms. This book includes information on both biomedical and technological applications of bioactive devices for hard tissue regeneration; design of chip-based disease diagnostic platforms; neuromorphic computing biomaterials that transfer techniques of neuroscience to a silicon chip; various top-down and bottom-up designs; and electrical characterization and transport mechanisms of DNA as nanowires.

Download or read book Computer Engineering and Technology written by Weixia Xu and published by Springer. This book was released on 2016-01-13 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 19th CCF Conference on Computer Engineering and Technology, NCCET 2015, held in Hefei, China, in October 2015. The 18 papers presented were carefully reviewed and selected from 158 submissions. They are organized in topical sections on processor architecture; application specific processors; computer application and software optimization; technology on the horizon.

Download or read book Scientific Computing in Electrical Engineering written by Andreas Bartel and published by Springer. This book was released on 2016-05-09 with total page 251 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of selected papers presented at the 10th International Conference on Scientific Computing in Electrical Engineering (SCEE), held in Wuppertal, Germany in 2014. The book is divided into five parts, reflecting the main directions of SCEE 2014: 1. Device Modeling, Electric Circuits and Simulation, 2. Computational Electromagnetics, 3. Coupled Problems, 4. Model Order Reduction, and 5. Uncertainty Quantification. Each part starts with a general introduction followed by the actual papers. The aim of the SCEE 2014 conference was to bring together scientists from academia and industry, mathematicians, electrical engineers, computer scientists, and physicists, with the goal of fostering intensive discussions on industrially relevant mathematical problems, with an emphasis on the modeling and numerical simulation of electronic circuits and devices, electromagnetic fields, and coupled problems. The methodological focus was on model order reduction and uncertainty quantification. this book="" will="" appeal="" to="" mathematicians="" and="" electrical="" engineers.="" it="" offers="" a="" valuable="" starting="" point="" for="" developers="" of="" algorithms="" programs="" who="" want="" learn="" about="" recent="" advances="" in="" other="" fields="" as="" well="" open="" problems="" coming="" from="" industry.="" moreover,="" be="" use="" representatives="" industry="" with="" an="" interest="" new="" program="" tools="" mathematical="" methods.

Download or read book Compact Size Wireless Power Transfer Using Defected Ground Structures written by Sherif Hekal and published by Springer. This book was released on 2019-05-29 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses the design challenges in near-field wireless power transfer (WPT) systems, such as high efficiency, compact size, and long transmission range. It presents new low-profile designs for the TX/RX structures using different shapes of defected ground structures (DGS) like (H, semi-H, and spiral-strips DGS). Most near-field WPT systems depend on magnetic resonant coupling (MRC) using 3-D wire loops or helical antennas, which are often bulky. This, in turn, poses technical difficulties in their application in small electronic devices and biomedical implants. To obtain compact structures, printed spiral coils (PSCs) have recently emerged as a candidate for low-profile WPT systems. However, most of the MRC WPT systems that use PSCs have limitations in the maximum achievable efficiency due to the feeding method. Inductive feeding constrains the geometric dimensions of the main transmitting (TX)/receiving (RX) resonators, which do not achieve the maximum achievable unloaded quality factor. This book will be of interest to researchers and professionals working on WPT-related problems.

Download or read book Machine Learning for Model Order Reduction written by Khaled Salah Mohamed and published by Springer. This book was released on 2018-03-02 with total page 99 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Book discusses machine learning for model order reduction, which can be used in modern VLSI design to predict the behavior of an electronic circuit, via mathematical models that predict behavior. The author describes techniques to reduce significantly the time required for simulations involving large-scale ordinary differential equations, which sometimes take several days or even weeks. This method is called model order reduction (MOR), which reduces the complexity of the original large system and generates a reduced-order model (ROM) to represent the original one. Readers will gain in-depth knowledge of machine learning and model order reduction concepts, the tradeoffs involved with using various algorithms, and how to apply the techniques presented to circuit simulations and numerical analysis. Introduces machine learning algorithms at the architecture level and the algorithm levels of abstraction; Describes new, hybrid solutions for model order reduction; Presents machine learning algorithms in depth, but simply; Uses real, industrial applications to verify algorithms.

Download or read book Advances in Embedded and Fan Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-12 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.

Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Download or read book Mathematical Analysis and Simulation of Field Models in Accelerator Circuits written by Idoia Cortes Garcia and published by Springer Nature. This book was released on 2021-01-04 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with the analysis and development of numerical methods for the time-domain analysis of multiphysical effects in superconducting circuits of particle accelerator magnets. An important challenge is the simulation of “quenching”, i.e. the transition of a material from the superconducting to the normally electrically conductive state. The book analyses complex mathematical structures and presents models to simulate such quenching events in the context of generalized circuit elements. Furthermore, it proposes efficient parallelized algorithms with guaranteed convergence properties for the simulation of multiphysical problems. Spanning from theoretical concepts to applied research, and featuring rigorous mathematical presentations on one side, as well as simplified explanations of many complex issues, on the other side, this book provides graduate students and researchers with a comprehensive introduction on the state of the art and a source of inspiration for future research. Moreover, the proposed concepts and methods can be extended to the simulation of multiphysical phenomena in different application contexts.

Download or read book Electromagnetics and Antenna Technology written by Alan J. Fenn and published by Artech House. This book was released on 2017-12-31 with total page 481 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by a leading expert in the field, this practical new resource presents the fundamentals of electromagnetics and antenna technology. This book covers the design, electromagnetic simulation, fabrication, and measurements for various types of antennas, including impedance matching techniques and beamforming for ultrawideband dipoles, monopoles, loops, vector sensors for direction finding, HF curtain arrays, 3D printed nonplanar patch antenna arrays, waveguides for portable radar, reflector antennas, and other antennas. It explores the essentials of phased array antennas and includes detailed derivations of important field equations, and a detailed formulation of the method of moments. This resource exhibits essential derivations of equations, providing readers with a strong foundation of the underpinnings of electromagnetics and antennas. It includes a complete chapter on the details of antenna and electromagnetic test and measurement. This book explores details on 3D printed non-planar circular patch array antenna technology and the design and analysis of a planar array-fed axisymmetric gregorian reflector. The lumped-element impedance matched antennas are examined and include a look at an analytic impedance matching solution with a parallel LC network. This book provides key insight into many aspects of antenna technology that have broad applications in radar and communications.

Download or read book Machine Learning Applications in Electronic Design Automation written by Haoxing Ren and published by Springer Nature. This book was released on 2023-01-01 with total page 585 pages. Available in PDF, EPUB and Kindle. Book excerpt: ​This book serves as a single-source reference to key machine learning (ML) applications and methods in digital and analog design and verification. Experts from academia and industry cover a wide range of the latest research on ML applications in electronic design automation (EDA), including analysis and optimization of digital design, analysis and optimization of analog design, as well as functional verification, FPGA and system level designs, design for manufacturing (DFM), and design space exploration. The authors also cover key ML methods such as classical ML, deep learning models such as convolutional neural networks (CNNs), graph neural networks (GNNs), generative adversarial networks (GANs) and optimization methods such as reinforcement learning (RL) and Bayesian optimization (BO). All of these topics are valuable to chip designers and EDA developers and researchers working in digital and analog designs and verification.

Download or read book Scanning Technologies for Autonomous Systems written by Julio C. Rodríguez-Quiñonez and published by Springer Nature. This book was released on with total page 455 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Wired Wireless Internet Communications written by Yevgeni Koucheryavy and published by Springer. This book was released on 2017-06-15 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the proceedings of the 15th IFIP International Conference on Wired/Wireless Internet Communications, WWIC 2017, held in St. Petersburg, Russia, in June 2017. The 27 papers presented in this volume were carefully reviewed and selected from 76 submissions. They were organized in topical sections named: network analysis and dimensioning; 5G communications; network design and planning; network protocols; information technology; and circuit design.

Download or read book Machine Learning Paradigms written by George A. Tsihrintzis and published by Springer. This book was released on 2019-07-06 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the inaugural volume in the new Springer series on Learning and Analytics in Intelligent Systems. The series aims at providing, in hard-copy and soft-copy form, books on all aspects of learning, analytics, advanced intelligent systems and related technologies. These disciplines are strongly related and mutually complementary; accordingly, the new series encourages an integrated approach to themes and topics in these disciplines, which will result in significant cross-fertilization, research advances and new knowledge creation. To maximize the dissemination of research findings, the series will publish edited books, monographs, handbooks, textbooks and conference proceedings. This book is intended for professors, researchers, scientists, engineers and students. An extensive list of references at the end of each chapter allows readers to probe further into those application areas that interest them most.

Download or read book Handbook of 3D Integration Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Download or read book Approximation Theory and Analytic Inequalities written by Themistocles M. Rassias and published by Springer Nature. This book was released on 2021-07-21 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed volume focuses on various important areas of mathematics in which approximation methods play an essential role. It features cutting-edge research on a wide spectrum of analytic inequalities with emphasis on differential and integral inequalities in the spirit of functional analysis, operator theory, nonlinear analysis, variational calculus, featuring a plethora of applications, making this work a valuable resource. The reader will be exposed to convexity theory, polynomial inequalities, extremal problems, prediction theory, fixed point theory for operators, PDEs, fractional integral inequalities, multidimensional numerical integration, Gauss–Jacobi and Hermite–Hadamard type inequalities, Hilbert-type inequalities, and Ulam’s stability of functional equations. Contributions have been written by eminent researchers, providing up-to-date information and several results which may be useful to a wide readership including graduate students and researchers working in mathematics, physics, economics, operational research, and their interconnections.