Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2020-10-05 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society and IEEE Microwave Theory and Techniques Society
Download or read book IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems 2014 written by and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2016-10-23 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm wave applications
Download or read book 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2017-10-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: PEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs
Download or read book 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2018-10-14 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnections and packaging structures of electronic systems covering all the application families and frequency ranges namely, digital, RF, microwave, and mm wave applications
Download or read book Leonove written by and published by . This book was released on 1979 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2014 written by and published by . This book was released on 2014 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Bio Inspired Technology written by Ruby Srivastava and published by BoD – Books on Demand. This book was released on 2019-09-18 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomimetic devices are designed and produced by materials, structures, and systems that are modelled on biological entities and processes. These devices are used to synthesize novel materials and their functions at the multiscale level for various applications. Molecular computing biological devices play a key role in the logical processing of the cellular machinery of all living organisms. This book includes information on both biomedical and technological applications of bioactive devices for hard tissue regeneration; design of chip-based disease diagnostic platforms; neuromorphic computing biomaterials that transfer techniques of neuroscience to a silicon chip; various top-down and bottom-up designs; and electrical characterization and transport mechanisms of DNA as nanowires.
Download or read book EPEPS 2010 written by and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2019-10-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society
Download or read book 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2014 written by and published by . This book was released on 2014 with total page 245 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Compact Size Wireless Power Transfer Using Defected Ground Structures written by Sherif Hekal and published by Springer. This book was released on 2019-05-29 with total page 91 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book addresses the design challenges in near-field wireless power transfer (WPT) systems, such as high efficiency, compact size, and long transmission range. It presents new low-profile designs for the TX/RX structures using different shapes of defected ground structures (DGS) like (H, semi-H, and spiral-strips DGS). Most near-field WPT systems depend on magnetic resonant coupling (MRC) using 3-D wire loops or helical antennas, which are often bulky. This, in turn, poses technical difficulties in their application in small electronic devices and biomedical implants. To obtain compact structures, printed spiral coils (PSCs) have recently emerged as a candidate for low-profile WPT systems. However, most of the MRC WPT systems that use PSCs have limitations in the maximum achievable efficiency due to the feeding method. Inductive feeding constrains the geometric dimensions of the main transmitting (TX)/receiving (RX) resonators, which do not achieve the maximum achievable unloaded quality factor. This book will be of interest to researchers and professionals working on WPT-related problems.
Download or read book 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems written by Components, Packaging, and Manufacturing Technology Society and published by . This book was released on 2011 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems EPEPS written by IEEE Staff and published by . This book was released on 2022-10-09 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: A forum for the latest advances in the electrical design, analysis, modeling, and characterization of interconnects and packaging structures of electronic systems covering all pertinent applications and wide range of frequency including digital, RF, microwave, mm wave and optical applications
Download or read book 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems EPEPS 2012 written by and published by . This book was released on 2012 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt:
