Download or read book IEMT IMC Symposium written by and published by . This book was released on 1997 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 2002 with total page 992 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Download or read book Proceedings written by and published by . This book was released on 1998 with total page 1072 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1999 with total page 844 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Download or read book Proceedings of the 1997 1st Electronic Packaging Technology Conference written by Andrew A. O. Tay and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Printed Electronics written by Zheng Cui and published by John Wiley & Sons. This book was released on 2016-04-13 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading

Download or read book New Serial Titles written by and published by . This book was released on 1997 with total page 1336 pages. Available in PDF, EPUB and Kindle. Book excerpt: A union list of serials commencing publication after Dec. 31, 1949.

Download or read book 2000 International Conference on High Density Interconnect and Systems Packaging written by International Conference on High Density Interconnect and Systems Packaging and published by . This book was released on 2000 with total page 644 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book High Performance Backbone Network Technology written by Naoaki Yamanaka and published by CRC Press. This book was released on 2020-04-01 with total page 1067 pages. Available in PDF, EPUB and Kindle. Book excerpt: Compiling the most influential papers from the IEICE Transactions in Communications, High-Performance Backbone Network Technology examines critical breakthroughs in the design and provision of effective public service networks in areas including traffic control, telephone service, real-time video transfer, voice and image transmission for a content delivery network (CDN), and Internet access. The contributors explore system structures, experimental prototypes, and field trials that herald the development of new IP networks that offer quality-of-service (QoS), as well as enhanced security, reliability, and function. Offers many hints and guidelines for future research in IP and photonic backbone network technologies

Download or read book International Symposium on Electronic Materials and Packaging written by and published by . This book was released on 2000 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: flip chip running; solder join reliability; emerging technologies; solder materials; delimitation; polymers for packaging; design and process; modelling and testing; material characterization; and package reliability.

Download or read book Magnetic Materials Processes and Devices VI written by and published by The Electrochemical Society. This book was released on 2001 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2000 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings 1999 International Symposium on Microelectronics written by and published by . This book was released on 1999 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text comprises the proceedings of the 1999 International Symposium on Microelectronics.

Download or read book Processing Materials of 3D Interconnects Damascene and Electronics Packaging 6 written by K. Kondo and published by The Electrochemical Society. This book was released on 2015-04-30 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Optical Electronics written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2012-06-06 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book proposes and reviews comprehensive strategies based on optical electronics for constructing optoelectronic systems with minimized optics excess. It describes the core technologies such as self-organized optical waveguides based on self-organized lightwave network (SOLNET), three-dimensional optical circuits, material-saving heterogeneous