Download or read book 2008 IEEE International Integrated Reliability Workshop Final Report written by and published by IEEE. This book was released on 2008 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book 1999 IEEE International Integrated Reliability Workshop Final Report written by International Integrated Reliability Workshop and published by . This book was released on 1999 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Special Issue on the 2005 International Integrated Reliability Workshop written by International Integrated Reliability Workshop. 2005, South Lake Tahoe, Calif.. and published by . This book was released on 2006 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
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